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Engineering Materials
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Subject
:
engineering
Instructions:
Answer 50 questions in 15 minutes.
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Match each statement with the correct term.
Don't refresh. All questions and answers are randomly picked and ordered every time you load a test.
This is a study tool. The 3 wrong answers for each question are randomly chosen from answers to other questions. So, you might find at times the answers obvious, but you will see it re-enforces your understanding as you take the test each time.
1. Dramatic change in impact energy is associated with a change in fracture mode from brittle to ductile.
Opaque
Ductile-to-Brittle Transition
Critical Properties of Superconductive Materials
Impact - Toughness
2. Superconductors expel magnetic fields - This is why a superconductor will float above a magnet.
Two ways to measure heat capacity
To improve fatigue life
Transparent
Meissner Effect
3. With Increasing temperature - the saturation magnetization diminishes gradually and then abruptly drops to zero at Curie Temperature - Tc.
Influence of Temperature on Magnetic Behavior
Liquid Crystal Displays (LCD's)
Incident Light
Response to a Magnetic Field
4. 1. Ductility- % elongation - % reduction in area - may be of use in metal forming operations (e.g. - stretch forming). This is convenient for mechanical testing - but not very meaningful for most deformation processing. 2. Toughness- Area beneath str
Response to a Magnetic Field
How to gage the extent of plastic deformation
Slip Bands
Thermal Stresses
5. Metals are good conductors since their _______is only partially filled.
Valence band
Diamagnetic Materials
Heat Capacity from an Atomic Prospective
Luminescence examples
6. Cracks propagate along grain boundaries.
Intergranular Fracture
Heat Capacity from an Atomic Prospective
Fourier's Law
Generation of a Magnetic Field - Within a Solid Material
7. Occurs at a single pore or other solid by refraction n = 1 for pore (air) n > 1 for the solid - n ~ 1.5 for glass - Scattering effect is maximized by pore/particle size within 400-700 nm range - Reason for Opacity in ceramics - glasses and polymers.
Reflectance of Non-Metals
Metals: Resistivity vs. T - Impurities
Internal magnetic moments
Scattering
8. Growth of an oxide layer by the reaction of oxygen with the substrate - Provides dopant masking and device isolation - IC technology uses 1. Thermal grown oxidation (dry) 2. Wet Oxidation 3. Selective Oxidation
Oxidation
Transparent
Brittle Ceramics
Incoherent
9. 1. Metals: Thermal energy puts many electrons into a higher energy state. 2. Energy States: Nearby energy states are accessible by thermal fluctuations.
Work Hardening
Griffith Crack Model
Conduction & Electron Transport
Domains in Ferromagnetic & Ferrimagnetic Materials
10. Hardness is the resistance of a material to deformation by indentation - Useful in quality control - Hardness can provide a qualitative assessment of strength - Hardness cannot be used to quantitatively infer strength or ductility.
Hysteresis and Permanent Magnetization
High impact energy
Intrinsic Semiconductors
Hardness
11. 1. Impose a compressive surface stress (to suppress surface cracks from growing) - Method 1: shot peening - Method 2: carburizing 2.Remove stress concentrators.
Ductile Materials
Work Hardening
Griffith Crack Model
To improve fatigue life
12. Transmitted light distorts electron clouds - The velocity of light in a material is lower than in a vacuum - Adding large ions to glass decreases the speed of light in the glass - Light can be "bent" (or refracted) as it passes through a transparent
Liquid Crystal Displays (LCD's)
Refraction
Brittle Fracture
Paramagnetic Materials
13. 1. Necking 2. Cavity formation 3. Cavity coalescence to form cracks 4. Crack propagation (growth) 5. Fracture
Electrical Conduction
Stages of Failure: Ductile Fracture
Magnetic Storage
The three modes of crack surface displacement
14. 1. Electron motions 2. The spins on electrons - Net atomic magnetic moment: sum of moments from all electrons.
There is no perfect material?
True Stress
Energy States: Insulators and Semiconductors
What do magnetic moments arise from?
15. A measure of the ease with which a B field can be induced inside a material.
Relative Permeability
Hard Magnetic Materials
Thermal Expansion: Asymmetric curve
Liquid Crystal Displays (LCD's)
16. If a material has ________ - then the field generated by those moments must be added to the induced field.
Internal magnetic moments
Film Deposition
Plastic Deformation (Metals)
Brittle Fracture
17. (sigma)=K(sigma)^n . K = strength coefficient - n = work hardening rate or strain hardening exponent. Large n value increases strength and hardness.
Holloman Equation
Pure Semiconductors: Conductivity vs. T
Oxidation
Internal magnetic moments
18. High toughness; material resists crack propagation.
Modulus of Rupture (MOR)
Ductile Materials
Why materials fail in service
High impact energy
19. Not ALL the light is refracted - SOME is reflected. Materials with a high index of refraction also have high reflectance - High R is bad for lens applications - since this leads to undesirable light losses or interference.
Opacifiers
Energy States: Insulators and Semiconductors
Incident Light
Reflectance of Non-Metals
20. The size of the material changes with a change in temperature - polymers have the largest values
Stress Intensity values
Coefficient of Thermal Expansion
Why materials fail in service
Force Decomposition
21. Elastic means reversible! This is not a permanent deformation.
Plastic Deformation (Metals)
Elastic Deformation
Incoherent
Impact - Toughness
22. Impurities added to the semiconductor that contribute to excess electrons or holes. Doping = intentional impurities.
Extrinsic Semiconductors
Rockwell
Yield and Reliability
Thermal Stresses
23. 1. Insulators: Higher energy states NOT ACCESSIBLE due to gap 2. Semiconductors: Higher energy states separated by a smaller gap.
