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Test your basic knowledge |
Engineering Materials
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Subject
:
engineering
Instructions:
Answer 50 questions in 15 minutes.
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Match each statement with the correct term.
Don't refresh. All questions and answers are randomly picked and ordered every time you load a test.
This is a study tool. The 3 wrong answers for each question are randomly chosen from answers to other questions. So, you might find at times the answers obvious, but you will see it re-enforces your understanding as you take the test each time.
1. The size of the material changes with a change in temperature - polymers have the largest values
Coefficient of Thermal Expansion
Magnetic Storage Media Types
Thermal expansion
Linewidth
2. Process by which geometric patterns are transferred from a mask (reticle) to a surface of a chip to form the device.
Heat Capacity from an Atomic Prospective
True Stress
Lithography
Luminescence
3. 1. Stress-strain behavior is not usually determined via tensile tests 2. Material fails before it yields 3. Bend/flexure tests are often used instead.
Brittle Ceramics
Impact energy
Insulators
Fourier's Law
4. To build a device - various thin metal or insulating films are grown on top of each other - Evaporation - MBE - Sputtering - CVD (ALD)
Fourier's Law
Sparkle of Diamonds
Heat Capacity
Film Deposition
5. Plastic means permanent! When a small load is applied - bonds stretch & planes shear. Then when the load is no longer applied - the planes are still sheared.
True Stress
Extrinsic Semiconductors
There is no perfect material?
Plastic Deformation (Metals)
6. The Magnetization of the material - and is essentially the dipole moment per unit volume. It is proportional to the applied field. Xm is the magnetic susceptibility.
M is known as what?
Why materials fail in service
Etching
Heat Capacity from an Atomic Prospective
7. Heat capacity.....- increases with temperature -for solids it reaches a limiting value of 3R
Holloman Equation
Luminescence
Dependence of Heat Capacity on Temperature
Sparkle of Diamonds
8. Width of smallest feature obtainable on Si surface
IC Devices: P-N Rectifying Junction
Linewidth
Ductile-to-Brittle Transition
Dependence of Heat Capacity on Temperature
9. 1. Diamagnetic (Xm ~ 10^-5) - small and negative magnetic susceptibilities 2. Paramagnetic (Xm ~ 10^-4) - small and positive magnetic susceptibilities 3. Ferromagnetic - large magnetic susceptibilities 4. Ferrimagnetic (Xm as large as 10^6) - large m
Metals: Resistivity vs. T - Impurities
Two ways to measure heat capacity
Refraction
4 Types of Magnetism
10. heat flux = -(thermal conductivity)(temperature gradient) - Defines heat transfer by CONDUCTION
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11. These are liquid crystal polymers- not your normal "crystal" -Rigid - rod shaped molecules are aligned even in liquid form.
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12. Because of ionic & covalent-type bonding.
Thermal expansion
Why do ceramics have larger bonding energy?
Critical Properties of Superconductive Materials
Internal magnetic moments
13. 1. Yield = ratio of functional chips to total # of chips - Most yield loss during wafer processing - b/c of complex 2. Reliability - No device has infinite lifetime. Statistical methods to predict expected lifetime - Failure mechanisms: Diffusion reg
Generation of a Magnetic Field - Within a Solid Material
Yield and Reliability
Film Deposition
Generation of a Magnetic Field - Vacuum
14. Wet: isotropic - under cut Dry: ansiotropic - directional
Etching
Soft Magnetic Materials
Conduction & Electron Transport
Charpy or Izod test
15. 1. Impose a compressive surface stress (to suppress surface cracks from growing) - Method 1: shot peening - Method 2: carburizing 2.Remove stress concentrators.
Intrinsic Semiconductors
To improve fatigue life
Influence of Temperature on Magnetic Behavior
How to gage the extent of plastic deformation
16. Dramatic change in impact energy is associated with a change in fracture mode from brittle to ductile.
Plastic Deformation (Metals)
Metals: Resistivity vs. T - Impurities
Film Deposition
Ductile-to-Brittle Transition
17. - Metals that exhibit high ductility - exhibit high toughness. Ceramics are very strong - but have low ductility and low toughness - Polymers are very ductile but are not generally very strong in shear (compared to metals and ceramics). They have low
Coefficient of Thermal Expansion
Stress Intensity values
Bending tests
Slip Bands
18. Diffuse image
Generation of a Magnetic Field - Vacuum
Translucent
Liquid Crystal Displays (LCD's)
Incident Light
19. 1. Metals: Thermal energy puts many electrons into a higher energy state. 2. Energy States: Nearby energy states are accessible by thermal fluctuations.
What do magnetic moments arise from?
Reflection of Light for Metals
Conduction & Electron Transport
Elastic Deformation
20. Becomes harder (more strain) to stretch (elongate)
Iron-Silicon Alloy in Transformer Cores
Work Hardening
Dependence of Heat Capacity on Temperature
Impact - Toughness
21. -> fluorescent light - electron transitions occur randomly - light waves are out of phase with each other.
Soft Magnetic Materials
Stress Intensity values
Incoherent
Brittle Ceramics
22. Occur due to: restrained thermal expansion/contraction -temperature gradients that lead to differential dimensional changes sigma = Thermal Stress
Superconductivity
Thermal Shock Resistance
Thermal Stresses
Luminescence examples
23. This strength parameter is similar in magnitude to a tensile strength. Fracture occurs along the outermost sample edge - which is under a tensile load.
