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Engineering Materials

Subject : engineering
Instructions:
  • Answer 50 questions in 15 minutes.
  • If you are not ready to take this test, you can study here.
  • Match each statement with the correct term.
  • Don't refresh. All questions and answers are randomly picked and ordered every time you load a test.

This is a study tool. The 3 wrong answers for each question are randomly chosen from answers to other questions. So, you might find at times the answers obvious, but you will see it re-enforces your understanding as you take the test each time.
1. 1. Yield = ratio of functional chips to total # of chips - Most yield loss during wafer processing - b/c of complex 2. Reliability - No device has infinite lifetime. Statistical methods to predict expected lifetime - Failure mechanisms: Diffusion reg






2. Small Coercivities - Used for electric motors - Example: commercial iron 99.95 Fe






3. Specific heat = energy input/(mass*temperature change)






4. The ability of a material to be rapidly cooled and not fracture






5. There is always some statistical distribution of flaws or defects.






6. High toughness; material resists crack propagation.






7. Cp: Heat capacity at constant pressure Cv: Heat capacity at constant volume.






8. With Increasing temperature - the saturation magnetization diminishes gradually and then abruptly drops to zero at Curie Temperature - Tc.






9. Resistance to plastic deformation of cracking in compression - and better wear properties.






10. The magnetic hysteresis phenomenon: Stage 1: Initial (unmagnetized state) Stage 2: Apply H - align domains Stage 3: Remove H - alignment remains => Permanent magnet Stage 4: Coercivity - Hc negative H needed to demagnitize Stage 5: Apply -H - align d






11. Second phase particles with n > glass.






12. Transmitted light distorts electron clouds - The velocity of light in a material is lower than in a vacuum - Adding large ions to glass decreases the speed of light in the glass - Light can be "bent" (or refracted) as it passes through a transparent






13. To build a device - various thin metal or insulating films are grown on top of each other - Evaporation - MBE - Sputtering - CVD (ALD)






14. Occurs at a single pore or other solid by refraction n = 1 for pore (air) n > 1 for the solid - n ~ 1.5 for glass - Scattering effect is maximized by pore/particle size within 400-700 nm range - Reason for Opacity in ceramics - glasses and polymers.






15. Degree of opacity depends on size and number of particles - Opacity of metals is the result of conduction electrons absorbing photons in the visible range.






16. The ability of a material to absorb heat - Quantitatively: The energy required to produce a unit rise in temperature for one mole of a material.






17. Becomes harder (more strain) to stretch (elongate)






18. Growth of an oxide layer by the reaction of oxygen with the substrate - Provides dopant masking and device isolation - IC technology uses 1. Thermal grown oxidation (dry) 2. Wet Oxidation 3. Selective Oxidation






19. Process by which geometric patterns are transferred from a mask (reticle) to a surface of a chip to form the device.






20. Occur when lots of dislocations move.






21. 1. Impose a compressive surface stress (to suppress surface cracks from growing) - Method 1: shot peening - Method 2: carburizing 2.Remove stress concentrators.






22. 1. Insulators: Higher energy states NOT ACCESSIBLE due to gap 2. Semiconductors: Higher energy states separated by a smaller gap.






23. Is reflected - absorbed - scattered - and/or transmitted: Io=It+Ia+Ir+Is






24. Metals are good conductors since their _______is only partially filled.






25. These materials are relatively unaffected by magnetic fields.






26. Without passing a current a continually varying magnetic field will cause a current to flow






27. Undergo little or no plastic deformation.






28. Emitted light is in phase






29. Digitalized data in the form of electrical signals are transferred to and recorded digitally on a magnetic medium (tape or disk) - This transference is accomplished by a recording system that consists of a read/write head - "write" or record data by






30. 1. General yielding occurs if flaw size a < a(critical) 2. Catastrophic fast fracture occurs if flaw size a > a(critical)






31. heat flux = -(thermal conductivity)(temperature gradient) - Defines heat transfer by CONDUCTION

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32. The ability of a material to transport heat - Atomic Perspective: Atomic vibrations and free electrons in hotter regions transport energy to cooler regions - Metals have the largest values






33. Wet: isotropic - under cut Dry: ansiotropic - directional






34. Found in 26 metals and hundreds of alloys & compounds - Tc= critical temperature = termperature below which material is superconductive.






35. 1. Tc= critical temperature- if T>Tc not superconducting 2. Jc= critical current density - if J>Jc not superconducting 3. Hc= critical magnetic field - if H > Hc not superconducting






36. Measures Hardness - No major sample damage - Each scales runs to 130 but only useful in range 20-100 - Minor load is 10 kg - Major load: 60 kg (diamond) - 100 kg (1/16 in. ball) - 150 kg (diamond)






37. Width of smallest feature obtainable on Si surface






38. If a material has ________ - then the field generated by those moments must be added to the induced field.






39. Hardness is the resistance of a material to deformation by indentation - Useful in quality control - Hardness can provide a qualitative assessment of strength - Hardness cannot be used to quantitatively infer strength or ductility.






40. Increase temperature - increase in interatomic separation - thermal expansion






41. (sigma)=K(sigma)^n . K = strength coefficient - n = work hardening rate or strain hardening exponent. Large n value increases strength and hardness.






42. Impurities added to the semiconductor that contribute to excess electrons or holes. Doping = intentional impurities.






43. Another optical property - Depends on the wavelength of the visible spectrum.






44. Allows you to calculate what happened G=F' x cos(lambda) - F=F' x cos(phi)






45. Because of ionic & covalent-type bonding.






46. The Magnetization of the material - and is essentially the dipole moment per unit volume. It is proportional to the applied field. Xm is the magnetic susceptibility.






47. Dramatic change in impact energy is associated with a change in fracture mode from brittle to ductile.






48. (sigma)=F/Ai (rho)=(rho)'(1+(epsilon))






49. This strength parameter is similar in magnitude to a tensile strength. Fracture occurs along the outermost sample edge - which is under a tensile load.






50. 1. Hard disk drives (granular/perpendicular media) 2. Recording tape (particulate media)






Can you answer 50 questions in 15 minutes?



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