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Engineering Materials

Subject : engineering
Instructions:
  • Answer 50 questions in 15 minutes.
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  • Match each statement with the correct term.
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This is a study tool. The 3 wrong answers for each question are randomly chosen from answers to other questions. So, you might find at times the answers obvious, but you will see it re-enforces your understanding as you take the test each time.
1. The size of the material changes with a change in temperature - polymers have the largest values






2. Process by which geometric patterns are transferred from a mask (reticle) to a surface of a chip to form the device.






3. 1. Stress-strain behavior is not usually determined via tensile tests 2. Material fails before it yields 3. Bend/flexure tests are often used instead.






4. To build a device - various thin metal or insulating films are grown on top of each other - Evaporation - MBE - Sputtering - CVD (ALD)






5. Plastic means permanent! When a small load is applied - bonds stretch & planes shear. Then when the load is no longer applied - the planes are still sheared.






6. The Magnetization of the material - and is essentially the dipole moment per unit volume. It is proportional to the applied field. Xm is the magnetic susceptibility.






7. Heat capacity.....- increases with temperature -for solids it reaches a limiting value of 3R






8. Width of smallest feature obtainable on Si surface






9. 1. Diamagnetic (Xm ~ 10^-5) - small and negative magnetic susceptibilities 2. Paramagnetic (Xm ~ 10^-4) - small and positive magnetic susceptibilities 3. Ferromagnetic - large magnetic susceptibilities 4. Ferrimagnetic (Xm as large as 10^6) - large m






10. heat flux = -(thermal conductivity)(temperature gradient) - Defines heat transfer by CONDUCTION

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11. These are liquid crystal polymers- not your normal "crystal" -Rigid - rod shaped molecules are aligned even in liquid form.

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12. Because of ionic & covalent-type bonding.






13. 1. Yield = ratio of functional chips to total # of chips - Most yield loss during wafer processing - b/c of complex 2. Reliability - No device has infinite lifetime. Statistical methods to predict expected lifetime - Failure mechanisms: Diffusion reg






14. Wet: isotropic - under cut Dry: ansiotropic - directional






15. 1. Impose a compressive surface stress (to suppress surface cracks from growing) - Method 1: shot peening - Method 2: carburizing 2.Remove stress concentrators.






16. Dramatic change in impact energy is associated with a change in fracture mode from brittle to ductile.






17. - Metals that exhibit high ductility - exhibit high toughness. Ceramics are very strong - but have low ductility and low toughness - Polymers are very ductile but are not generally very strong in shear (compared to metals and ceramics). They have low






18. Diffuse image






19. 1. Metals: Thermal energy puts many electrons into a higher energy state. 2. Energy States: Nearby energy states are accessible by thermal fluctuations.






20. Becomes harder (more strain) to stretch (elongate)






21. -> fluorescent light - electron transitions occur randomly - light waves are out of phase with each other.






22. Occur due to: restrained thermal expansion/contraction -temperature gradients that lead to differential dimensional changes sigma = Thermal Stress






23. This strength parameter is similar in magnitude to a tensile strength. Fracture occurs along the outermost sample edge - which is under a tensile load.






24. Stress concentration at a crack tips






25. A high index of refraction (n value) allows for multiple internal reactions.






26. Hardness is the resistance of a material to deformation by indentation - Useful in quality control - Hardness can provide a qualitative assessment of strength - Hardness cannot be used to quantitatively infer strength or ductility.






27. Reflectiviy is between 0.90 and 0.95 - Metal surfaces appear shiny - Most of absorbed light is reflected at the same wavelength (NO REFRACTION) - Small fraction of light may be absorbed - Color of reflected light depends on wavelength distribution of






28. Defines the ability of a material to resist fracture even when a flaw exists - Directly depends on size of flaw and material properties - K(ic) is a materials constant






29. Increase temperature - no increase in interatomic separation - no thermal expansion






30. Measures Hardness 1. psia = 500 x HB 2. MPa = 3.45 x HB






31. Resistance to plastic deformation of cracking in compression - and better wear properties.






32. With Increasing temperature - the saturation magnetization diminishes gradually and then abruptly drops to zero at Curie Temperature - Tc.






33. Is analogous to toughness.






34. 1. Hard disk drives (granular/perpendicular media) 2. Recording tape (particulate media)






35. Process by which metal atoms diffuse because of a potential.






36. Growth of an oxide layer by the reaction of oxygen with the substrate - Provides dopant masking and device isolation - IC technology uses 1. Thermal grown oxidation (dry) 2. Wet Oxidation 3. Selective Oxidation






37. A parallel-plate capacitor involves an insulator - or dielectric - between two metal electrodes. The charge density buildup at the capacitor surface is related to the dielectric constant of the material.






38. The ability of a material to be rapidly cooled and not fracture






39. Different orientation of cleavage planes in grains.






40. 1. Ductility- % elongation - % reduction in area - may be of use in metal forming operations (e.g. - stretch forming). This is convenient for mechanical testing - but not very meaningful for most deformation processing. 2. Toughness- Area beneath str






41. Failure under cyclic stress 1. It can cause part failure - even though (sigma)max < (sigma)c 2. Causes ~90% of mechanical engineering failures.






42. (sigma)=K(sigma)^n . K = strength coefficient - n = work hardening rate or strain hardening exponent. Large n value increases strength and hardness.






43. Measures impact energy 1. Strike a notched sample with an anvil 2. Measure how far the anvil travels following impact 3. Distance traveled is related to energy required to break the sample 4. Very high rate of loading. Makes materials more "brittle."






44. ...occurs in bcc metals but not in fcc metals.






45. Increase temperature - increase in interatomic separation - thermal expansion






46. (sigma)=F/Ai (rho)=(rho)'(1+(epsilon))






47. High toughness; material resists crack propagation.






48. 1. Fluorescent Lamp - tungstate or silicate coating on inside of tube emits white light due to UV light generated inside the tube. 2. TV screen - emits light as electron beam is scanned back and forth.






49. Liquid polymer at room T - sandwiched between two sheets of glass - coated with transparent - electrically conductive film. - Character forming letters/ numbers etched on the face - Voltage applied disrupts the orientation of the rod- shaped molecule






50. Allows you to calculate what happened G=F' x cos(lambda) - F=F' x cos(phi)







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