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Engineering Materials

Subject : engineering
Instructions:
  • Answer 50 questions in 15 minutes.
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  • Match each statement with the correct term.
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This is a study tool. The 3 wrong answers for each question are randomly chosen from answers to other questions. So, you might find at times the answers obvious, but you will see it re-enforces your understanding as you take the test each time.
1. Transmitted light distorts electron clouds - The velocity of light in a material is lower than in a vacuum - Adding large ions to glass decreases the speed of light in the glass - Light can be "bent" (or refracted) as it passes through a transparent






2. Is analogous to toughness.






3. Measures impact energy 1. Strike a notched sample with an anvil 2. Measure how far the anvil travels following impact 3. Distance traveled is related to energy required to break the sample 4. Very high rate of loading. Makes materials more "brittle."






4. Process by which geometric patterns are transferred from a mask (reticle) to a surface of a chip to form the device.






5. A parallel-plate capacitor involves an insulator - or dielectric - between two metal electrodes. The charge density buildup at the capacitor surface is related to the dielectric constant of the material.






6. Defines the ability of a material to resist fracture even when a flaw exists - Directly depends on size of flaw and material properties - K(ic) is a materials constant






7. 1. Ability of the material to absorb energy prior to fracture 2. Short term dynamic stressing - Car collisions - Bullets - Athletic equipment 3. This is different than toughness; energy necessary to push a crack (flaw) through a material 4. Useful in






8. Plastic means permanent! When a small load is applied - bonds stretch & planes shear. Then when the load is no longer applied - the planes are still sheared.






9. 1. Fluorescent Lamp - tungstate or silicate coating on inside of tube emits white light due to UV light generated inside the tube. 2. TV screen - emits light as electron beam is scanned back and forth.






10. Ability to transmit a clear image - The image is clear.






11. Specular: light reflecting off a mirror (average) - Diffuse: light reflecting off a white wall (local)






12. The ability of a material to absorb heat - Quantitatively: The energy required to produce a unit rise in temperature for one mole of a material.






13. 1. Impose a compressive surface stress (to suppress surface cracks from growing) - Method 1: shot peening - Method 2: carburizing 2.Remove stress concentrators.






14. Typical loading conditions are _____ enough to break all inter-atomic bonds






15. Specific heat = energy input/(mass*temperature change)






16. Growth of an oxide layer by the reaction of oxygen with the substrate - Provides dopant masking and device isolation - IC technology uses 1. Thermal grown oxidation (dry) 2. Wet Oxidation 3. Selective Oxidation






17. Increase temperature - increase in interatomic separation - thermal expansion






18. The size of the material changes with a change in temperature - polymers have the largest values






19. Diffuse image






20. They are used to assess properties of ceramics & glasses.






21. ...occurs in bcc metals but not in fcc metals.






22. Sigma=ln(li/lo)






23. Materials change size when temperature is changed






24. Elastic means reversible! This is not a permanent deformation.






25. Metals are good conductors since their _______is only partially filled.






26. Undergo extensive plastic deformation prior to failure.






27. 1. Data for Pure Silicon - electrical conductivity increases with T - opposite to metals






28. 1. Electron motions 2. The spins on electrons - Net atomic magnetic moment: sum of moments from all electrons.






29. These are liquid crystal polymers- not your normal "crystal" -Rigid - rod shaped molecules are aligned even in liquid form.

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30. Is reflected - absorbed - scattered - and/or transmitted: Io=It+Ia+Ir+Is






31. The Magnetization of the material - and is essentially the dipole moment per unit volume. It is proportional to the applied field. Xm is the magnetic susceptibility.






32. - The emission of light from a substance due to the absorption of energy. (Could be radiation - mechanical - or chemical energy. Could also be energetic particles.) - Traps and activator levels are produced by impurity additions to the material - Whe






33. Small Coercivities - Used for electric motors - Example: commercial iron 99.95 Fe






34. 1. Yield = ratio of functional chips to total # of chips - Most yield loss during wafer processing - b/c of complex 2. Reliability - No device has infinite lifetime. Statistical methods to predict expected lifetime - Failure mechanisms: Diffusion reg






35. Because of ionic & covalent-type bonding.






36. Allows you to calculate what happened G=F' x cos(lambda) - F=F' x cos(phi)






37. 1. Stress-strain behavior is not usually determined via tensile tests 2. Material fails before it yields 3. Bend/flexure tests are often used instead.






38. heat flux = -(thermal conductivity)(temperature gradient) - Defines heat transfer by CONDUCTION

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39. Rho=F/A - tau=G/A . Depending on what angle the force is applied - and what angle the crystal is at - it takes different amounts of force to induce plastic deformation.






40. 1. Ductility- % elongation - % reduction in area - may be of use in metal forming operations (e.g. - stretch forming). This is convenient for mechanical testing - but not very meaningful for most deformation processing. 2. Toughness- Area beneath str






41. Superconductors expel magnetic fields - This is why a superconductor will float above a magnet.






42. If a material has ________ - then the field generated by those moments must be added to the induced field.






43. With Increasing temperature - the saturation magnetization diminishes gradually and then abruptly drops to zero at Curie Temperature - Tc.






44. A high index of refraction (n value) allows for multiple internal reactions.






45. Second phase particles with n > glass.






46. (sigma)=K(sigma)^n . K = strength coefficient - n = work hardening rate or strain hardening exponent. Large n value increases strength and hardness.






47. This strength parameter is similar in magnitude to a tensile strength. Fracture occurs along the outermost sample edge - which is under a tensile load.






48. Another optical property - Depends on the wavelength of the visible spectrum.






49. The magnetic hysteresis phenomenon: Stage 1: Initial (unmagnetized state) Stage 2: Apply H - align domains Stage 3: Remove H - alignment remains => Permanent magnet Stage 4: Coercivity - Hc negative H needed to demagnitize Stage 5: Apply -H - align d






50. 1. Diamagnetic (Xm ~ 10^-5) - small and negative magnetic susceptibilities 2. Paramagnetic (Xm ~ 10^-4) - small and positive magnetic susceptibilities 3. Ferromagnetic - large magnetic susceptibilities 4. Ferrimagnetic (Xm as large as 10^6) - large m







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