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Test your basic knowledge |
Engineering Materials
Start Test
Study First
Subject
:
engineering
Instructions:
Answer 50 questions in 15 minutes.
If you are not ready to take this test, you can
study here
.
Match each statement with the correct term.
Don't refresh. All questions and answers are randomly picked and ordered every time you load a test.
This is a study tool. The 3 wrong answers for each question are randomly chosen from answers to other questions. So, you might find at times the answers obvious, but you will see it re-enforces your understanding as you take the test each time.
1. 1. General yielding occurs if flaw size a < a(critical) 2. Catastrophic fast fracture occurs if flaw size a > a(critical)
Engineering Fracture Performance
Impact - Toughness
Thermal Expansion: Asymmetric curve
Iron-Silicon Alloy in Transformer Cores
2. High toughness; material resists crack propagation.
Fourier's Law
Film Deposition
IC Devices: P-N Rectifying Junction
High impact energy
3. 1. Metals: Thermal energy puts many electrons into a higher energy state. 2. Energy States: Nearby energy states are accessible by thermal fluctuations.
Electrical Conduction
Conduction & Electron Transport
Dependence of Heat Capacity on Temperature
Stress Intensity Factor
4. Allows you to calculate what happened G=F' x cos(lambda) - F=F' x cos(phi)
Reflectance of Non-Metals
Stress Intensity values
Engineering Fracture Performance
Force Decomposition
5. Measures impact energy 1. Strike a notched sample with an anvil 2. Measure how far the anvil travels following impact 3. Distance traveled is related to energy required to break the sample 4. Very high rate of loading. Makes materials more "brittle."
Plastic Deformation (Metals)
Charpy or Izod test
Metallization
Generation of a Magnetic Field - Within a Solid Material
6. Elastic means reversible! This is not a permanent deformation.
4 Types of Magnetism
Superconductivity
Elastic Deformation
Magnetic Storage
7. (sigma)=K(sigma)^n . K = strength coefficient - n = work hardening rate or strain hardening exponent. Large n value increases strength and hardness.
Holloman Equation
What do magnetic moments arise from?
How an LCD works
Yield and Reliability
8. heat flux = -(thermal conductivity)(temperature gradient) - Defines heat transfer by CONDUCTION
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9. The magnetic hysteresis phenomenon: Stage 1: Initial (unmagnetized state) Stage 2: Apply H - align domains Stage 3: Remove H - alignment remains => Permanent magnet Stage 4: Coercivity - Hc negative H needed to demagnitize Stage 5: Apply -H - align d
Hysteresis and Permanent Magnetization
Relative Permeability
HB (Brinell Hardness)
Iron-Silicon Alloy in Transformer Cores
10. Defines the ability of a material to resist fracture even when a flaw exists - Directly depends on size of flaw and material properties - K(ic) is a materials constant
Stress Intensity Factor
Valence band
Ductile Materials
Conduction & Electron Transport
11. Superconductors expel magnetic fields - This is why a superconductor will float above a magnet.
Two kinds of Reflection
Engineering Fracture Performance
Electromigration
Meissner Effect
12. Measures Hardness - No major sample damage - Each scales runs to 130 but only useful in range 20-100 - Minor load is 10 kg - Major load: 60 kg (diamond) - 100 kg (1/16 in. ball) - 150 kg (diamond)
Impact - Toughness
Diamagnetic Materials
Transparent
Rockwell
13. Second phase particles with n > glass.
Two ways to measure heat capacity
Paramagnetic Materials
The Transistor
Opacifiers
14. Process by which geometric patterns are transferred from a mask (reticle) to a surface of a chip to form the device.
Intergranular Fracture
True Stress
Lithography
Transgranular Fracture
15. For a metal - there is no ______ - only reflection
HB (Brinell Hardness)
Holloman Equation
Luminescence
Refraction
16. Stress concentration at a crack tips
True Stress
Not severe
Griffith Crack Model
Relative Permeability
17. This strength parameter is similar in magnitude to a tensile strength. Fracture occurs along the outermost sample edge - which is under a tensile load.
LASER
Modulus of Rupture (MOR)
Lithography
Pure Semiconductors: Conductivity vs. T
18. Emitted light is in phase
Response to a Magnetic Field
Fourier's Law
Magnetic Storage
Coherent
19. - A magnetic field is induced in the material B= Magnetic Induction (tesla) inside the material mu= permeability of a solid
Fatigue
Generation of a Magnetic Field - Within a Solid Material
Relative Permeability
Transgranular Fracture
20. These materials are relatively unaffected by magnetic fields.
Where does DBTT occur?
Metals: Resistivity vs. T - Impurities
Diamagnetic Materials
Plastic Deformation (Metals)
21. The ability of a material to be rapidly cooled and not fracture
Thermal Conductivity
Magnetic Storage Media Types
Transgranular Fracture
Thermal Shock Resistance
22. Flaws and Defects - They concentrate stress locally to levels high enough to rupture bonds.
True Stress
4 Types of Magnetism
Translucent
Why materials fail in service
23. Transmitted light distorts electron clouds - The velocity of light in a material is lower than in a vacuum - Adding large ions to glass decreases the speed of light in the glass - Light can be "bent" (or refracted) as it passes through a transparent
Metallization
Brittle Fracture
Refraction
Domains in Ferromagnetic & Ferrimagnetic Materials
24. 1. Imperfections increase resistivity - grain boundaries - dislocations - impurity atoms - vacancies 2. Resistivity - increases with temperature - wt% impurity - and %CW
Where does DBTT occur?
