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Engineering Materials

Subject : engineering
Instructions:
  • Answer 50 questions in 15 minutes.
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  • Match each statement with the correct term.
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This is a study tool. The 3 wrong answers for each question are randomly chosen from answers to other questions. So, you might find at times the answers obvious, but you will see it re-enforces your understanding as you take the test each time.
1. ...occurs in bcc metals but not in fcc metals.






2. Dimples on fracture surface correspond to microcavities that initiate crack formation.






3. Increase temperature - increase in interatomic separation - thermal expansion






4. Increase temperature - no increase in interatomic separation - no thermal expansion






5. Ability to transmit a clear image - The image is clear.






6. This strength parameter is similar in magnitude to a tensile strength. Fracture occurs along the outermost sample edge - which is under a tensile load.






7. There is always some statistical distribution of flaws or defects.






8. A measure of the ease with which a B field can be induced inside a material.






9. Because of ionic & covalent-type bonding.






10. Defines the ability of a material to resist fracture even when a flaw exists - Directly depends on size of flaw and material properties - K(ic) is a materials constant






11. Light Amplification by Stimulated Emission of Radiation






12. Without passing a current a continually varying magnetic field will cause a current to flow






13. For a metal - there is no ______ - only reflection






14. The ability of a material to be rapidly cooled and not fracture






15. Is analogous to toughness.






16. With Increasing temperature - the saturation magnetization diminishes gradually and then abruptly drops to zero at Curie Temperature - Tc.






17. Rho=F/A - tau=G/A . Depending on what angle the force is applied - and what angle the crystal is at - it takes different amounts of force to induce plastic deformation.






18. 1. Tc= critical temperature- if T>Tc not superconducting 2. Jc= critical current density - if J>Jc not superconducting 3. Hc= critical magnetic field - if H > Hc not superconducting






19. Allows flow of electrons in one direction only (useful to convert alternating current to direct current) - Result: no net current flow






20. Hardness is the resistance of a material to deformation by indentation - Useful in quality control - Hardness can provide a qualitative assessment of strength - Hardness cannot be used to quantitatively infer strength or ductility.






21. Energy is stored as atomic vibrations - As temperature increases - the average energy of atomic vibrations increases.






22. 1. Fluorescent Lamp - tungstate or silicate coating on inside of tube emits white light due to UV light generated inside the tube. 2. TV screen - emits light as electron beam is scanned back and forth.






23. - A magnetic field is induced in the material B= Magnetic Induction (tesla) inside the material mu= permeability of a solid






24. Process by which geometric patterns are transferred from a mask (reticle) to a surface of a chip to form the device.






25. Specular: light reflecting off a mirror (average) - Diffuse: light reflecting off a white wall (local)






26. The ability of a material to transport heat - Atomic Perspective: Atomic vibrations and free electrons in hotter regions transport energy to cooler regions - Metals have the largest values






27. Occur when lots of dislocations move.






28. Occurs at a single pore or other solid by refraction n = 1 for pore (air) n > 1 for the solid - n ~ 1.5 for glass - Scattering effect is maximized by pore/particle size within 400-700 nm range - Reason for Opacity in ceramics - glasses and polymers.






29. They are used to assess properties of ceramics & glasses.






30. - The emission of light from a substance due to the absorption of energy. (Could be radiation - mechanical - or chemical energy. Could also be energetic particles.) - Traps and activator levels are produced by impurity additions to the material - Whe






31. Process by which metal atoms diffuse because of a potential.






32. Second phase particles with n > glass.






33. Impurities added to the semiconductor that contribute to excess electrons or holes. Doping = intentional impurities.






34. Measures impact energy 1. Strike a notched sample with an anvil 2. Measure how far the anvil travels following impact 3. Distance traveled is related to energy required to break the sample 4. Very high rate of loading. Makes materials more "brittle."






35. Resistance to plastic deformation of cracking in compression - and better wear properties.






36. 1. General yielding occurs if flaw size a < a(critical) 2. Catastrophic fast fracture occurs if flaw size a > a(critical)






37. Loss of image transmission - You get no image - There is no light transmission - and therefore reflects - scatters - or absorbs ALL of it. Both mirrors and carbon black are opaque.






38. Wet: isotropic - under cut Dry: ansiotropic - directional






39. The Magnetization of the material - and is essentially the dipole moment per unit volume. It is proportional to the applied field. Xm is the magnetic susceptibility.






40. Sigma=ln(li/lo)






41. Found in 26 metals and hundreds of alloys & compounds - Tc= critical temperature = termperature below which material is superconductive.






42. 1. Ductility- % elongation - % reduction in area - may be of use in metal forming operations (e.g. - stretch forming). This is convenient for mechanical testing - but not very meaningful for most deformation processing. 2. Toughness- Area beneath str






43. To build a device - various thin metal or insulating films are grown on top of each other - Evaporation - MBE - Sputtering - CVD (ALD)






44. 1. Metals: Thermal energy puts many electrons into a higher energy state. 2. Energy States: Nearby energy states are accessible by thermal fluctuations.






45. The ability of a material to absorb heat - Quantitatively: The energy required to produce a unit rise in temperature for one mole of a material.






46. 1. Ability of the material to absorb energy prior to fracture 2. Short term dynamic stressing - Car collisions - Bullets - Athletic equipment 3. This is different than toughness; energy necessary to push a crack (flaw) through a material 4. Useful in






47. The size of the material changes with a change in temperature - polymers have the largest values






48. Stress concentration at a crack tips






49. (sigma)=F/Ai (rho)=(rho)'(1+(epsilon))






50. No appreciable plastic deformation. The crack propagates very fast; nearly perpendicular to applied stress. Cracks often propagate along specific crystal planes or boundaries.







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