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Test your basic knowledge |
Engineering Materials
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Subject
:
engineering
Instructions:
Answer 50 questions in 15 minutes.
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Match each statement with the correct term.
Don't refresh. All questions and answers are randomly picked and ordered every time you load a test.
This is a study tool. The 3 wrong answers for each question are randomly chosen from answers to other questions. So, you might find at times the answers obvious, but you will see it re-enforces your understanding as you take the test each time.
1. The ability of a material to be rapidly cooled and not fracture
Pure Semiconductors: Conductivity vs. T
Thermal Shock Resistance
Magnetic Storage Media Types
Oxidation
2. Undergo extensive plastic deformation prior to failure.
M is known as what?
The Transistor
Iron-Silicon Alloy in Transformer Cores
Ductile Materials
3. A parallel-plate capacitor involves an insulator - or dielectric - between two metal electrodes. The charge density buildup at the capacitor surface is related to the dielectric constant of the material.
Bending tests
Insulators
Two ways to measure heat capacity
Opacifiers
4. Growth of an oxide layer by the reaction of oxygen with the substrate - Provides dopant masking and device isolation - IC technology uses 1. Thermal grown oxidation (dry) 2. Wet Oxidation 3. Selective Oxidation
Thermal Shock Resistance
Stages of Failure: Ductile Fracture
Hysteresis and Permanent Magnetization
Oxidation
5. These are liquid crystal polymers- not your normal "crystal" -Rigid - rod shaped molecules are aligned even in liquid form.
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6. Digitalized data in the form of electrical signals are transferred to and recorded digitally on a magnetic medium (tape or disk) - This transference is accomplished by a recording system that consists of a read/write head - "write" or record data by
Transgranular Fracture
Magnetic Storage
Brittle Fracture
Hardness
7. Found in 26 metals and hundreds of alloys & compounds - Tc= critical temperature = termperature below which material is superconductive.
Superconductivity
Generation of a Magnetic Field - Within a Solid Material
Magnetic Storage Media Types
High impact energy
8. Stress concentration at a crack tips
Griffith Crack Model
Ductile-to-Brittle Transition
Specific Heat
Thermal expansion
9. Dramatic change in impact energy is associated with a change in fracture mode from brittle to ductile.
There is no perfect material?
Modulus of Rupture (MOR)
Ductile-to-Brittle Transition
Rockwell
10. - A magnetic field is induced in the material B= Magnetic Induction (tesla) inside the material mu= permeability of a solid
Specific Heat
Generation of a Magnetic Field - Within a Solid Material
Thermal expansion
Shear and Tensile Stress
11. Without passing a current a continually varying magnetic field will cause a current to flow
Brittle Fracture
Response to a Magnetic Field
Soft Magnetic Materials
Why do ceramics have larger bonding energy?
12. Increase temperature - no increase in interatomic separation - no thermal expansion
Thermal Expansion: Symmetric curve
Intrinsic Semiconductors
Rockwell
Soft Magnetic Materials
13. Impurities added to the semiconductor that contribute to excess electrons or holes. Doping = intentional impurities.
Coefficient of Thermal Expansion
Relative Permeability
Intrinsic Semiconductors
Extrinsic Semiconductors
14. Created by current through a coil N= total number of turns L= length of turns (m) I= current (ampere) H= applied magnetic field (ampere-turns/m) Bo= magnetic flux density in a vacuum (tesla)
Critical Properties of Superconductive Materials
Thermal Shock Resistance
Generation of a Magnetic Field - Vacuum
High impact energy
15. Resistance to plastic deformation of cracking in compression - and better wear properties.
Large Hardness
Why do ceramics have larger bonding energy?
Critical Properties of Superconductive Materials
Thermal Stresses
16. If a material has ________ - then the field generated by those moments must be added to the induced field.
Brittle Ceramics
Dependence of Heat Capacity on Temperature
Internal magnetic moments
Extrinsic Semiconductors
17. Allows you to calculate what happened G=F' x cos(lambda) - F=F' x cos(phi)
Linewidth
Force Decomposition
What do magnetic moments arise from?
Superconductivity
18. There is always some statistical distribution of flaws or defects.
There is no perfect material?
Translucent
Film Deposition
Critical Properties of Superconductive Materials
19. 1. Yield = ratio of functional chips to total # of chips - Most yield loss during wafer processing - b/c of complex 2. Reliability - No device has infinite lifetime. Statistical methods to predict expected lifetime - Failure mechanisms: Diffusion reg
Yield and Reliability
Where does DBTT occur?
Opacity
Domains in Ferromagnetic & Ferrimagnetic Materials
20. Second phase particles with n > glass.
Slip Bands
Why materials fail in service
Opacifiers
Ductile Materials
21. 1. General yielding occurs if flaw size a < a(critical) 2. Catastrophic fast fracture occurs if flaw size a > a(critical)
Influence of Temperature on Magnetic Behavior
Engineering Fracture Performance
LASER
There is no perfect material?
22. Light Amplification by Stimulated Emission of Radiation
Coefficient of Thermal Expansion
Diamagnetic Materials
LASER
Thermal Stresses
23. A measure of the ease with which a B field can be induced inside a material.
Relative Permeability
Transgranular Fracture
Slip Bands
Dependence of Heat Capacity on Temperature
24. Failure under cyclic stress 1. It can cause part failure - even though (sigma)max < (sigma)c 2. Causes ~90% of mechanical engineering failures.
