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Engineering Materials

Subject : engineering
Instructions:
  • Answer 50 questions in 15 minutes.
  • If you are not ready to take this test, you can study here.
  • Match each statement with the correct term.
  • Don't refresh. All questions and answers are randomly picked and ordered every time you load a test.

This is a study tool. The 3 wrong answers for each question are randomly chosen from answers to other questions. So, you might find at times the answers obvious, but you will see it re-enforces your understanding as you take the test each time.
1. Measures Hardness 1. psia = 500 x HB 2. MPa = 3.45 x HB






2. 1. Impose a compressive surface stress (to suppress surface cracks from growing) - Method 1: shot peening - Method 2: carburizing 2.Remove stress concentrators.






3. Stress concentration at a crack tips






4. Because of ionic & covalent-type bonding.






5. Measures Hardness - No major sample damage - Each scales runs to 130 but only useful in range 20-100 - Minor load is 10 kg - Major load: 60 kg (diamond) - 100 kg (1/16 in. ball) - 150 kg (diamond)






6. 1. Electron motions 2. The spins on electrons - Net atomic magnetic moment: sum of moments from all electrons.






7. Allows you to calculate what happened G=F' x cos(lambda) - F=F' x cos(phi)






8. With Increasing temperature - the saturation magnetization diminishes gradually and then abruptly drops to zero at Curie Temperature - Tc.






9. The ability of a material to absorb heat - Quantitatively: The energy required to produce a unit rise in temperature for one mole of a material.






10. A measure of the ease with which a B field can be induced inside a material.






11. Failure under cyclic stress 1. It can cause part failure - even though (sigma)max < (sigma)c 2. Causes ~90% of mechanical engineering failures.






12. These materials are "attracted" to magnetic fields.






13. Small Coercivities - Used for electric motors - Example: commercial iron 99.95 Fe






14. - A magnetic field is induced in the material B= Magnetic Induction (tesla) inside the material mu= permeability of a solid






15. If a material has ________ - then the field generated by those moments must be added to the induced field.






16. As the applied field (H) increases the magnetic domains change shape and size by movement of domain boundaries.






17. - The emission of light from a substance due to the absorption of energy. (Could be radiation - mechanical - or chemical energy. Could also be energetic particles.) - Traps and activator levels are produced by impurity additions to the material - Whe






18. Impurities added to the semiconductor that contribute to excess electrons or holes. Doping = intentional impurities.






19. Cracks pass through grains - often along specific crystal planes.






20. Another optical property - Depends on the wavelength of the visible spectrum.






21. 1. General yielding occurs if flaw size a < a(critical) 2. Catastrophic fast fracture occurs if flaw size a > a(critical)






22. Occur due to: restrained thermal expansion/contraction -temperature gradients that lead to differential dimensional changes sigma = Thermal Stress






23. Specific heat = energy input/(mass*temperature change)






24. 1. Stress-strain behavior is not usually determined via tensile tests 2. Material fails before it yields 3. Bend/flexure tests are often used instead.






25. (sigma)=K(sigma)^n . K = strength coefficient - n = work hardening rate or strain hardening exponent. Large n value increases strength and hardness.






26. Increase temperature - no increase in interatomic separation - no thermal expansion






27. 1. Fluorescent Lamp - tungstate or silicate coating on inside of tube emits white light due to UV light generated inside the tube. 2. TV screen - emits light as electron beam is scanned back and forth.






28. Cracks propagate along grain boundaries.






29. 1. Yield = ratio of functional chips to total # of chips - Most yield loss during wafer processing - b/c of complex 2. Reliability - No device has infinite lifetime. Statistical methods to predict expected lifetime - Failure mechanisms: Diffusion reg






30. Superconductors expel magnetic fields - This is why a superconductor will float above a magnet.






31. The Magnetization of the material - and is essentially the dipole moment per unit volume. It is proportional to the applied field. Xm is the magnetic susceptibility.






32. Specular: light reflecting off a mirror (average) - Diffuse: light reflecting off a white wall (local)






33. 1. Insulators: Higher energy states NOT ACCESSIBLE due to gap 2. Semiconductors: Higher energy states separated by a smaller gap.






34. 1. Hard disk drives (granular/perpendicular media) 2. Recording tape (particulate media)






35. A high index of refraction (n value) allows for multiple internal reactions.






36. Liquid polymer at room T - sandwiched between two sheets of glass - coated with transparent - electrically conductive film. - Character forming letters/ numbers etched on the face - Voltage applied disrupts the orientation of the rod- shaped molecule






37. heat flux = -(thermal conductivity)(temperature gradient) - Defines heat transfer by CONDUCTION

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38. Process by which metal atoms diffuse because of a potential.






39. Rho=F/A - tau=G/A . Depending on what angle the force is applied - and what angle the crystal is at - it takes different amounts of force to induce plastic deformation.






40. Occur when lots of dislocations move.






41. Measures impact energy 1. Strike a notched sample with an anvil 2. Measure how far the anvil travels following impact 3. Distance traveled is related to energy required to break the sample 4. Very high rate of loading. Makes materials more "brittle."






42. The ability of a material to be rapidly cooled and not fracture






43. 1. Data for Pure Silicon - electrical conductivity increases with T - opposite to metals






44. Ohms Law: voltage drop = current * resistance






45. Undergo little or no plastic deformation.






46. - Metals that exhibit high ductility - exhibit high toughness. Ceramics are very strong - but have low ductility and low toughness - Polymers are very ductile but are not generally very strong in shear (compared to metals and ceramics). They have low






47. Growing interconnections to connect devices -Low electrical resistance - good adhesion to dielectric insulators.






48. They are used to assess properties of ceramics & glasses.






49. 1. Necking 2. Cavity formation 3. Cavity coalescence to form cracks 4. Crack propagation (growth) 5. Fracture






50. These are liquid crystal polymers- not your normal "crystal" -Rigid - rod shaped molecules are aligned even in liquid form.

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