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Engineering Materials
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Subject
:
engineering
Instructions:
Answer 50 questions in 15 minutes.
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Match each statement with the correct term.
Don't refresh. All questions and answers are randomly picked and ordered every time you load a test.
This is a study tool. The 3 wrong answers for each question are randomly chosen from answers to other questions. So, you might find at times the answers obvious, but you will see it re-enforces your understanding as you take the test each time.
1. 1. Metals: Thermal energy puts many electrons into a higher energy state. 2. Energy States: Nearby energy states are accessible by thermal fluctuations.
Conduction & Electron Transport
Ductile Fracture
To improve fatigue life
The Transistor
2. 1. Diamagnetic (Xm ~ 10^-5) - small and negative magnetic susceptibilities 2. Paramagnetic (Xm ~ 10^-4) - small and positive magnetic susceptibilities 3. Ferromagnetic - large magnetic susceptibilities 4. Ferrimagnetic (Xm as large as 10^6) - large m
Electromigration
4 Types of Magnetism
Ductile-to-Brittle Transition
Luminescence examples
3. Failure under cyclic stress 1. It can cause part failure - even though (sigma)max < (sigma)c 2. Causes ~90% of mechanical engineering failures.
Luminescence
Liquid Crystal Displays (LCD's)
Fatigue
Hardness
4. Width of smallest feature obtainable on Si surface
Reflectance of Non-Metals
Thermal expansion
Linewidth
Two kinds of Reflection
5. 1. Tc= critical temperature- if T>Tc not superconducting 2. Jc= critical current density - if J>Jc not superconducting 3. Hc= critical magnetic field - if H > Hc not superconducting
The Transistor
Hardness
Charpy or Izod test
Critical Properties of Superconductive Materials
6. Process by which metal atoms diffuse because of a potential.
Why do ceramics have larger bonding energy?
Electromigration
Intrinsic Semiconductors
Heat Capacity from an Atomic Prospective
7. Diffuse image
Thermal Expansion: Asymmetric curve
Translucent
Thermal Conductivity
Stages of Failure: Ductile Fracture
8. -> fluorescent light - electron transitions occur randomly - light waves are out of phase with each other.
Incoherent
Scattering
Work Hardening
Thermal Stresses
9. 1. Data for Pure Silicon - electrical conductivity increases with T - opposite to metals
The three modes of crack surface displacement
Opacity
Pure Semiconductors: Conductivity vs. T
Magnetic Storage Media Types
10. Typical loading conditions are _____ enough to break all inter-atomic bonds
Superconductivity
Not severe
Thermal Expansion: Asymmetric curve
Incoherent
11. 1. Yield = ratio of functional chips to total # of chips - Most yield loss during wafer processing - b/c of complex 2. Reliability - No device has infinite lifetime. Statistical methods to predict expected lifetime - Failure mechanisms: Diffusion reg
High impact energy
Yield and Reliability
To improve fatigue life
Hardness
12. This strength parameter is similar in magnitude to a tensile strength. Fracture occurs along the outermost sample edge - which is under a tensile load.
Specific Heat
Modulus of Rupture (MOR)
Opaque
High impact energy
13. High toughness; material resists crack propagation.
Incident Light
Metallization
True Stress
High impact energy
14. (sigma)=K(sigma)^n . K = strength coefficient - n = work hardening rate or strain hardening exponent. Large n value increases strength and hardness.
Brittle Ceramics
Holloman Equation
Modulus of Rupture (MOR)
Griffith Crack Model
15. Hardness is the resistance of a material to deformation by indentation - Useful in quality control - Hardness can provide a qualitative assessment of strength - Hardness cannot be used to quantitatively infer strength or ductility.
Opacity
Fourier's Law
Thermal expansion
Hardness
16. Energy is stored as atomic vibrations - As temperature increases - the average energy of atomic vibrations increases.
Brittle Ceramics
Paramagnetic Materials
Extrinsic Semiconductors
Heat Capacity from an Atomic Prospective
17. Defines the ability of a material to resist fracture even when a flaw exists - Directly depends on size of flaw and material properties - K(ic) is a materials constant
Superconductivity
Film Deposition
Stress Intensity Factor
Hysteresis and Permanent Magnetization
18. Impurities added to the semiconductor that contribute to excess electrons or holes. Doping = intentional impurities.
Extrinsic Semiconductors
Ductile-to-Brittle Transition
Hardness
Why materials fail in service
19. Cp: Heat capacity at constant pressure Cv: Heat capacity at constant volume.
Two ways to measure heat capacity
Thermal expansion
Brittle Ceramics
How to gage the extent of plastic deformation
20. Measures impact energy 1. Strike a notched sample with an anvil 2. Measure how far the anvil travels following impact 3. Distance traveled is related to energy required to break the sample 4. Very high rate of loading. Makes materials more "brittle."
Intrinsic Semiconductors
Charpy or Izod test
Transgranular Fracture
Coherent
21. Occur due to: restrained thermal expansion/contraction -temperature gradients that lead to differential dimensional changes sigma = Thermal Stress
Metals: Resistivity vs. T - Impurities
Relative Permeability
Thermal Stresses
Modulus of Rupture (MOR)
22. Allows you to calculate what happened G=F' x cos(lambda) - F=F' x cos(phi)
Linewidth
Incident Light
Force Decomposition
Influence of Temperature on Magnetic Behavior
23. Flaws and Defects - They concentrate stress locally to levels high enough to rupture bonds.
How to gage the extent of plastic deformation
Why fracture surfaces have faceted texture
Why materials fail in service
Fourier's Law
24. 1. Insulators: Higher energy states NOT ACCESSIBLE due to gap 2. Semiconductors: Higher energy states separated by a smaller gap.
