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Engineering Materials

Subject : engineering
Instructions:
  • Answer 50 questions in 15 minutes.
  • If you are not ready to take this test, you can study here.
  • Match each statement with the correct term.
  • Don't refresh. All questions and answers are randomly picked and ordered every time you load a test.

This is a study tool. The 3 wrong answers for each question are randomly chosen from answers to other questions. So, you might find at times the answers obvious, but you will see it re-enforces your understanding as you take the test each time.
1. If a material has ________ - then the field generated by those moments must be added to the induced field.






2. (sigma)=K(sigma)^n . K = strength coefficient - n = work hardening rate or strain hardening exponent. Large n value increases strength and hardness.






3. - The emission of light from a substance due to the absorption of energy. (Could be radiation - mechanical - or chemical energy. Could also be energetic particles.) - Traps and activator levels are produced by impurity additions to the material - Whe






4. Specific heat = energy input/(mass*temperature change)






5. High toughness; material resists crack propagation.






6. Large coercivities - Used for permanent magnets - Add particles/voids to inhibit domain wall motion - Example: tungsten steel






7. Plastic means permanent! When a small load is applied - bonds stretch & planes shear. Then when the load is no longer applied - the planes are still sheared.






8. Width of smallest feature obtainable on Si surface






9. Liquid polymer at room T - sandwiched between two sheets of glass - coated with transparent - electrically conductive film. - Character forming letters/ numbers etched on the face - Voltage applied disrupts the orientation of the rod- shaped molecule






10. 1. General yielding occurs if flaw size a < a(critical) 2. Catastrophic fast fracture occurs if flaw size a > a(critical)






11. 1. Ductility- % elongation - % reduction in area - may be of use in metal forming operations (e.g. - stretch forming). This is convenient for mechanical testing - but not very meaningful for most deformation processing. 2. Toughness- Area beneath str






12. Transmitted light distorts electron clouds - The velocity of light in a material is lower than in a vacuum - Adding large ions to glass decreases the speed of light in the glass - Light can be "bent" (or refracted) as it passes through a transparent






13. Without passing a current a continually varying magnetic field will cause a current to flow






14. Process by which geometric patterns are transferred from a mask (reticle) to a surface of a chip to form the device.






15. Cracks pass through grains - often along specific crystal planes.






16. The ability of a material to be rapidly cooled and not fracture






17. 1. Hard disk drives (granular/perpendicular media) 2. Recording tape (particulate media)






18. These materials are relatively unaffected by magnetic fields.






19. Cracks propagate along grain boundaries.






20. The Magnetization of the material - and is essentially the dipole moment per unit volume. It is proportional to the applied field. Xm is the magnetic susceptibility.






21. Increase temperature - no increase in interatomic separation - no thermal expansion






22. - A magnetic field is induced in the material B= Magnetic Induction (tesla) inside the material mu= permeability of a solid






23. Not ALL the light is refracted - SOME is reflected. Materials with a high index of refraction also have high reflectance - High R is bad for lens applications - since this leads to undesirable light losses or interference.






24. (sigma)=F/Ai (rho)=(rho)'(1+(epsilon))






25. Growth of an oxide layer by the reaction of oxygen with the substrate - Provides dopant masking and device isolation - IC technology uses 1. Thermal grown oxidation (dry) 2. Wet Oxidation 3. Selective Oxidation






26. The ability of a material to absorb heat - Quantitatively: The energy required to produce a unit rise in temperature for one mole of a material.






27. To build a device - various thin metal or insulating films are grown on top of each other - Evaporation - MBE - Sputtering - CVD (ALD)






28. A high index of refraction (n value) allows for multiple internal reactions.






29. Typical loading conditions are _____ enough to break all inter-atomic bonds






30. Flaws and Defects - They concentrate stress locally to levels high enough to rupture bonds.






31. 1. Imperfections increase resistivity - grain boundaries - dislocations - impurity atoms - vacancies 2. Resistivity - increases with temperature - wt% impurity - and %CW






32. heat flux = -(thermal conductivity)(temperature gradient) - Defines heat transfer by CONDUCTION

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33. -> fluorescent light - electron transitions occur randomly - light waves are out of phase with each other.






34. ...occurs in bcc metals but not in fcc metals.






35. Heat capacity.....- increases with temperature -for solids it reaches a limiting value of 3R






36. No appreciable plastic deformation. The crack propagates very fast; nearly perpendicular to applied stress. Cracks often propagate along specific crystal planes or boundaries.






37. Small Coercivities - Used for electric motors - Example: commercial iron 99.95 Fe






38. As the applied field (H) increases the magnetic domains change shape and size by movement of domain boundaries.






39. Process by which metal atoms diffuse because of a potential.






40. 1. Fluorescent Lamp - tungstate or silicate coating on inside of tube emits white light due to UV light generated inside the tube. 2. TV screen - emits light as electron beam is scanned back and forth.






41. With Increasing temperature - the saturation magnetization diminishes gradually and then abruptly drops to zero at Curie Temperature - Tc.






42. Light Amplification by Stimulated Emission of Radiation






43. 1. Stress-strain behavior is not usually determined via tensile tests 2. Material fails before it yields 3. Bend/flexure tests are often used instead.






44. Measures Hardness 1. psia = 500 x HB 2. MPa = 3.45 x HB






45. This strength parameter is similar in magnitude to a tensile strength. Fracture occurs along the outermost sample edge - which is under a tensile load.






46. Digitalized data in the form of electrical signals are transferred to and recorded digitally on a magnetic medium (tape or disk) - This transference is accomplished by a recording system that consists of a read/write head - "write" or record data by






47. Dramatic change in impact energy is associated with a change in fracture mode from brittle to ductile.






48. 1. Electron motions 2. The spins on electrons - Net atomic magnetic moment: sum of moments from all electrons.






49. Stress concentration at a crack tips






50. Rho=F/A - tau=G/A . Depending on what angle the force is applied - and what angle the crystal is at - it takes different amounts of force to induce plastic deformation.