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Test your basic knowledge |
Engineering Materials
Start Test
Study First
Subject
:
engineering
Instructions:
Answer 50 questions in 15 minutes.
If you are not ready to take this test, you can
study here
.
Match each statement with the correct term.
Don't refresh. All questions and answers are randomly picked and ordered every time you load a test.
This is a study tool. The 3 wrong answers for each question are randomly chosen from answers to other questions. So, you might find at times the answers obvious, but you will see it re-enforces your understanding as you take the test each time.
1. Transmitted light distorts electron clouds - The velocity of light in a material is lower than in a vacuum - Adding large ions to glass decreases the speed of light in the glass - Light can be "bent" (or refracted) as it passes through a transparent
Refraction
Thermal expansion
Holloman Equation
Scattering
2. Because of ionic & covalent-type bonding.
Intergranular Fracture
Ductile-to-Brittle Transition
Stages of Failure: Ductile Fracture
Why do ceramics have larger bonding energy?
3. The ability of a material to transport heat - Atomic Perspective: Atomic vibrations and free electrons in hotter regions transport energy to cooler regions - Metals have the largest values
Hardness
Thermal Conductivity
Large Hardness
Soft Magnetic Materials
4. Heat capacity.....- increases with temperature -for solids it reaches a limiting value of 3R
Dependence of Heat Capacity on Temperature
M is known as what?
Heat Capacity from an Atomic Prospective
Luminescence
5. - Metals that exhibit high ductility - exhibit high toughness. Ceramics are very strong - but have low ductility and low toughness - Polymers are very ductile but are not generally very strong in shear (compared to metals and ceramics). They have low
Heat Capacity
To improve fatigue life
Meissner Effect
Stress Intensity values
6. -> fluorescent light - electron transitions occur randomly - light waves are out of phase with each other.
Magnetic Storage Media Types
Incoherent
HB (Brinell Hardness)
Slip Bands
7. Different orientation of cleavage planes in grains.
Intrinsic Semiconductors
Thermal Shock Resistance
Why fracture surfaces have faceted texture
Insulators
8. 1. Hard disk drives (granular/perpendicular media) 2. Recording tape (particulate media)
Stress Intensity values
Relative Permeability
Response to a Magnetic Field
Magnetic Storage Media Types
9. 1. Impose a compressive surface stress (to suppress surface cracks from growing) - Method 1: shot peening - Method 2: carburizing 2.Remove stress concentrators.
To improve fatigue life
Generation of a Magnetic Field - Within a Solid Material
IC Devices: P-N Rectifying Junction
Luminescence examples
10. Undergo extensive plastic deformation prior to failure.
Hardness
IC Devices: P-N Rectifying Junction
Ductile Materials
Magnetic Storage
11. heat flux = -(thermal conductivity)(temperature gradient) - Defines heat transfer by CONDUCTION
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12. A high index of refraction (n value) allows for multiple internal reactions.
The Transistor
Iron-Silicon Alloy in Transformer Cores
Sparkle of Diamonds
Superconductivity
13. The ability of a material to absorb heat - Quantitatively: The energy required to produce a unit rise in temperature for one mole of a material.
Heat Capacity
Stress Intensity values
The three modes of crack surface displacement
Oxidation
14. If a material has ________ - then the field generated by those moments must be added to the induced field.
Two ways to measure heat capacity
Thermal Conductivity
Dependence of Heat Capacity on Temperature
Internal magnetic moments
15. Width of smallest feature obtainable on Si surface
Plastic Deformation (Metals)
Coefficient of Thermal Expansion
Relative Permeability
Linewidth
16. Loss of image transmission - You get no image - There is no light transmission - and therefore reflects - scatters - or absorbs ALL of it. Both mirrors and carbon black are opaque.
Paramagnetic Materials
Hysteresis and Permanent Magnetization
Opaque
LASER
17. 1. Yield = ratio of functional chips to total # of chips - Most yield loss during wafer processing - b/c of complex 2. Reliability - No device has infinite lifetime. Statistical methods to predict expected lifetime - Failure mechanisms: Diffusion reg
Thermal Expansion: Asymmetric curve
Hard Magnetic Materials
Yield and Reliability
Oxidation
18. Measures impact energy 1. Strike a notched sample with an anvil 2. Measure how far the anvil travels following impact 3. Distance traveled is related to energy required to break the sample 4. Very high rate of loading. Makes materials more "brittle."
Film Deposition
Ductile Materials
Slip Bands
Charpy or Izod test
19. Cracks propagate along grain boundaries.
Intergranular Fracture
Impact energy
Paramagnetic Materials
Heat Capacity
20. Allows flow of electrons in one direction only (useful to convert alternating current to direct current) - Result: no net current flow
Hysteresis and Permanent Magnetization
Impact - Toughness
Work Hardening
IC Devices: P-N Rectifying Junction
21. Ohms Law: voltage drop = current * resistance
Bending tests
Electrical Conduction
HB (Brinell Hardness)
Griffith Crack Model
22. Dramatic change in impact energy is associated with a change in fracture mode from brittle to ductile.
Where does DBTT occur?
