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Engineering Materials

Subject : engineering
Instructions:
  • Answer 50 questions in 15 minutes.
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  • Match each statement with the correct term.
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This is a study tool. The 3 wrong answers for each question are randomly chosen from answers to other questions. So, you might find at times the answers obvious, but you will see it re-enforces your understanding as you take the test each time.
1. Specific heat = energy input/(mass*temperature change)






2. 1. Necking 2. Cavity formation 3. Cavity coalescence to form cracks 4. Crack propagation (growth) 5. Fracture






3. heat flux = -(thermal conductivity)(temperature gradient) - Defines heat transfer by CONDUCTION

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4. The Magnetization of the material - and is essentially the dipole moment per unit volume. It is proportional to the applied field. Xm is the magnetic susceptibility.






5. 1. Stress-strain behavior is not usually determined via tensile tests 2. Material fails before it yields 3. Bend/flexure tests are often used instead.






6. Increase temperature - increase in interatomic separation - thermal expansion






7. Growth of an oxide layer by the reaction of oxygen with the substrate - Provides dopant masking and device isolation - IC technology uses 1. Thermal grown oxidation (dry) 2. Wet Oxidation 3. Selective Oxidation






8. Plastic means permanent! When a small load is applied - bonds stretch & planes shear. Then when the load is no longer applied - the planes are still sheared.






9. Occurs at a single pore or other solid by refraction n = 1 for pore (air) n > 1 for the solid - n ~ 1.5 for glass - Scattering effect is maximized by pore/particle size within 400-700 nm range - Reason for Opacity in ceramics - glasses and polymers.






10. Found in 26 metals and hundreds of alloys & compounds - Tc= critical temperature = termperature below which material is superconductive.






11. 1. Tc= critical temperature- if T>Tc not superconducting 2. Jc= critical current density - if J>Jc not superconducting 3. Hc= critical magnetic field - if H > Hc not superconducting






12. Becomes harder (more strain) to stretch (elongate)






13. No appreciable plastic deformation. The crack propagates very fast; nearly perpendicular to applied stress. Cracks often propagate along specific crystal planes or boundaries.






14. 1. Ductility- % elongation - % reduction in area - may be of use in metal forming operations (e.g. - stretch forming). This is convenient for mechanical testing - but not very meaningful for most deformation processing. 2. Toughness- Area beneath str






15. Light Amplification by Stimulated Emission of Radiation






16. A three terminal device that acts like a simple "on-off" switch. (the basis of Integrated Circuits (IC) technology - used in computers - cell phones - automotive control - etc) - If voltage (potential) applied to the "gate" - current flows between th






17. Undergo extensive plastic deformation prior to failure.






18. Rho=F/A - tau=G/A . Depending on what angle the force is applied - and what angle the crystal is at - it takes different amounts of force to induce plastic deformation.






19. There is always some statistical distribution of flaws or defects.






20. - The emission of light from a substance due to the absorption of energy. (Could be radiation - mechanical - or chemical energy. Could also be energetic particles.) - Traps and activator levels are produced by impurity additions to the material - Whe






21. 1. Yield = ratio of functional chips to total # of chips - Most yield loss during wafer processing - b/c of complex 2. Reliability - No device has infinite lifetime. Statistical methods to predict expected lifetime - Failure mechanisms: Diffusion reg






22. Ability to transmit a clear image - The image is clear.






23. - Metals that exhibit high ductility - exhibit high toughness. Ceramics are very strong - but have low ductility and low toughness - Polymers are very ductile but are not generally very strong in shear (compared to metals and ceramics). They have low






24. (sigma)=K(sigma)^n . K = strength coefficient - n = work hardening rate or strain hardening exponent. Large n value increases strength and hardness.






25. Occur due to: restrained thermal expansion/contraction -temperature gradients that lead to differential dimensional changes sigma = Thermal Stress






26. They are used to assess properties of ceramics & glasses.






27. Large coercivities - Used for permanent magnets - Add particles/voids to inhibit domain wall motion - Example: tungsten steel






28. Liquid polymer at room T - sandwiched between two sheets of glass - coated with transparent - electrically conductive film. - Character forming letters/ numbers etched on the face - Voltage applied disrupts the orientation of the rod- shaped molecule






29. Loss of image transmission - You get no image - There is no light transmission - and therefore reflects - scatters - or absorbs ALL of it. Both mirrors and carbon black are opaque.






30. Sigma=ln(li/lo)






31. Degree of opacity depends on size and number of particles - Opacity of metals is the result of conduction electrons absorbing photons in the visible range.






32. Cp: Heat capacity at constant pressure Cv: Heat capacity at constant volume.






33. 1. Electron motions 2. The spins on electrons - Net atomic magnetic moment: sum of moments from all electrons.






34. The size of the material changes with a change in temperature - polymers have the largest values






35. Measures Hardness 1. psia = 500 x HB 2. MPa = 3.45 x HB






36. Superconductors expel magnetic fields - This is why a superconductor will float above a magnet.






37. Transformer cores require soft magnetic materials - which are easily magnetized and de-magnetized - and have high electrical resistivity - Energy losses in transformers could be minimized if their cores were fabricated such that the easy magnetizatio






38. 1. Impose a compressive surface stress (to suppress surface cracks from growing) - Method 1: shot peening - Method 2: carburizing 2.Remove stress concentrators.






39. Digitalized data in the form of electrical signals are transferred to and recorded digitally on a magnetic medium (tape or disk) - This transference is accomplished by a recording system that consists of a read/write head - "write" or record data by






40. Wet: isotropic - under cut Dry: ansiotropic - directional






41. These materials are "attracted" to magnetic fields.






42. Dimples on fracture surface correspond to microcavities that initiate crack formation.






43. Not ALL the light is refracted - SOME is reflected. Materials with a high index of refraction also have high reflectance - High R is bad for lens applications - since this leads to undesirable light losses or interference.






44. Another optical property - Depends on the wavelength of the visible spectrum.






45. Width of smallest feature obtainable on Si surface






46. Resistance to plastic deformation of cracking in compression - and better wear properties.






47. 1. Tensile (opening) 2. Sliding 3. Tearing






48. As the applied field (H) increases the magnetic domains change shape and size by movement of domain boundaries.






49. Created by current through a coil N= total number of turns L= length of turns (m) I= current (ampere) H= applied magnetic field (ampere-turns/m) Bo= magnetic flux density in a vacuum (tesla)






50. Failure under cyclic stress 1. It can cause part failure - even though (sigma)max < (sigma)c 2. Causes ~90% of mechanical engineering failures.







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