To improve fatigue life
Energy States: Insulators and Semiconductors
Stress Intensity Factor
LASER
24. Allows flow of electrons in one direction only (useful to convert alternating current to direct current) - Result: no net current flow
IC Devices: P-N Rectifying Junction
High impact energy
Modulus of Rupture (MOR)
Intrinsic Semiconductors
25. As the applied field (H) increases the magnetic domains change shape and size by movement of domain boundaries.
The Transistor
Hard Magnetic Materials
Domains in Ferromagnetic & Ferrimagnetic Materials
Sparkle of Diamonds
26. Measures Hardness 1. psia = 500 x HB 2. MPa = 3.45 x HB
HB (Brinell Hardness)
Incident Light
Force Decomposition
Stress Intensity values
27. The ability of a material to transport heat - Atomic Perspective: Atomic vibrations and free electrons in hotter regions transport energy to cooler regions - Metals have the largest values
Thermal Conductivity
Specific Heat
Work Hardening
Slip Bands
28. Materials change size when temperature is changed
Stages of Failure: Ductile Fracture
Heat Capacity
Transparent
Thermal expansion
29. - The emission of light from a substance due to the absorption of energy. (Could be radiation - mechanical - or chemical energy. Could also be energetic particles.) - Traps and activator levels are produced by impurity additions to the material - Whe
How to gage the extent of plastic deformation
How an LCD works
Work Hardening
Luminescence
30. 1. Tensile (opening) 2. Sliding 3. Tearing
Linewidth
The three modes of crack surface displacement
Two ways to measure heat capacity
Color
31. # of thermally generated electrons = # of holes (broken bonds)
Holloman Equation
Intrinsic Semiconductors
Intergranular Fracture
True Stress
32. Ability to transmit a clear image - The image is clear.
Stages of Failure: Ductile Fracture
Plastic Deformation (Metals)
Lithography
Transparent
33. Occur when lots of dislocations move.
Sparkle of Diamonds
Intrinsic Semiconductors
Slip Bands
Translucent
34. Heat capacity.....- increases with temperature -for solids it reaches a limiting value of 3R
Dependence of Heat Capacity on Temperature
Opacity
Griffith Crack Model
Luminescence
35. Diffuse image
What do magnetic moments arise from?
Two kinds of Reflection
Translucent
Force Decomposition
36. Resistance to plastic deformation of cracking in compression - and better wear properties.
Hard Magnetic Materials
Magnetic Storage
Large Hardness
Shear and Tensile Stress
37. Small Coercivities - Used for electric motors - Example: commercial iron 99.95 Fe
Ductile Materials
Why materials fail in service
Soft Magnetic Materials
HB (Brinell Hardness)
38. Becomes harder (more strain) to stretch (elongate)
Work Hardening
Influence of Temperature on Magnetic Behavior
Intergranular Fracture
Engineering Fracture Performance
39. 1. Data for Pure Silicon - electrical conductivity increases with T - opposite to metals
Electrical Conduction
Pure Semiconductors: Conductivity vs. T
Griffith Crack Model
There is no perfect material?
40. Defines the ability of a material to resist fracture even when a flaw exists - Directly depends on size of flaw and material properties - K(ic) is a materials constant
Stress Intensity Factor
Transgranular Fracture
Brittle Materials
True Stress
41. To build a device - various thin metal or insulating films are grown on top of each other - Evaporation - MBE - Sputtering - CVD (ALD)
Specific Heat
Plastic Deformation (Metals)
Film Deposition
Scattering
42. For a metal - there is no ______ - only reflection
Brittle Fracture
Pure Semiconductors: Conductivity vs. T
Why do ceramics have larger bonding energy?
Refraction
43. The Magnetization of the material - and is essentially the dipole moment per unit volume. It is proportional to the applied field. Xm is the magnetic susceptibility.
True Strain
Impact - Toughness
How an LCD works
M is known as what?
44. Cracks pass through grains - often along specific crystal planes.
Meissner Effect
Metals: Resistivity vs. T - Impurities
Dependence of Heat Capacity on Temperature
Transgranular Fracture
45. A three terminal device that acts like a simple "on-off" switch. (the basis of Integrated Circuits (IC) technology - used in computers - cell phones - automotive control - etc) - If voltage (potential) applied to the "gate" - current flows between th
Energy States: Insulators and Semiconductors
Griffith Crack Model
Reflection of Light for Metals
The Transistor
46. The ability of a material to absorb heat - Quantitatively: The energy required to produce a unit rise in temperature for one mole of a material.
Intergranular Fracture
The three modes of crack surface displacement
Heat Capacity
Relative Permeability
47. Wet: isotropic - under cut Dry: ansiotropic - directional
Slip Bands
Etching
M is known as what?
Refraction
48. Another optical property - Depends on the wavelength of the visible spectrum.
Not severe
Electrical Conduction
Color
Electromigration
49. These materials are relatively unaffected by magnetic fields.
Diamagnetic Materials
Meissner Effect
Reflection of Light for Metals
Paramagnetic Materials
50. Process by which geometric patterns are transferred from a mask (reticle) to a surface of a chip to form the device.
Reflection of Light for Metals
Lithography
Where does DBTT occur?
Specific Heat
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