Ductile-to-Brittle Transition
Generation of a Magnetic Field - Within a Solid Material
Dependence of Heat Capacity on Temperature
23. - A magnetic field is induced in the material B= Magnetic Induction (tesla) inside the material mu= permeability of a solid
Thermal Conductivity
Generation of a Magnetic Field - Within a Solid Material
Domains in Ferromagnetic & Ferrimagnetic Materials
Heat Capacity
24. Liquid polymer at room T - sandwiched between two sheets of glass - coated with transparent - electrically conductive film. - Character forming letters/ numbers etched on the face - Voltage applied disrupts the orientation of the rod- shaped molecule
How an LCD works
Meissner Effect
Transgranular Fracture
Work Hardening
25. These materials are relatively unaffected by magnetic fields.
Thermal expansion
Incident Light
Diamagnetic Materials
Refraction
26. Specular: light reflecting off a mirror (average) - Diffuse: light reflecting off a white wall (local)
Two kinds of Reflection
Hardness
Impact energy
Translucent
27. Occur due to: restrained thermal expansion/contraction -temperature gradients that lead to differential dimensional changes sigma = Thermal Stress
Thermal expansion
True Strain
Thermal Stresses
Holloman Equation
28. Cp: Heat capacity at constant pressure Cv: Heat capacity at constant volume.
Why materials fail in service
Thermal expansion
Two ways to measure heat capacity
Specific Heat
29. With Increasing temperature - the saturation magnetization diminishes gradually and then abruptly drops to zero at Curie Temperature - Tc.
Influence of Temperature on Magnetic Behavior
The Transistor
Ductile-to-Brittle Transition
Work Hardening
30. Transformer cores require soft magnetic materials - which are easily magnetized and de-magnetized - and have high electrical resistivity - Energy losses in transformers could be minimized if their cores were fabricated such that the easy magnetizatio
Elastic Deformation
Iron-Silicon Alloy in Transformer Cores
Extrinsic Semiconductors
Film Deposition
31. Metals are good conductors since their _______is only partially filled.
Conduction & Electron Transport
Valence band
Intrinsic Semiconductors
Generation of a Magnetic Field - Vacuum
32. Not ALL the light is refracted - SOME is reflected. Materials with a high index of refraction also have high reflectance - High R is bad for lens applications - since this leads to undesirable light losses or interference.
Why materials fail in service
Reflectance of Non-Metals
Rockwell
What do magnetic moments arise from?
33. Another optical property - Depends on the wavelength of the visible spectrum.
Etching
Thermal Conductivity
Opacity
Color
34. Light Amplification by Stimulated Emission of Radiation
LASER
Reflectance of Non-Metals
Elastic Deformation
IC Devices: P-N Rectifying Junction
35. Resistance to plastic deformation of cracking in compression - and better wear properties.
Transparent
Large Hardness
Opacity
The Transistor
36. They are used to assess properties of ceramics & glasses.
Bending tests
Intergranular Fracture
Translucent
Insulators
37. Is analogous to toughness.
Impact energy
There is no perfect material?
Impact - Toughness
Coefficient of Thermal Expansion
38. Growing interconnections to connect devices -Low electrical resistance - good adhesion to dielectric insulators.
Hard Magnetic Materials
Metallization
Opacifiers
Ductile-to-Brittle Transition
39. This strength parameter is similar in magnitude to a tensile strength. Fracture occurs along the outermost sample edge - which is under a tensile load.
Scattering
Translucent
Modulus of Rupture (MOR)
Shear and Tensile Stress
40. Process by which metal atoms diffuse because of a potential.
Electromigration
Brittle Materials
Impact energy
Dependence of Heat Capacity on Temperature
41. Impurities added to the semiconductor that contribute to excess electrons or holes. Doping = intentional impurities.
How to gage the extent of plastic deformation
Heat Capacity from an Atomic Prospective
Extrinsic Semiconductors
Where does DBTT occur?
42. 1. Data for Pure Silicon - electrical conductivity increases with T - opposite to metals
Pure Semiconductors: Conductivity vs. T
Why fracture surfaces have faceted texture
Critical Properties of Superconductive Materials
Where does DBTT occur?
43. These materials are "attracted" to magnetic fields.
Shear and Tensile Stress
Why do ceramics have larger bonding energy?
Paramagnetic Materials
Electrical Conduction
44. Is reflected - absorbed - scattered - and/or transmitted: Io=It+Ia+Ir+Is
Fatigue
Coefficient of Thermal Expansion
Incident Light
Thermal Expansion: Symmetric curve
45. Undergo little or no plastic deformation.
Transgranular Fracture
Thermal Conductivity
Brittle Materials
Two ways to measure heat capacity
46. (sigma)=K(sigma)^n . K = strength coefficient - n = work hardening rate or strain hardening exponent. Large n value increases strength and hardness.
Thermal Expansion: Asymmetric curve
Holloman Equation
Fourier's Law
Magnetic Storage
47. Defines the ability of a material to resist fracture even when a flaw exists - Directly depends on size of flaw and material properties - K(ic) is a materials constant
Stress Intensity Factor
Specific Heat
Impact - Toughness
Soft Magnetic Materials
48. 1. Imperfections increase resistivity - grain boundaries - dislocations - impurity atoms - vacancies 2. Resistivity - increases with temperature - wt% impurity - and %CW
Thermal Expansion: Symmetric curve
Metals: Resistivity vs. T - Impurities
Brittle Fracture
Magnetic Storage
49. Found in 26 metals and hundreds of alloys & compounds - Tc= critical temperature = termperature below which material is superconductive.
Ductile-to-Brittle Transition
Intergranular Fracture
Dependence of Heat Capacity on Temperature
Superconductivity
50. 1. Ductility- % elongation - % reduction in area - may be of use in metal forming operations (e.g. - stretch forming). This is convenient for mechanical testing - but not very meaningful for most deformation processing. 2. Toughness- Area beneath str
How to gage the extent of plastic deformation
Thermal Shock Resistance
Meissner Effect
Heat Capacity from an Atomic Prospective