Thermal Stresses
Extrinsic Semiconductors
Metals: Resistivity vs. T - Impurities
25. The size of the material changes with a change in temperature - polymers have the largest values
Reflectance of Non-Metals
Coefficient of Thermal Expansion
Pure Semiconductors: Conductivity vs. T
Intergranular Fracture
26. Liquid polymer at room T - sandwiched between two sheets of glass - coated with transparent - electrically conductive film. - Character forming letters/ numbers etched on the face - Voltage applied disrupts the orientation of the rod- shaped molecule
How an LCD works
Yield and Reliability
Two kinds of Reflection
Why fracture surfaces have faceted texture
27. Different orientation of cleavage planes in grains.
Translucent
Electromigration
Thermal Expansion: Symmetric curve
Why fracture surfaces have faceted texture
28. # of thermally generated electrons = # of holes (broken bonds)
Impact energy
Stages of Failure: Ductile Fracture
Intrinsic Semiconductors
Holloman Equation
29. A three terminal device that acts like a simple "on-off" switch. (the basis of Integrated Circuits (IC) technology - used in computers - cell phones - automotive control - etc) - If voltage (potential) applied to the "gate" - current flows between th
Rockwell
Relative Permeability
How to gage the extent of plastic deformation
The Transistor
30. Degree of opacity depends on size and number of particles - Opacity of metals is the result of conduction electrons absorbing photons in the visible range.
Two kinds of Reflection
Opacity
High impact energy
True Strain
31. As the applied field (H) increases the magnetic domains change shape and size by movement of domain boundaries.
Domains in Ferromagnetic & Ferrimagnetic Materials
4 Types of Magnetism
Energy States: Insulators and Semiconductors
Where does DBTT occur?
32. Without passing a current a continually varying magnetic field will cause a current to flow
Brittle Fracture
Iron-Silicon Alloy in Transformer Cores
What do magnetic moments arise from?
Response to a Magnetic Field
33. Not ALL the light is refracted - SOME is reflected. Materials with a high index of refraction also have high reflectance - High R is bad for lens applications - since this leads to undesirable light losses or interference.
Reflectance of Non-Metals
Liquid Crystal Displays (LCD's)
Specific Heat
Why materials fail in service
34. Cracks propagate along grain boundaries.
Dependence of Heat Capacity on Temperature
How to gage the extent of plastic deformation
Intergranular Fracture
Brittle Fracture
35. To build a device - various thin metal or insulating films are grown on top of each other - Evaporation - MBE - Sputtering - CVD (ALD)
Film Deposition
Specific Heat
Shear and Tensile Stress
Soft Magnetic Materials
36. Occur due to: restrained thermal expansion/contraction -temperature gradients that lead to differential dimensional changes sigma = Thermal Stress
Thermal expansion
High impact energy
Relative Permeability
Thermal Stresses
37. 1. Fluorescent Lamp - tungstate or silicate coating on inside of tube emits white light due to UV light generated inside the tube. 2. TV screen - emits light as electron beam is scanned back and forth.
Incident Light
Brittle Ceramics
Oxidation
Luminescence examples
38. Sigma=ln(li/lo)
Relative Permeability
Insulators
Transparent
True Strain
39. Growing interconnections to connect devices -Low electrical resistance - good adhesion to dielectric insulators.
Two kinds of Reflection
Reflection of Light for Metals
Metallization
Hardness
40. Diffuse image
Internal magnetic moments
Pure Semiconductors: Conductivity vs. T
Translucent
Intrinsic Semiconductors
41. Is reflected - absorbed - scattered - and/or transmitted: Io=It+Ia+Ir+Is
Incident Light
Luminescence
Heat Capacity from an Atomic Prospective
Pure Semiconductors: Conductivity vs. T
42. Digitalized data in the form of electrical signals are transferred to and recorded digitally on a magnetic medium (tape or disk) - This transference is accomplished by a recording system that consists of a read/write head - "write" or record data by
Magnetic Storage
Pure Semiconductors: Conductivity vs. T
Bending tests
Holloman Equation
43. The Magnetization of the material - and is essentially the dipole moment per unit volume. It is proportional to the applied field. Xm is the magnetic susceptibility.
Transgranular Fracture
Insulators
Coherent
M is known as what?
44. Small Coercivities - Used for electric motors - Example: commercial iron 99.95 Fe
Soft Magnetic Materials
Extrinsic Semiconductors
Etching
Griffith Crack Model
45. Growth of an oxide layer by the reaction of oxygen with the substrate - Provides dopant masking and device isolation - IC technology uses 1. Thermal grown oxidation (dry) 2. Wet Oxidation 3. Selective Oxidation
Oxidation
Electromigration
Insulators
Incident Light
46. The ability of a material to transport heat - Atomic Perspective: Atomic vibrations and free electrons in hotter regions transport energy to cooler regions - Metals have the largest values
Why fracture surfaces have faceted texture
Thermal Conductivity
Intrinsic Semiconductors
Griffith Crack Model
47. With Increasing temperature - the saturation magnetization diminishes gradually and then abruptly drops to zero at Curie Temperature - Tc.
Meissner Effect
Dependence of Heat Capacity on Temperature
Pure Semiconductors: Conductivity vs. T
Influence of Temperature on Magnetic Behavior
48. Undergo extensive plastic deformation prior to failure.
Ductile Materials
Hardness
True Stress
Domains in Ferromagnetic & Ferrimagnetic Materials
49. Cp: Heat capacity at constant pressure Cv: Heat capacity at constant volume.
Two ways to measure heat capacity
Superconductivity
Critical Properties of Superconductive Materials
Brittle Fracture
50. Is analogous to toughness.
Magnetic Storage
Work Hardening
How an LCD works
Impact energy