Fatigue
Hysteresis and Permanent Magnetization
Coherent
True Stress
25. The magnetic hysteresis phenomenon: Stage 1: Initial (unmagnetized state) Stage 2: Apply H - align domains Stage 3: Remove H - alignment remains => Permanent magnet Stage 4: Coercivity - Hc negative H needed to demagnitize Stage 5: Apply -H - align d
Large Hardness
Intergranular Fracture
Holloman Equation
Hysteresis and Permanent Magnetization
26. To build a device - various thin metal or insulating films are grown on top of each other - Evaporation - MBE - Sputtering - CVD (ALD)
Two ways to measure heat capacity
Reflectance of Non-Metals
Ductile Materials
Film Deposition
27. 1. Impose a compressive surface stress (to suppress surface cracks from growing) - Method 1: shot peening - Method 2: carburizing 2.Remove stress concentrators.
How an LCD works
Holloman Equation
To improve fatigue life
Fourier's Law
28. Cp: Heat capacity at constant pressure Cv: Heat capacity at constant volume.
Two ways to measure heat capacity
Lithography
Color
Coherent
29. 1. Data for Pure Silicon - electrical conductivity increases with T - opposite to metals
Stress Intensity values
Relative Permeability
Pure Semiconductors: Conductivity vs. T
Opaque
30. Measures Hardness 1. psia = 500 x HB 2. MPa = 3.45 x HB
Electromigration
Thermal Stresses
Refraction
HB (Brinell Hardness)
31. Reflectiviy is between 0.90 and 0.95 - Metal surfaces appear shiny - Most of absorbed light is reflected at the same wavelength (NO REFRACTION) - Small fraction of light may be absorbed - Color of reflected light depends on wavelength distribution of
Brittle Fracture
Reflection of Light for Metals
Internal magnetic moments
Energy States: Insulators and Semiconductors
32. Transformer cores require soft magnetic materials - which are easily magnetized and de-magnetized - and have high electrical resistivity - Energy losses in transformers could be minimized if their cores were fabricated such that the easy magnetizatio
Iron-Silicon Alloy in Transformer Cores
Etching
Conduction & Electron Transport
Modulus of Rupture (MOR)
33. The size of the material changes with a change in temperature - polymers have the largest values
Refraction
Coefficient of Thermal Expansion
Bending tests
Force Decomposition
34. Sigma=ln(li/lo)
LASER
Transgranular Fracture
Sparkle of Diamonds
True Strain
35. Specular: light reflecting off a mirror (average) - Diffuse: light reflecting off a white wall (local)
Scattering
Lithography
Insulators
Two kinds of Reflection
36. Allows flow of electrons in one direction only (useful to convert alternating current to direct current) - Result: no net current flow
Dependence of Heat Capacity on Temperature
Opacity
Linewidth
IC Devices: P-N Rectifying Junction
37. Energy is stored as atomic vibrations - As temperature increases - the average energy of atomic vibrations increases.
Heat Capacity from an Atomic Prospective
Stress Intensity values
The Transistor
Meissner Effect
38. As the applied field (H) increases the magnetic domains change shape and size by movement of domain boundaries.
Conduction & Electron Transport
Domains in Ferromagnetic & Ferrimagnetic Materials
Color
Refraction
39. Loss of image transmission - You get no image - There is no light transmission - and therefore reflects - scatters - or absorbs ALL of it. Both mirrors and carbon black are opaque.
Incoherent
Why materials fail in service
Opaque
Generation of a Magnetic Field - Vacuum
40. 1. Ability of the material to absorb energy prior to fracture 2. Short term dynamic stressing - Car collisions - Bullets - Athletic equipment 3. This is different than toughness; energy necessary to push a crack (flaw) through a material 4. Useful in
Fourier's Law
Impact - Toughness
Brittle Fracture
Domains in Ferromagnetic & Ferrimagnetic Materials
41. Elastic means reversible! This is not a permanent deformation.
Heat Capacity
Relative Permeability
Elastic Deformation
Linewidth
42. Flaws and Defects - They concentrate stress locally to levels high enough to rupture bonds.
Why materials fail in service
Fourier's Law
Color
Metallization
43. They are used to assess properties of ceramics & glasses.
Bending tests
Why do ceramics have larger bonding energy?
Thermal Stresses
Iron-Silicon Alloy in Transformer Cores
44. 1. Tc= critical temperature- if T>Tc not superconducting 2. Jc= critical current density - if J>Jc not superconducting 3. Hc= critical magnetic field - if H > Hc not superconducting
Critical Properties of Superconductive Materials
Linewidth
Diamagnetic Materials
IC Devices: P-N Rectifying Junction
45. Process by which geometric patterns are transferred from a mask (reticle) to a surface of a chip to form the device.
Lithography
There is no perfect material?
Extrinsic Semiconductors
Opacifiers
46. Occur due to: restrained thermal expansion/contraction -temperature gradients that lead to differential dimensional changes sigma = Thermal Stress
Transparent
Opacifiers
Thermal Stresses
Meissner Effect
47. Plastic means permanent! When a small load is applied - bonds stretch & planes shear. Then when the load is no longer applied - the planes are still sheared.
Heat Capacity from an Atomic Prospective
Film Deposition
Plastic Deformation (Metals)
Elastic Deformation
48. Because of ionic & covalent-type bonding.
Why do ceramics have larger bonding energy?
Energy States: Insulators and Semiconductors
Internal magnetic moments
Reflection of Light for Metals
49. For a metal - there is no ______ - only reflection
Refraction
HB (Brinell Hardness)
LASER
Linewidth
50. With Increasing temperature - the saturation magnetization diminishes gradually and then abruptly drops to zero at Curie Temperature - Tc.
Influence of Temperature on Magnetic Behavior
Holloman Equation
4 Types of Magnetism
Fourier's Law
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