SUBJECTS
|
BROWSE
|
CAREER CENTER
|
POPULAR
|
JOIN
|
LOGIN
Business Skills
|
Soft Skills
|
Basic Literacy
|
Certifications
About
|
Help
|
Privacy
|
Terms
|
Email
Search
Test your basic knowledge |
Engineering Materials
Start Test
Study First
Subject
:
engineering
Instructions:
Answer 50 questions in 15 minutes.
If you are not ready to take this test, you can
study here
.
Match each statement with the correct term.
Don't refresh. All questions and answers are randomly picked and ordered every time you load a test.
This is a study tool. The 3 wrong answers for each question are randomly chosen from answers to other questions. So, you might find at times the answers obvious, but you will see it re-enforces your understanding as you take the test each time.
1. Flaws and Defects - They concentrate stress locally to levels high enough to rupture bonds.
Opacity
How an LCD works
What do magnetic moments arise from?
Why materials fail in service
2. Transformer cores require soft magnetic materials - which are easily magnetized and de-magnetized - and have high electrical resistivity - Energy losses in transformers could be minimized if their cores were fabricated such that the easy magnetizatio
Thermal Shock Resistance
Refraction
Iron-Silicon Alloy in Transformer Cores
Why do ceramics have larger bonding energy?
3. Energy is stored as atomic vibrations - As temperature increases - the average energy of atomic vibrations increases.
Heat Capacity from an Atomic Prospective
Etching
Valence band
How an LCD works
4. 1. Ability of the material to absorb energy prior to fracture 2. Short term dynamic stressing - Car collisions - Bullets - Athletic equipment 3. This is different than toughness; energy necessary to push a crack (flaw) through a material 4. Useful in
HB (Brinell Hardness)
Relative Permeability
Griffith Crack Model
Impact - Toughness
5. 1. Fluorescent Lamp - tungstate or silicate coating on inside of tube emits white light due to UV light generated inside the tube. 2. TV screen - emits light as electron beam is scanned back and forth.
The Transistor
Lithography
Luminescence examples
Liquid Crystal Displays (LCD's)
6. With Increasing temperature - the saturation magnetization diminishes gradually and then abruptly drops to zero at Curie Temperature - Tc.
Bending tests
Transgranular Fracture
Brittle Fracture
Influence of Temperature on Magnetic Behavior
7. 1. Necking 2. Cavity formation 3. Cavity coalescence to form cracks 4. Crack propagation (growth) 5. Fracture
Stages of Failure: Ductile Fracture
Refraction
Film Deposition
Electrical Conduction
8. Process by which metal atoms diffuse because of a potential.
Electromigration
Pure Semiconductors: Conductivity vs. T
Insulators
Ductile-to-Brittle Transition
9. Process by which geometric patterns are transferred from a mask (reticle) to a surface of a chip to form the device.
Generation of a Magnetic Field - Vacuum
Pure Semiconductors: Conductivity vs. T
Lithography
Impact energy
10. # of thermally generated electrons = # of holes (broken bonds)
Oxidation
Slip Bands
Charpy or Izod test
Intrinsic Semiconductors
11. Dimples on fracture surface correspond to microcavities that initiate crack formation.
Ductile Fracture
Stress Intensity values
Extrinsic Semiconductors
Refraction
12. Second phase particles with n > glass.
Scattering
Not severe
Opacifiers
Opacity
13. (sigma)=F/Ai (rho)=(rho)'(1+(epsilon))
Metals: Resistivity vs. T - Impurities
Dependence of Heat Capacity on Temperature
True Stress
What do magnetic moments arise from?
14. Undergo extensive plastic deformation prior to failure.
Engineering Fracture Performance
Electrical Conduction
Heat Capacity
Ductile Materials
15. 1. Impose a compressive surface stress (to suppress surface cracks from growing) - Method 1: shot peening - Method 2: carburizing 2.Remove stress concentrators.
Thermal Expansion: Symmetric curve
To improve fatigue life
Fourier's Law
Brittle Fracture
16. Impurities added to the semiconductor that contribute to excess electrons or holes. Doping = intentional impurities.
Extrinsic Semiconductors
Incoherent
Large Hardness
Paramagnetic Materials
17. Wet: isotropic - under cut Dry: ansiotropic - directional
How to gage the extent of plastic deformation
Lithography
Etching
Thermal Expansion: Asymmetric curve
18. Superconductors expel magnetic fields - This is why a superconductor will float above a magnet.
Linewidth
Fourier's Law
Meissner Effect
IC Devices: P-N Rectifying Junction
19. 1. Hard disk drives (granular/perpendicular media) 2. Recording tape (particulate media)
Influence of Temperature on Magnetic Behavior
Iron-Silicon Alloy in Transformer Cores
Magnetic Storage Media Types
Luminescence examples
20. Cracks propagate along grain boundaries.
Extrinsic Semiconductors
Two ways to measure heat capacity
Intergranular Fracture
Lithography
21. Elastic means reversible! This is not a permanent deformation.
Meissner Effect
Scattering
Generation of a Magnetic Field - Vacuum
Elastic Deformation
22. Specular: light reflecting off a mirror (average) - Diffuse: light reflecting off a white wall (local)
Thermal Expansion: Asymmetric curve
There is no perfect material?
Two kinds of Reflection
Transparent
23. As the applied field (H) increases the magnetic domains change shape and size by movement of domain boundaries.
Domains in Ferromagnetic & Ferrimagnetic Materials
Incident Light
Rockwell
Specific Heat
24. Undergo little or no plastic deformation.
Large Hardness
LASER
Brittle Materials
Incoherent
25. Hardness is the resistance of a material to deformation by indentation - Useful in quality control - Hardness can provide a qualitative assessment of strength - Hardness cannot be used to quantitatively infer strength or ductility.
