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Engineering Materials

Subject : engineering
Instructions:
  • Answer 50 questions in 15 minutes.
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  • Match each statement with the correct term.
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This is a study tool. The 3 wrong answers for each question are randomly chosen from answers to other questions. So, you might find at times the answers obvious, but you will see it re-enforces your understanding as you take the test each time.
1. A high index of refraction (n value) allows for multiple internal reactions.






2. If a material has ________ - then the field generated by those moments must be added to the induced field.






3. - A magnetic field is induced in the material B= Magnetic Induction (tesla) inside the material mu= permeability of a solid






4. The ability of a material to transport heat - Atomic Perspective: Atomic vibrations and free electrons in hotter regions transport energy to cooler regions - Metals have the largest values






5. Ohms Law: voltage drop = current * resistance






6. 1. Fluorescent Lamp - tungstate or silicate coating on inside of tube emits white light due to UV light generated inside the tube. 2. TV screen - emits light as electron beam is scanned back and forth.






7. Specular: light reflecting off a mirror (average) - Diffuse: light reflecting off a white wall (local)






8. Energy is stored as atomic vibrations - As temperature increases - the average energy of atomic vibrations increases.






9. - The emission of light from a substance due to the absorption of energy. (Could be radiation - mechanical - or chemical energy. Could also be energetic particles.) - Traps and activator levels are produced by impurity additions to the material - Whe






10. Hardness is the resistance of a material to deformation by indentation - Useful in quality control - Hardness can provide a qualitative assessment of strength - Hardness cannot be used to quantitatively infer strength or ductility.






11. Loss of image transmission - You get no image - There is no light transmission - and therefore reflects - scatters - or absorbs ALL of it. Both mirrors and carbon black are opaque.






12. Increase temperature - no increase in interatomic separation - no thermal expansion






13. ...occurs in bcc metals but not in fcc metals.






14. 1. Insulators: Higher energy states NOT ACCESSIBLE due to gap 2. Semiconductors: Higher energy states separated by a smaller gap.






15. Stress concentration at a crack tips






16. Without passing a current a continually varying magnetic field will cause a current to flow






17. There is always some statistical distribution of flaws or defects.






18. Digitalized data in the form of electrical signals are transferred to and recorded digitally on a magnetic medium (tape or disk) - This transference is accomplished by a recording system that consists of a read/write head - "write" or record data by






19. The size of the material changes with a change in temperature - polymers have the largest values






20. Growth of an oxide layer by the reaction of oxygen with the substrate - Provides dopant masking and device isolation - IC technology uses 1. Thermal grown oxidation (dry) 2. Wet Oxidation 3. Selective Oxidation






21. Small Coercivities - Used for electric motors - Example: commercial iron 99.95 Fe






22. 1. Imperfections increase resistivity - grain boundaries - dislocations - impurity atoms - vacancies 2. Resistivity - increases with temperature - wt% impurity - and %CW






23. Width of smallest feature obtainable on Si surface






24. Process by which metal atoms diffuse because of a potential.






25. Plastic means permanent! When a small load is applied - bonds stretch & planes shear. Then when the load is no longer applied - the planes are still sheared.






26. Resistance to plastic deformation of cracking in compression - and better wear properties.






27. Degree of opacity depends on size and number of particles - Opacity of metals is the result of conduction electrons absorbing photons in the visible range.






28. Different orientation of cleavage planes in grains.






29. Measures Hardness 1. psia = 500 x HB 2. MPa = 3.45 x HB






30. The Magnetization of the material - and is essentially the dipole moment per unit volume. It is proportional to the applied field. Xm is the magnetic susceptibility.






31. 1. Electron motions 2. The spins on electrons - Net atomic magnetic moment: sum of moments from all electrons.






32. Heat capacity.....- increases with temperature -for solids it reaches a limiting value of 3R






33. Large coercivities - Used for permanent magnets - Add particles/voids to inhibit domain wall motion - Example: tungsten steel






34. 1. Data for Pure Silicon - electrical conductivity increases with T - opposite to metals






35. 1. Tensile (opening) 2. Sliding 3. Tearing






36. Is analogous to toughness.






37. Allows you to calculate what happened G=F' x cos(lambda) - F=F' x cos(phi)






38. Undergo extensive plastic deformation prior to failure.






39. Process by which geometric patterns are transferred from a mask (reticle) to a surface of a chip to form the device.






40. Increase temperature - increase in interatomic separation - thermal expansion






41. Dramatic change in impact energy is associated with a change in fracture mode from brittle to ductile.






42. Created by current through a coil N= total number of turns L= length of turns (m) I= current (ampere) H= applied magnetic field (ampere-turns/m) Bo= magnetic flux density in a vacuum (tesla)






43. Emitted light is in phase






44. Cracks propagate along grain boundaries.






45. Rho=F/A - tau=G/A . Depending on what angle the force is applied - and what angle the crystal is at - it takes different amounts of force to induce plastic deformation.






46. Occur when lots of dislocations move.






47. -> fluorescent light - electron transitions occur randomly - light waves are out of phase with each other.






48. The magnetic hysteresis phenomenon: Stage 1: Initial (unmagnetized state) Stage 2: Apply H - align domains Stage 3: Remove H - alignment remains => Permanent magnet Stage 4: Coercivity - Hc negative H needed to demagnitize Stage 5: Apply -H - align d






49. Flaws and Defects - They concentrate stress locally to levels high enough to rupture bonds.






50. Specific heat = energy input/(mass*temperature change)







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