SUBJECTS
|
BROWSE
|
CAREER CENTER
|
POPULAR
|
JOIN
|
LOGIN
Business Skills
|
Soft Skills
|
Basic Literacy
|
Certifications
About
|
Help
|
Privacy
|
Terms
|
Email
Search
Test your basic knowledge |
Engineering Materials
Start Test
Study First
Subject
:
engineering
Instructions:
Answer 50 questions in 15 minutes.
If you are not ready to take this test, you can
study here
.
Match each statement with the correct term.
Don't refresh. All questions and answers are randomly picked and ordered every time you load a test.
This is a study tool. The 3 wrong answers for each question are randomly chosen from answers to other questions. So, you might find at times the answers obvious, but you will see it re-enforces your understanding as you take the test each time.
1. Ohms Law: voltage drop = current * resistance
Impact energy
Electrical Conduction
LASER
Stress Intensity values
2. Not ALL the light is refracted - SOME is reflected. Materials with a high index of refraction also have high reflectance - High R is bad for lens applications - since this leads to undesirable light losses or interference.
The three modes of crack surface displacement
Domains in Ferromagnetic & Ferrimagnetic Materials
Thermal expansion
Reflectance of Non-Metals
3. Specific heat = energy input/(mass*temperature change)
Generation of a Magnetic Field - Within a Solid Material
Metallization
Influence of Temperature on Magnetic Behavior
Specific Heat
4. # of thermally generated electrons = # of holes (broken bonds)
Electrical Conduction
Why materials fail in service
Intrinsic Semiconductors
Why do ceramics have larger bonding energy?
5. Impurities added to the semiconductor that contribute to excess electrons or holes. Doping = intentional impurities.
Fatigue
High impact energy
Extrinsic Semiconductors
Energy States: Insulators and Semiconductors
6. 1. Impose a compressive surface stress (to suppress surface cracks from growing) - Method 1: shot peening - Method 2: carburizing 2.Remove stress concentrators.
Ductile Fracture
To improve fatigue life
Thermal Conductivity
Heat Capacity from an Atomic Prospective
7. (sigma)=K(sigma)^n . K = strength coefficient - n = work hardening rate or strain hardening exponent. Large n value increases strength and hardness.
Hysteresis and Permanent Magnetization
Coefficient of Thermal Expansion
Holloman Equation
Magnetic Storage Media Types
8. They are used to assess properties of ceramics & glasses.
Magnetic Storage Media Types
Scattering
Refraction
Bending tests
9. With Increasing temperature - the saturation magnetization diminishes gradually and then abruptly drops to zero at Curie Temperature - Tc.
Sparkle of Diamonds
Charpy or Izod test
Influence of Temperature on Magnetic Behavior
Generation of a Magnetic Field - Vacuum
10. Allows flow of electrons in one direction only (useful to convert alternating current to direct current) - Result: no net current flow
IC Devices: P-N Rectifying Junction
Coefficient of Thermal Expansion
Thermal Expansion: Symmetric curve
Brittle Materials
11. Created by current through a coil N= total number of turns L= length of turns (m) I= current (ampere) H= applied magnetic field (ampere-turns/m) Bo= magnetic flux density in a vacuum (tesla)
Generation of a Magnetic Field - Vacuum
Heat Capacity
Sparkle of Diamonds
Refraction
12. Ability to transmit a clear image - The image is clear.
Transparent
Intrinsic Semiconductors
Generation of a Magnetic Field - Within a Solid Material
Electrical Conduction
13. 1. Metals: Thermal energy puts many electrons into a higher energy state. 2. Energy States: Nearby energy states are accessible by thermal fluctuations.
Conduction & Electron Transport
The three modes of crack surface displacement
Color
Rockwell
14. A parallel-plate capacitor involves an insulator - or dielectric - between two metal electrodes. The charge density buildup at the capacitor surface is related to the dielectric constant of the material.
Insulators
M is known as what?
Yield and Reliability
Diamagnetic Materials
15. The size of the material changes with a change in temperature - polymers have the largest values
Brittle Fracture
Coefficient of Thermal Expansion
Refraction
Color
16. Cracks propagate along grain boundaries.
Etching
Impact energy
Intergranular Fracture
Hysteresis and Permanent Magnetization
17. Energy is stored as atomic vibrations - As temperature increases - the average energy of atomic vibrations increases.
Heat Capacity from an Atomic Prospective
Why do ceramics have larger bonding energy?
Plastic Deformation (Metals)
Lithography
18. Diffuse image
Translucent
Opaque
Intrinsic Semiconductors
Transgranular Fracture
19. This strength parameter is similar in magnitude to a tensile strength. Fracture occurs along the outermost sample edge - which is under a tensile load.
Modulus of Rupture (MOR)
Oxidation
Paramagnetic Materials
Work Hardening
20. For a metal - there is no ______ - only reflection
Generation of a Magnetic Field - Within a Solid Material
The Transistor
Refraction
Ductile Materials
21. The Magnetization of the material - and is essentially the dipole moment per unit volume. It is proportional to the applied field. Xm is the magnetic susceptibility.
Stress Intensity Factor
Reflectance of Non-Metals
How an LCD works
M is known as what?