There is no perfect material?
Electrical Conduction
Hardness
Heat Capacity from an Atomic Prospective
26. Is reflected - absorbed - scattered - and/or transmitted: Io=It+Ia+Ir+Is
Transgranular Fracture
Superconductivity
Opaque
Incident Light
27. heat flux = -(thermal conductivity)(temperature gradient) - Defines heat transfer by CONDUCTION
Warning
: Invalid argument supplied for foreach() in
/var/www/html/basicversity.com/show_quiz.php
on line
183
28. Loss of image transmission - You get no image - There is no light transmission - and therefore reflects - scatters - or absorbs ALL of it. Both mirrors and carbon black are opaque.
Translucent
Brittle Ceramics
Linewidth
Opaque
29. Width of smallest feature obtainable on Si surface
M is known as what?
Opaque
Linewidth
Thermal Expansion: Symmetric curve
30. ...occurs in bcc metals but not in fcc metals.
Holloman Equation
Luminescence
What do magnetic moments arise from?
Where does DBTT occur?
31. Measures Hardness - No major sample damage - Each scales runs to 130 but only useful in range 20-100 - Minor load is 10 kg - Major load: 60 kg (diamond) - 100 kg (1/16 in. ball) - 150 kg (diamond)
Slip Bands
Rockwell
Bending tests
Opacifiers
32. 1. Diamagnetic (Xm ~ 10^-5) - small and negative magnetic susceptibilities 2. Paramagnetic (Xm ~ 10^-4) - small and positive magnetic susceptibilities 3. Ferromagnetic - large magnetic susceptibilities 4. Ferrimagnetic (Xm as large as 10^6) - large m
Holloman Equation
Large Hardness
Refraction
4 Types of Magnetism
33. Transmitted light distorts electron clouds - The velocity of light in a material is lower than in a vacuum - Adding large ions to glass decreases the speed of light in the glass - Light can be "bent" (or refracted) as it passes through a transparent
Refraction
Shear and Tensile Stress
Incoherent
Intergranular Fracture
34. Occur due to: restrained thermal expansion/contraction -temperature gradients that lead to differential dimensional changes sigma = Thermal Stress
Opacity
Charpy or Izod test
Bending tests
Thermal Stresses
35. No appreciable plastic deformation. The crack propagates very fast; nearly perpendicular to applied stress. Cracks often propagate along specific crystal planes or boundaries.
Fourier's Law
Stress Intensity Factor
Shear and Tensile Stress
Brittle Fracture
36. The ability of a material to absorb heat - Quantitatively: The energy required to produce a unit rise in temperature for one mole of a material.
Holloman Equation
Sparkle of Diamonds
Pure Semiconductors: Conductivity vs. T
Heat Capacity
37. Reflectiviy is between 0.90 and 0.95 - Metal surfaces appear shiny - Most of absorbed light is reflected at the same wavelength (NO REFRACTION) - Small fraction of light may be absorbed - Color of reflected light depends on wavelength distribution of
Metals: Resistivity vs. T - Impurities
Critical Properties of Superconductive Materials
Reflection of Light for Metals
Refraction
38. Typical loading conditions are _____ enough to break all inter-atomic bonds
LASER
Metals: Resistivity vs. T - Impurities
Not severe
Two kinds of Reflection
39. Materials change size when temperature is changed
Hardness
Thermal expansion
Why materials fail in service
Liquid Crystal Displays (LCD's)
40. -> fluorescent light - electron transitions occur randomly - light waves are out of phase with each other.
Stress Intensity Factor
Magnetic Storage Media Types
LASER
Incoherent
41. Light Amplification by Stimulated Emission of Radiation
Impact energy
Translucent
LASER
Stress Intensity Factor
42. Cracks pass through grains - often along specific crystal planes.
Opacifiers
Large Hardness
Brittle Fracture
Transgranular Fracture
43. 1. Ductility- % elongation - % reduction in area - may be of use in metal forming operations (e.g. - stretch forming). This is convenient for mechanical testing - but not very meaningful for most deformation processing. 2. Toughness- Area beneath str
Brittle Fracture
Refraction
Incident Light
How to gage the extent of plastic deformation
44. Created by current through a coil N= total number of turns L= length of turns (m) I= current (ampere) H= applied magnetic field (ampere-turns/m) Bo= magnetic flux density in a vacuum (tesla)
Yield and Reliability
Generation of a Magnetic Field - Vacuum
True Strain
Refraction
45. - A magnetic field is induced in the material B= Magnetic Induction (tesla) inside the material mu= permeability of a solid
Ductile Fracture
Modulus of Rupture (MOR)
Opacity
Generation of a Magnetic Field - Within a Solid Material
46. This strength parameter is similar in magnitude to a tensile strength. Fracture occurs along the outermost sample edge - which is under a tensile load.
Paramagnetic Materials
Bending tests
Modulus of Rupture (MOR)
Incident Light
47. - Metals that exhibit high ductility - exhibit high toughness. Ceramics are very strong - but have low ductility and low toughness - Polymers are very ductile but are not generally very strong in shear (compared to metals and ceramics). They have low
Modulus of Rupture (MOR)
IC Devices: P-N Rectifying Junction
Valence band
Stress Intensity values
48. Allows flow of electrons in one direction only (useful to convert alternating current to direct current) - Result: no net current flow
IC Devices: P-N Rectifying Junction
How to gage the extent of plastic deformation
Reflectance of Non-Metals
Soft Magnetic Materials
49. If a material has ________ - then the field generated by those moments must be added to the induced field.
Internal magnetic moments
Valence band
Intrinsic Semiconductors
Force Decomposition
50. High toughness; material resists crack propagation.
Intergranular Fracture
Reflection of Light for Metals
Opacity
High impact energy