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Engineering Materials

Subject : engineering
Instructions:
  • Answer 50 questions in 15 minutes.
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  • Match each statement with the correct term.
  • Don't refresh. All questions and answers are randomly picked and ordered every time you load a test.

This is a study tool. The 3 wrong answers for each question are randomly chosen from answers to other questions. So, you might find at times the answers obvious, but you will see it re-enforces your understanding as you take the test each time.
1. Process by which metal atoms diffuse because of a potential.






2. Dimples on fracture surface correspond to microcavities that initiate crack formation.






3. 1. Electron motions 2. The spins on electrons - Net atomic magnetic moment: sum of moments from all electrons.






4. (sigma)=K(sigma)^n . K = strength coefficient - n = work hardening rate or strain hardening exponent. Large n value increases strength and hardness.






5. (sigma)=F/Ai (rho)=(rho)'(1+(epsilon))






6. Growth of an oxide layer by the reaction of oxygen with the substrate - Provides dopant masking and device isolation - IC technology uses 1. Thermal grown oxidation (dry) 2. Wet Oxidation 3. Selective Oxidation






7. Becomes harder (more strain) to stretch (elongate)






8. 1. Fluorescent Lamp - tungstate or silicate coating on inside of tube emits white light due to UV light generated inside the tube. 2. TV screen - emits light as electron beam is scanned back and forth.






9. These are liquid crystal polymers- not your normal "crystal" -Rigid - rod shaped molecules are aligned even in liquid form.

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10. Sigma=ln(li/lo)






11. They are used to assess properties of ceramics & glasses.






12. There is always some statistical distribution of flaws or defects.






13. Flaws and Defects - They concentrate stress locally to levels high enough to rupture bonds.






14. Without passing a current a continually varying magnetic field will cause a current to flow






15. Resistance to plastic deformation of cracking in compression - and better wear properties.






16. 1. Necking 2. Cavity formation 3. Cavity coalescence to form cracks 4. Crack propagation (growth) 5. Fracture






17. 1. Metals: Thermal energy puts many electrons into a higher energy state. 2. Energy States: Nearby energy states are accessible by thermal fluctuations.






18. Another optical property - Depends on the wavelength of the visible spectrum.






19. Is reflected - absorbed - scattered - and/or transmitted: Io=It+Ia+Ir+Is






20. 1. Tensile (opening) 2. Sliding 3. Tearing






21. Transmitted light distorts electron clouds - The velocity of light in a material is lower than in a vacuum - Adding large ions to glass decreases the speed of light in the glass - Light can be "bent" (or refracted) as it passes through a transparent






22. Liquid polymer at room T - sandwiched between two sheets of glass - coated with transparent - electrically conductive film. - Character forming letters/ numbers etched on the face - Voltage applied disrupts the orientation of the rod- shaped molecule






23. Degree of opacity depends on size and number of particles - Opacity of metals is the result of conduction electrons absorbing photons in the visible range.






24. Typical loading conditions are _____ enough to break all inter-atomic bonds






25. This strength parameter is similar in magnitude to a tensile strength. Fracture occurs along the outermost sample edge - which is under a tensile load.






26. Reflectiviy is between 0.90 and 0.95 - Metal surfaces appear shiny - Most of absorbed light is reflected at the same wavelength (NO REFRACTION) - Small fraction of light may be absorbed - Color of reflected light depends on wavelength distribution of






27. 1. Tc= critical temperature- if T>Tc not superconducting 2. Jc= critical current density - if J>Jc not superconducting 3. Hc= critical magnetic field - if H > Hc not superconducting






28. As the applied field (H) increases the magnetic domains change shape and size by movement of domain boundaries.






29. Light Amplification by Stimulated Emission of Radiation






30. A parallel-plate capacitor involves an insulator - or dielectric - between two metal electrodes. The charge density buildup at the capacitor surface is related to the dielectric constant of the material.






31. 1. Ductility- % elongation - % reduction in area - may be of use in metal forming operations (e.g. - stretch forming). This is convenient for mechanical testing - but not very meaningful for most deformation processing. 2. Toughness- Area beneath str






32. For a metal - there is no ______ - only reflection






33. Energy is stored as atomic vibrations - As temperature increases - the average energy of atomic vibrations increases.






34. Undergo extensive plastic deformation prior to failure.






35. Metals are good conductors since their _______is only partially filled.






36. Undergo little or no plastic deformation.






37. Allows flow of electrons in one direction only (useful to convert alternating current to direct current) - Result: no net current flow






38. Measures impact energy 1. Strike a notched sample with an anvil 2. Measure how far the anvil travels following impact 3. Distance traveled is related to energy required to break the sample 4. Very high rate of loading. Makes materials more "brittle."






39. 1. Yield = ratio of functional chips to total # of chips - Most yield loss during wafer processing - b/c of complex 2. Reliability - No device has infinite lifetime. Statistical methods to predict expected lifetime - Failure mechanisms: Diffusion reg






40. - The emission of light from a substance due to the absorption of energy. (Could be radiation - mechanical - or chemical energy. Could also be energetic particles.) - Traps and activator levels are produced by impurity additions to the material - Whe






41. The ability of a material to transport heat - Atomic Perspective: Atomic vibrations and free electrons in hotter regions transport energy to cooler regions - Metals have the largest values






42. Defines the ability of a material to resist fracture even when a flaw exists - Directly depends on size of flaw and material properties - K(ic) is a materials constant






43. Ability to transmit a clear image - The image is clear.






44. Occur due to: restrained thermal expansion/contraction -temperature gradients that lead to differential dimensional changes sigma = Thermal Stress






45. Found in 26 metals and hundreds of alloys & compounds - Tc= critical temperature = termperature below which material is superconductive.






46. Impurities added to the semiconductor that contribute to excess electrons or holes. Doping = intentional impurities.






47. A three terminal device that acts like a simple "on-off" switch. (the basis of Integrated Circuits (IC) technology - used in computers - cell phones - automotive control - etc) - If voltage (potential) applied to the "gate" - current flows between th






48. Large coercivities - Used for permanent magnets - Add particles/voids to inhibit domain wall motion - Example: tungsten steel






49. A high index of refraction (n value) allows for multiple internal reactions.






50. Different orientation of cleavage planes in grains.







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