Superconductivity
Modulus of Rupture (MOR)
Two kinds of Reflection
IC Devices: P-N Rectifying Junction
24. Stress concentration at a crack tips
Incoherent
Critical Properties of Superconductive Materials
Griffith Crack Model
Internal magnetic moments
25. A high index of refraction (n value) allows for multiple internal reactions.
Relative Permeability
HB (Brinell Hardness)
Sparkle of Diamonds
Magnetic Storage
26. Hardness is the resistance of a material to deformation by indentation - Useful in quality control - Hardness can provide a qualitative assessment of strength - Hardness cannot be used to quantitatively infer strength or ductility.
Liquid Crystal Displays (LCD's)
Modulus of Rupture (MOR)
Hardness
Valence band
27. Reflectiviy is between 0.90 and 0.95 - Metal surfaces appear shiny - Most of absorbed light is reflected at the same wavelength (NO REFRACTION) - Small fraction of light may be absorbed - Color of reflected light depends on wavelength distribution of
4 Types of Magnetism
Reflection of Light for Metals
Heat Capacity from an Atomic Prospective
True Strain
28. Defines the ability of a material to resist fracture even when a flaw exists - Directly depends on size of flaw and material properties - K(ic) is a materials constant
Thermal expansion
Two ways to measure heat capacity
Brittle Fracture
Stress Intensity Factor
29. Increase temperature - no increase in interatomic separation - no thermal expansion
Force Decomposition
Thermal Expansion: Symmetric curve
Relative Permeability
Internal magnetic moments
30. Measures Hardness 1. psia = 500 x HB 2. MPa = 3.45 x HB
Coherent
Diamagnetic Materials
Insulators
HB (Brinell Hardness)
31. Resistance to plastic deformation of cracking in compression - and better wear properties.
Magnetic Storage
Dependence of Heat Capacity on Temperature
Large Hardness
Electromigration
32. With Increasing temperature - the saturation magnetization diminishes gradually and then abruptly drops to zero at Curie Temperature - Tc.
Generation of a Magnetic Field - Within a Solid Material
Influence of Temperature on Magnetic Behavior
Force Decomposition
M is known as what?
33. Is analogous to toughness.
Impact energy
Brittle Fracture
Etching
Energy States: Insulators and Semiconductors
34. 1. Hard disk drives (granular/perpendicular media) 2. Recording tape (particulate media)
Engineering Fracture Performance
Luminescence examples
Charpy or Izod test
Magnetic Storage Media Types
35. Process by which metal atoms diffuse because of a potential.
Yield and Reliability
Translucent
Hard Magnetic Materials
Electromigration
36. Growth of an oxide layer by the reaction of oxygen with the substrate - Provides dopant masking and device isolation - IC technology uses 1. Thermal grown oxidation (dry) 2. Wet Oxidation 3. Selective Oxidation
Oxidation
Internal magnetic moments
Extrinsic Semiconductors
Yield and Reliability
37. A parallel-plate capacitor involves an insulator - or dielectric - between two metal electrodes. The charge density buildup at the capacitor surface is related to the dielectric constant of the material.
Translucent
Stress Intensity Factor
Insulators
Work Hardening
38. The ability of a material to be rapidly cooled and not fracture
Brittle Fracture
Thermal Shock Resistance
Conduction & Electron Transport
Film Deposition
39. Different orientation of cleavage planes in grains.
Ductile Materials
Why fracture surfaces have faceted texture
Lithography
Griffith Crack Model
40. 1. Ductility- % elongation - % reduction in area - may be of use in metal forming operations (e.g. - stretch forming). This is convenient for mechanical testing - but not very meaningful for most deformation processing. 2. Toughness- Area beneath str
How to gage the extent of plastic deformation
Diamagnetic Materials
Stages of Failure: Ductile Fracture
Response to a Magnetic Field
41. Failure under cyclic stress 1. It can cause part failure - even though (sigma)max < (sigma)c 2. Causes ~90% of mechanical engineering failures.
Scattering
Lithography
Fatigue
Thermal Conductivity
42. (sigma)=K(sigma)^n . K = strength coefficient - n = work hardening rate or strain hardening exponent. Large n value increases strength and hardness.
IC Devices: P-N Rectifying Junction
Holloman Equation
Translucent
Specific Heat
43. Measures impact energy 1. Strike a notched sample with an anvil 2. Measure how far the anvil travels following impact 3. Distance traveled is related to energy required to break the sample 4. Very high rate of loading. Makes materials more "brittle."
Hysteresis and Permanent Magnetization
Force Decomposition
Charpy or Izod test
HB (Brinell Hardness)
44. ...occurs in bcc metals but not in fcc metals.
There is no perfect material?
Where does DBTT occur?
Intergranular Fracture
Relative Permeability
45. Increase temperature - increase in interatomic separation - thermal expansion
The Transistor
Thermal Expansion: Asymmetric curve
Transparent
Griffith Crack Model
46. (sigma)=F/Ai (rho)=(rho)'(1+(epsilon))
Metals: Resistivity vs. T - Impurities
Coefficient of Thermal Expansion
True Stress
Opaque
47. High toughness; material resists crack propagation.
Electrical Conduction
LASER
High impact energy
Plastic Deformation (Metals)
48. 1. Fluorescent Lamp - tungstate or silicate coating on inside of tube emits white light due to UV light generated inside the tube. 2. TV screen - emits light as electron beam is scanned back and forth.
Opacifiers
Translucent
Stress Intensity values
Luminescence examples
49. Liquid polymer at room T - sandwiched between two sheets of glass - coated with transparent - electrically conductive film. - Character forming letters/ numbers etched on the face - Voltage applied disrupts the orientation of the rod- shaped molecule
M is known as what?
Opaque
How an LCD works
Reflectance of Non-Metals
50. Allows you to calculate what happened G=F' x cos(lambda) - F=F' x cos(phi)
Fatigue
Brittle Fracture
Force Decomposition
Why materials fail in service
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