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Engineering Materials

Subject : engineering
Instructions:
  • Answer 50 questions in 15 minutes.
  • If you are not ready to take this test, you can study here.
  • Match each statement with the correct term.
  • Don't refresh. All questions and answers are randomly picked and ordered every time you load a test.

This is a study tool. The 3 wrong answers for each question are randomly chosen from answers to other questions. So, you might find at times the answers obvious, but you will see it re-enforces your understanding as you take the test each time.
1. To build a device - various thin metal or insulating films are grown on top of each other - Evaporation - MBE - Sputtering - CVD (ALD)






2. Light Amplification by Stimulated Emission of Radiation






3. Second phase particles with n > glass.






4. As the applied field (H) increases the magnetic domains change shape and size by movement of domain boundaries.






5. 1. Diamagnetic (Xm ~ 10^-5) - small and negative magnetic susceptibilities 2. Paramagnetic (Xm ~ 10^-4) - small and positive magnetic susceptibilities 3. Ferromagnetic - large magnetic susceptibilities 4. Ferrimagnetic (Xm as large as 10^6) - large m






6. The ability of a material to be rapidly cooled and not fracture






7. 1. Ability of the material to absorb energy prior to fracture 2. Short term dynamic stressing - Car collisions - Bullets - Athletic equipment 3. This is different than toughness; energy necessary to push a crack (flaw) through a material 4. Useful in






8. - The emission of light from a substance due to the absorption of energy. (Could be radiation - mechanical - or chemical energy. Could also be energetic particles.) - Traps and activator levels are produced by impurity additions to the material - Whe






9. Heat capacity.....- increases with temperature -for solids it reaches a limiting value of 3R






10. Cp: Heat capacity at constant pressure Cv: Heat capacity at constant volume.






11. 1. Ductility- % elongation - % reduction in area - may be of use in metal forming operations (e.g. - stretch forming). This is convenient for mechanical testing - but not very meaningful for most deformation processing. 2. Toughness- Area beneath str






12. 1. Hard disk drives (granular/perpendicular media) 2. Recording tape (particulate media)






13. Superconductors expel magnetic fields - This is why a superconductor will float above a magnet.






14. This strength parameter is similar in magnitude to a tensile strength. Fracture occurs along the outermost sample edge - which is under a tensile load.






15. Width of smallest feature obtainable on Si surface






16. 1. Tensile (opening) 2. Sliding 3. Tearing






17. Large coercivities - Used for permanent magnets - Add particles/voids to inhibit domain wall motion - Example: tungsten steel






18. These are liquid crystal polymers- not your normal "crystal" -Rigid - rod shaped molecules are aligned even in liquid form.

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19. These materials are "attracted" to magnetic fields.






20. heat flux = -(thermal conductivity)(temperature gradient) - Defines heat transfer by CONDUCTION

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21. Allows you to calculate what happened G=F' x cos(lambda) - F=F' x cos(phi)






22. The Magnetization of the material - and is essentially the dipole moment per unit volume. It is proportional to the applied field. Xm is the magnetic susceptibility.






23. 1. Insulators: Higher energy states NOT ACCESSIBLE due to gap 2. Semiconductors: Higher energy states separated by a smaller gap.






24. Measures impact energy 1. Strike a notched sample with an anvil 2. Measure how far the anvil travels following impact 3. Distance traveled is related to energy required to break the sample 4. Very high rate of loading. Makes materials more "brittle."






25. Occur due to: restrained thermal expansion/contraction -temperature gradients that lead to differential dimensional changes sigma = Thermal Stress






26. Digitalized data in the form of electrical signals are transferred to and recorded digitally on a magnetic medium (tape or disk) - This transference is accomplished by a recording system that consists of a read/write head - "write" or record data by






27. Impurities added to the semiconductor that contribute to excess electrons or holes. Doping = intentional impurities.






28. Becomes harder (more strain) to stretch (elongate)






29. Typical loading conditions are _____ enough to break all inter-atomic bonds






30. Wet: isotropic - under cut Dry: ansiotropic - directional






31. 1. Data for Pure Silicon - electrical conductivity increases with T - opposite to metals






32. They are used to assess properties of ceramics & glasses.






33. Metals are good conductors since their _______is only partially filled.






34. Loss of image transmission - You get no image - There is no light transmission - and therefore reflects - scatters - or absorbs ALL of it. Both mirrors and carbon black are opaque.






35. - A magnetic field is induced in the material B= Magnetic Induction (tesla) inside the material mu= permeability of a solid






36. Energy is stored as atomic vibrations - As temperature increases - the average energy of atomic vibrations increases.






37. If a material has ________ - then the field generated by those moments must be added to the induced field.






38. Because of ionic & covalent-type bonding.






39. Cracks propagate along grain boundaries.






40. (sigma)=F/Ai (rho)=(rho)'(1+(epsilon))






41. Materials change size when temperature is changed






42. Degree of opacity depends on size and number of particles - Opacity of metals is the result of conduction electrons absorbing photons in the visible range.






43. # of thermally generated electrons = # of holes (broken bonds)






44. 1. Necking 2. Cavity formation 3. Cavity coalescence to form cracks 4. Crack propagation (growth) 5. Fracture






45. - Metals that exhibit high ductility - exhibit high toughness. Ceramics are very strong - but have low ductility and low toughness - Polymers are very ductile but are not generally very strong in shear (compared to metals and ceramics). They have low






46. (sigma)=K(sigma)^n . K = strength coefficient - n = work hardening rate or strain hardening exponent. Large n value increases strength and hardness.






47. Process by which geometric patterns are transferred from a mask (reticle) to a surface of a chip to form the device.






48. Different orientation of cleavage planes in grains.






49. With Increasing temperature - the saturation magnetization diminishes gradually and then abruptly drops to zero at Curie Temperature - Tc.






50. For a metal - there is no ______ - only reflection







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