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Engineering Materials

Subject : engineering
Instructions:
  • Answer 50 questions in 15 minutes.
  • If you are not ready to take this test, you can study here.
  • Match each statement with the correct term.
  • Don't refresh. All questions and answers are randomly picked and ordered every time you load a test.

This is a study tool. The 3 wrong answers for each question are randomly chosen from answers to other questions. So, you might find at times the answers obvious, but you will see it re-enforces your understanding as you take the test each time.
1. Cracks pass through grains - often along specific crystal planes.






2. Second phase particles with n > glass.






3. Digitalized data in the form of electrical signals are transferred to and recorded digitally on a magnetic medium (tape or disk) - This transference is accomplished by a recording system that consists of a read/write head - "write" or record data by






4. 1. Impose a compressive surface stress (to suppress surface cracks from growing) - Method 1: shot peening - Method 2: carburizing 2.Remove stress concentrators.






5. They are used to assess properties of ceramics & glasses.






6. 1. Electron motions 2. The spins on electrons - Net atomic magnetic moment: sum of moments from all electrons.






7. Another optical property - Depends on the wavelength of the visible spectrum.






8. Measures Hardness 1. psia = 500 x HB 2. MPa = 3.45 x HB






9. 1. Tensile (opening) 2. Sliding 3. Tearing






10. Wet: isotropic - under cut Dry: ansiotropic - directional






11. Ohms Law: voltage drop = current * resistance






12. Growth of an oxide layer by the reaction of oxygen with the substrate - Provides dopant masking and device isolation - IC technology uses 1. Thermal grown oxidation (dry) 2. Wet Oxidation 3. Selective Oxidation






13. Without passing a current a continually varying magnetic field will cause a current to flow






14. Allows flow of electrons in one direction only (useful to convert alternating current to direct current) - Result: no net current flow






15. Different orientation of cleavage planes in grains.






16. ...occurs in bcc metals but not in fcc metals.






17. 1. Stress-strain behavior is not usually determined via tensile tests 2. Material fails before it yields 3. Bend/flexure tests are often used instead.






18. Occurs at a single pore or other solid by refraction n = 1 for pore (air) n > 1 for the solid - n ~ 1.5 for glass - Scattering effect is maximized by pore/particle size within 400-700 nm range - Reason for Opacity in ceramics - glasses and polymers.






19. (sigma)=K(sigma)^n . K = strength coefficient - n = work hardening rate or strain hardening exponent. Large n value increases strength and hardness.






20. Energy is stored as atomic vibrations - As temperature increases - the average energy of atomic vibrations increases.






21. The magnetic hysteresis phenomenon: Stage 1: Initial (unmagnetized state) Stage 2: Apply H - align domains Stage 3: Remove H - alignment remains => Permanent magnet Stage 4: Coercivity - Hc negative H needed to demagnitize Stage 5: Apply -H - align d






22. The ability of a material to absorb heat - Quantitatively: The energy required to produce a unit rise in temperature for one mole of a material.






23. 1. Fluorescent Lamp - tungstate or silicate coating on inside of tube emits white light due to UV light generated inside the tube. 2. TV screen - emits light as electron beam is scanned back and forth.






24. Not ALL the light is refracted - SOME is reflected. Materials with a high index of refraction also have high reflectance - High R is bad for lens applications - since this leads to undesirable light losses or interference.






25. - Metals that exhibit high ductility - exhibit high toughness. Ceramics are very strong - but have low ductility and low toughness - Polymers are very ductile but are not generally very strong in shear (compared to metals and ceramics). They have low






26. 1. Necking 2. Cavity formation 3. Cavity coalescence to form cracks 4. Crack propagation (growth) 5. Fracture






27. Increase temperature - no increase in interatomic separation - no thermal expansion






28. Typical loading conditions are _____ enough to break all inter-atomic bonds






29. Plastic means permanent! When a small load is applied - bonds stretch & planes shear. Then when the load is no longer applied - the planes are still sheared.






30. Allows you to calculate what happened G=F' x cos(lambda) - F=F' x cos(phi)






31. # of thermally generated electrons = # of holes (broken bonds)






32. 1. Data for Pure Silicon - electrical conductivity increases with T - opposite to metals






33. -> fluorescent light - electron transitions occur randomly - light waves are out of phase with each other.






34. Emitted light is in phase






35. - A magnetic field is induced in the material B= Magnetic Induction (tesla) inside the material mu= permeability of a solid






36. A measure of the ease with which a B field can be induced inside a material.






37. If a material has ________ - then the field generated by those moments must be added to the induced field.






38. High toughness; material resists crack propagation.






39. Stress concentration at a crack tips






40. Hardness is the resistance of a material to deformation by indentation - Useful in quality control - Hardness can provide a qualitative assessment of strength - Hardness cannot be used to quantitatively infer strength or ductility.






41. Resistance to plastic deformation of cracking in compression - and better wear properties.






42. 1. Imperfections increase resistivity - grain boundaries - dislocations - impurity atoms - vacancies 2. Resistivity - increases with temperature - wt% impurity - and %CW






43. Process by which geometric patterns are transferred from a mask (reticle) to a surface of a chip to form the device.






44. Light Amplification by Stimulated Emission of Radiation






45. The ability of a material to be rapidly cooled and not fracture






46. Heat capacity.....- increases with temperature -for solids it reaches a limiting value of 3R






47. The Magnetization of the material - and is essentially the dipole moment per unit volume. It is proportional to the applied field. Xm is the magnetic susceptibility.






48. Found in 26 metals and hundreds of alloys & compounds - Tc= critical temperature = termperature below which material is superconductive.






49. Dramatic change in impact energy is associated with a change in fracture mode from brittle to ductile.






50. Undergo little or no plastic deformation.







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