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Engineering Materials

Subject : engineering
Instructions:
  • Answer 50 questions in 15 minutes.
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  • Match each statement with the correct term.
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This is a study tool. The 3 wrong answers for each question are randomly chosen from answers to other questions. So, you might find at times the answers obvious, but you will see it re-enforces your understanding as you take the test each time.
1. The ability of a material to be rapidly cooled and not fracture






2. Undergo extensive plastic deformation prior to failure.






3. A parallel-plate capacitor involves an insulator - or dielectric - between two metal electrodes. The charge density buildup at the capacitor surface is related to the dielectric constant of the material.






4. Growth of an oxide layer by the reaction of oxygen with the substrate - Provides dopant masking and device isolation - IC technology uses 1. Thermal grown oxidation (dry) 2. Wet Oxidation 3. Selective Oxidation






5. These are liquid crystal polymers- not your normal "crystal" -Rigid - rod shaped molecules are aligned even in liquid form.

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6. Digitalized data in the form of electrical signals are transferred to and recorded digitally on a magnetic medium (tape or disk) - This transference is accomplished by a recording system that consists of a read/write head - "write" or record data by






7. Found in 26 metals and hundreds of alloys & compounds - Tc= critical temperature = termperature below which material is superconductive.






8. Stress concentration at a crack tips






9. Dramatic change in impact energy is associated with a change in fracture mode from brittle to ductile.






10. - A magnetic field is induced in the material B= Magnetic Induction (tesla) inside the material mu= permeability of a solid






11. Without passing a current a continually varying magnetic field will cause a current to flow






12. Increase temperature - no increase in interatomic separation - no thermal expansion






13. Impurities added to the semiconductor that contribute to excess electrons or holes. Doping = intentional impurities.






14. Created by current through a coil N= total number of turns L= length of turns (m) I= current (ampere) H= applied magnetic field (ampere-turns/m) Bo= magnetic flux density in a vacuum (tesla)






15. Resistance to plastic deformation of cracking in compression - and better wear properties.






16. If a material has ________ - then the field generated by those moments must be added to the induced field.






17. Allows you to calculate what happened G=F' x cos(lambda) - F=F' x cos(phi)






18. There is always some statistical distribution of flaws or defects.






19. 1. Yield = ratio of functional chips to total # of chips - Most yield loss during wafer processing - b/c of complex 2. Reliability - No device has infinite lifetime. Statistical methods to predict expected lifetime - Failure mechanisms: Diffusion reg






20. Second phase particles with n > glass.






21. 1. General yielding occurs if flaw size a < a(critical) 2. Catastrophic fast fracture occurs if flaw size a > a(critical)






22. Light Amplification by Stimulated Emission of Radiation






23. A measure of the ease with which a B field can be induced inside a material.






24. Failure under cyclic stress 1. It can cause part failure - even though (sigma)max < (sigma)c 2. Causes ~90% of mechanical engineering failures.






25. The magnetic hysteresis phenomenon: Stage 1: Initial (unmagnetized state) Stage 2: Apply H - align domains Stage 3: Remove H - alignment remains => Permanent magnet Stage 4: Coercivity - Hc negative H needed to demagnitize Stage 5: Apply -H - align d






26. To build a device - various thin metal or insulating films are grown on top of each other - Evaporation - MBE - Sputtering - CVD (ALD)






27. 1. Impose a compressive surface stress (to suppress surface cracks from growing) - Method 1: shot peening - Method 2: carburizing 2.Remove stress concentrators.






28. Cp: Heat capacity at constant pressure Cv: Heat capacity at constant volume.






29. 1. Data for Pure Silicon - electrical conductivity increases with T - opposite to metals






30. Measures Hardness 1. psia = 500 x HB 2. MPa = 3.45 x HB






31. Reflectiviy is between 0.90 and 0.95 - Metal surfaces appear shiny - Most of absorbed light is reflected at the same wavelength (NO REFRACTION) - Small fraction of light may be absorbed - Color of reflected light depends on wavelength distribution of






32. Transformer cores require soft magnetic materials - which are easily magnetized and de-magnetized - and have high electrical resistivity - Energy losses in transformers could be minimized if their cores were fabricated such that the easy magnetizatio






33. The size of the material changes with a change in temperature - polymers have the largest values






34. Sigma=ln(li/lo)






35. Specular: light reflecting off a mirror (average) - Diffuse: light reflecting off a white wall (local)






36. Allows flow of electrons in one direction only (useful to convert alternating current to direct current) - Result: no net current flow






37. Energy is stored as atomic vibrations - As temperature increases - the average energy of atomic vibrations increases.






38. As the applied field (H) increases the magnetic domains change shape and size by movement of domain boundaries.






39. Loss of image transmission - You get no image - There is no light transmission - and therefore reflects - scatters - or absorbs ALL of it. Both mirrors and carbon black are opaque.






40. 1. Ability of the material to absorb energy prior to fracture 2. Short term dynamic stressing - Car collisions - Bullets - Athletic equipment 3. This is different than toughness; energy necessary to push a crack (flaw) through a material 4. Useful in






41. Elastic means reversible! This is not a permanent deformation.






42. Flaws and Defects - They concentrate stress locally to levels high enough to rupture bonds.






43. They are used to assess properties of ceramics & glasses.






44. 1. Tc= critical temperature- if T>Tc not superconducting 2. Jc= critical current density - if J>Jc not superconducting 3. Hc= critical magnetic field - if H > Hc not superconducting






45. Process by which geometric patterns are transferred from a mask (reticle) to a surface of a chip to form the device.






46. Occur due to: restrained thermal expansion/contraction -temperature gradients that lead to differential dimensional changes sigma = Thermal Stress






47. Plastic means permanent! When a small load is applied - bonds stretch & planes shear. Then when the load is no longer applied - the planes are still sheared.






48. Because of ionic & covalent-type bonding.






49. For a metal - there is no ______ - only reflection






50. With Increasing temperature - the saturation magnetization diminishes gradually and then abruptly drops to zero at Curie Temperature - Tc.







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