22. Process by which geometric patterns are transferred from a mask (reticle) to a surface of a chip to form the device.
Heat Capacity
Lithography
Incident Light
Stages of Failure: Ductile Fracture
23. Is analogous to toughness.
Why materials fail in service
Elastic Deformation
Paramagnetic Materials
Impact energy
24. Metals are good conductors since their _______is only partially filled.
Valence band
Scattering
Translucent
Influence of Temperature on Magnetic Behavior
25. Becomes harder (more strain) to stretch (elongate)
To improve fatigue life
Work Hardening
Lithography
Iron-Silicon Alloy in Transformer Cores
26. Is reflected - absorbed - scattered - and/or transmitted: Io=It+Ia+Ir+Is
Incident Light
Specific Heat
What do magnetic moments arise from?
Force Decomposition
27. Typical loading conditions are _____ enough to break all inter-atomic bonds
Meissner Effect
Luminescence examples
Engineering Fracture Performance
Not severe
28. Elastic means reversible! This is not a permanent deformation.
Intergranular Fracture
Elastic Deformation
Coherent
Ductile-to-Brittle Transition
29. Growing interconnections to connect devices -Low electrical resistance - good adhesion to dielectric insulators.
Metallization
Work Hardening
Heat Capacity
Why materials fail in service
30. Large coercivities - Used for permanent magnets - Add particles/voids to inhibit domain wall motion - Example: tungsten steel
Superconductivity
Opacifiers
Hard Magnetic Materials
Diamagnetic Materials
31. A three terminal device that acts like a simple "on-off" switch. (the basis of Integrated Circuits (IC) technology - used in computers - cell phones - automotive control - etc) - If voltage (potential) applied to the "gate" - current flows between th
Large Hardness
Oxidation
Engineering Fracture Performance
The Transistor
32. 1. General yielding occurs if flaw size a < a(critical) 2. Catastrophic fast fracture occurs if flaw size a > a(critical)
4 Types of Magnetism
Shear and Tensile Stress
Force Decomposition
Engineering Fracture Performance
33. ...occurs in bcc metals but not in fcc metals.
Not severe
Metallization
Paramagnetic Materials
Where does DBTT occur?
34. Undergo little or no plastic deformation.
Fourier's Law
High impact energy
Pure Semiconductors: Conductivity vs. T
Brittle Materials
35. 1. Data for Pure Silicon - electrical conductivity increases with T - opposite to metals
HB (Brinell Hardness)
Pure Semiconductors: Conductivity vs. T
Fatigue
How an LCD works
36. -> fluorescent light - electron transitions occur randomly - light waves are out of phase with each other.
Incoherent
Slip Bands
Thermal expansion
Generation of a Magnetic Field - Vacuum
37. The ability of a material to absorb heat - Quantitatively: The energy required to produce a unit rise in temperature for one mole of a material.
Heat Capacity
Transgranular Fracture
Luminescence examples
True Stress
38. Process by which metal atoms diffuse because of a potential.
What do magnetic moments arise from?
Magnetic Storage
Holloman Equation
Electromigration
39. Without passing a current a continually varying magnetic field will cause a current to flow
Brittle Materials
Thermal Expansion: Asymmetric curve
Response to a Magnetic Field
Pure Semiconductors: Conductivity vs. T
40. There is always some statistical distribution of flaws or defects.
There is no perfect material?
Response to a Magnetic Field
Magnetic Storage
Ductile Materials
41. Loss of image transmission - You get no image - There is no light transmission - and therefore reflects - scatters - or absorbs ALL of it. Both mirrors and carbon black are opaque.
Intergranular Fracture
How an LCD works
Modulus of Rupture (MOR)
Opaque
42. Increase temperature - increase in interatomic separation - thermal expansion
Thermal Expansion: Asymmetric curve
Why do ceramics have larger bonding energy?
Domains in Ferromagnetic & Ferrimagnetic Materials
Translucent
43. If a material has ________ - then the field generated by those moments must be added to the induced field.
Internal magnetic moments
HB (Brinell Hardness)
Dependence of Heat Capacity on Temperature
IC Devices: P-N Rectifying Junction
44. Wet: isotropic - under cut Dry: ansiotropic - directional
Bending tests
Why do ceramics have larger bonding energy?
Refraction
Etching
45. - Metals that exhibit high ductility - exhibit high toughness. Ceramics are very strong - but have low ductility and low toughness - Polymers are very ductile but are not generally very strong in shear (compared to metals and ceramics). They have low
High impact energy
Stress Intensity values
Why do ceramics have larger bonding energy?
Fourier's Law
46. 1. Tensile (opening) 2. Sliding 3. Tearing
There is no perfect material?
Impact - Toughness
The three modes of crack surface displacement
Lithography
47. Defines the ability of a material to resist fracture even when a flaw exists - Directly depends on size of flaw and material properties - K(ic) is a materials constant
Large Hardness
Two kinds of Reflection
Brittle Fracture
Stress Intensity Factor
48. The ability of a material to transport heat - Atomic Perspective: Atomic vibrations and free electrons in hotter regions transport energy to cooler regions - Metals have the largest values
Specific Heat
Scattering
Internal magnetic moments
Thermal Conductivity
49. Growth of an oxide layer by the reaction of oxygen with the substrate - Provides dopant masking and device isolation - IC technology uses 1. Thermal grown oxidation (dry) 2. Wet Oxidation 3. Selective Oxidation
Stages of Failure: Ductile Fracture
Stress Intensity values
Oxidation
Internal magnetic moments
50. 1. Ductility- % elongation - % reduction in area - may be of use in metal forming operations (e.g. - stretch forming). This is convenient for mechanical testing - but not very meaningful for most deformation processing. 2. Toughness- Area beneath str
Critical Properties of Superconductive Materials
Stages of Failure: Ductile Fracture
How to gage the extent of plastic deformation
Magnetic Storage Media Types