To improve fatigue life
Ductile Materials
Relative Permeability
Energy States: Insulators and Semiconductors
25. Degree of opacity depends on size and number of particles - Opacity of metals is the result of conduction electrons absorbing photons in the visible range.
Sparkle of Diamonds
Incident Light
Large Hardness
Opacity
26. Different orientation of cleavage planes in grains.
Etching
Stages of Failure: Ductile Fracture
High impact energy
Why fracture surfaces have faceted texture
27. Specific heat = energy input/(mass*temperature change)
Specific Heat
IC Devices: P-N Rectifying Junction
Insulators
Hardness
28. 1. Tensile (opening) 2. Sliding 3. Tearing
Refraction
Impact energy
Scattering
The three modes of crack surface displacement
29. Digitalized data in the form of electrical signals are transferred to and recorded digitally on a magnetic medium (tape or disk) - This transference is accomplished by a recording system that consists of a read/write head - "write" or record data by
There is no perfect material?
Oxidation
Magnetic Storage
The three modes of crack surface displacement
30. 1. Hard disk drives (granular/perpendicular media) 2. Recording tape (particulate media)
Generation of a Magnetic Field - Within a Solid Material
The three modes of crack surface displacement
Magnetic Storage Media Types
Conduction & Electron Transport
31. Reflectiviy is between 0.90 and 0.95 - Metal surfaces appear shiny - Most of absorbed light is reflected at the same wavelength (NO REFRACTION) - Small fraction of light may be absorbed - Color of reflected light depends on wavelength distribution of
Reflection of Light for Metals
Work Hardening
Brittle Ceramics
Stress Intensity values
32. Elastic means reversible! This is not a permanent deformation.
Elastic Deformation
Iron-Silicon Alloy in Transformer Cores
Incoherent
Incident Light
33. These materials are relatively unaffected by magnetic fields.
Stages of Failure: Ductile Fracture
Diamagnetic Materials
Yield and Reliability
Coherent
34. Not ALL the light is refracted - SOME is reflected. Materials with a high index of refraction also have high reflectance - High R is bad for lens applications - since this leads to undesirable light losses or interference.
Coherent
True Stress
Incident Light
Reflectance of Non-Metals
35. Dramatic change in impact energy is associated with a change in fracture mode from brittle to ductile.
Soft Magnetic Materials
Incoherent
Diamagnetic Materials
Ductile-to-Brittle Transition
36. Measures Hardness 1. psia = 500 x HB 2. MPa = 3.45 x HB
Work Hardening
The three modes of crack surface displacement
HB (Brinell Hardness)
Sparkle of Diamonds
37. Occur when lots of dislocations move.
Luminescence
Slip Bands
Extrinsic Semiconductors
Luminescence examples
38. The ability of a material to be rapidly cooled and not fracture
Thermal Shock Resistance
The Transistor
High impact energy
Brittle Materials
39. ...occurs in bcc metals but not in fcc metals.
Coefficient of Thermal Expansion
Scattering
Where does DBTT occur?
Engineering Fracture Performance
40. 1. Ability of the material to absorb energy prior to fracture 2. Short term dynamic stressing - Car collisions - Bullets - Athletic equipment 3. This is different than toughness; energy necessary to push a crack (flaw) through a material 4. Useful in
Brittle Fracture
Impact - Toughness
Luminescence examples
Hysteresis and Permanent Magnetization
41. Cracks propagate along grain boundaries.
Shear and Tensile Stress
True Strain
Intergranular Fracture
Thermal expansion
42. For a metal - there is no ______ - only reflection
Refraction
Metallization
Energy States: Insulators and Semiconductors
Color
43. Allows flow of electrons in one direction only (useful to convert alternating current to direct current) - Result: no net current flow
Plastic Deformation (Metals)
Sparkle of Diamonds
IC Devices: P-N Rectifying Junction
Luminescence examples
44. Without passing a current a continually varying magnetic field will cause a current to flow
Heat Capacity
Thermal expansion
Rockwell
Response to a Magnetic Field
45. The magnetic hysteresis phenomenon: Stage 1: Initial (unmagnetized state) Stage 2: Apply H - align domains Stage 3: Remove H - alignment remains => Permanent magnet Stage 4: Coercivity - Hc negative H needed to demagnitize Stage 5: Apply -H - align d
Plastic Deformation (Metals)
Hysteresis and Permanent Magnetization
Impact - Toughness
Valence band
46. A three terminal device that acts like a simple "on-off" switch. (the basis of Integrated Circuits (IC) technology - used in computers - cell phones - automotive control - etc) - If voltage (potential) applied to the "gate" - current flows between th
Response to a Magnetic Field
Ductile Fracture
The Transistor
Not severe
47. 1. Stress-strain behavior is not usually determined via tensile tests 2. Material fails before it yields 3. Bend/flexure tests are often used instead.
Luminescence
Large Hardness
Brittle Ceramics
What do magnetic moments arise from?
48. Materials change size when temperature is changed
Thermal Stresses
Intergranular Fracture
Opacity
Thermal expansion
49. Increase temperature - no increase in interatomic separation - no thermal expansion
Soft Magnetic Materials
True Stress
Yield and Reliability
Thermal Expansion: Symmetric curve
50. - A magnetic field is induced in the material B= Magnetic Induction (tesla) inside the material mu= permeability of a solid
Ductile Materials
M is known as what?
Generation of a Magnetic Field - Within a Solid Material
Stress Intensity values
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