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Test your basic knowledge |
Engineering Materials
Start Test
Study First
Subject
:
engineering
Instructions:
Answer 50 questions in 15 minutes.
If you are not ready to take this test, you can
study here
.
Match each statement with the correct term.
Don't refresh. All questions and answers are randomly picked and ordered every time you load a test.
This is a study tool. The 3 wrong answers for each question are randomly chosen from answers to other questions. So, you might find at times the answers obvious, but you will see it re-enforces your understanding as you take the test each time.
1. Allows you to calculate what happened G=F' x cos(lambda) - F=F' x cos(phi)
Force Decomposition
Refraction
Relative Permeability
Intrinsic Semiconductors
2. Resistance to plastic deformation of cracking in compression - and better wear properties.
Lithography
Linewidth
Large Hardness
Modulus of Rupture (MOR)
3. Is analogous to toughness.
Refraction
Impact energy
Luminescence examples
Magnetic Storage Media Types
4. Becomes harder (more strain) to stretch (elongate)
Pure Semiconductors: Conductivity vs. T
Valence band
Work Hardening
Reflectance of Non-Metals
5. Increase temperature - no increase in interatomic separation - no thermal expansion
Thermal Expansion: Symmetric curve
Luminescence
4 Types of Magnetism
Superconductivity
6. A measure of the ease with which a B field can be induced inside a material.
Electrical Conduction
Yield and Reliability
True Stress
Relative Permeability
7. Ability to transmit a clear image - The image is clear.
Film Deposition
Transparent
Two kinds of Reflection
Sparkle of Diamonds
8. Second phase particles with n > glass.
Opacifiers
M is known as what?
Heat Capacity from an Atomic Prospective
Color
9. Increase temperature - increase in interatomic separation - thermal expansion
HB (Brinell Hardness)
Two kinds of Reflection
Brittle Ceramics
Thermal Expansion: Asymmetric curve
10. Impurities added to the semiconductor that contribute to excess electrons or holes. Doping = intentional impurities.
Generation of a Magnetic Field - Within a Solid Material
Intrinsic Semiconductors
IC Devices: P-N Rectifying Junction
Extrinsic Semiconductors
11. # of thermally generated electrons = # of holes (broken bonds)
Sparkle of Diamonds
Intrinsic Semiconductors
Dependence of Heat Capacity on Temperature
High impact energy
12. Ohms Law: voltage drop = current * resistance
Two kinds of Reflection
Hardness
Two ways to measure heat capacity
Electrical Conduction
13. Measures Hardness 1. psia = 500 x HB 2. MPa = 3.45 x HB
Domains in Ferromagnetic & Ferrimagnetic Materials
HB (Brinell Hardness)
Where does DBTT occur?
Not severe
14. Occur due to: restrained thermal expansion/contraction -temperature gradients that lead to differential dimensional changes sigma = Thermal Stress
Luminescence examples
Thermal Stresses
How an LCD works
Diamagnetic Materials
15. 1. Electron motions 2. The spins on electrons - Net atomic magnetic moment: sum of moments from all electrons.
Extrinsic Semiconductors
Brittle Materials
Elastic Deformation
What do magnetic moments arise from?
16. ...occurs in bcc metals but not in fcc metals.
Fatigue
Incoherent
Where does DBTT occur?
Internal magnetic moments
17. 1. Fluorescent Lamp - tungstate or silicate coating on inside of tube emits white light due to UV light generated inside the tube. 2. TV screen - emits light as electron beam is scanned back and forth.
Domains in Ferromagnetic & Ferrimagnetic Materials
Holloman Equation
Electrical Conduction
Luminescence examples
18. These are liquid crystal polymers- not your normal "crystal" -Rigid - rod shaped molecules are aligned even in liquid form.
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19. Reflectiviy is between 0.90 and 0.95 - Metal surfaces appear shiny - Most of absorbed light is reflected at the same wavelength (NO REFRACTION) - Small fraction of light may be absorbed - Color of reflected light depends on wavelength distribution of
Conduction & Electron Transport
Reflection of Light for Metals
Shear and Tensile Stress
Dependence of Heat Capacity on Temperature
20. Heat capacity.....- increases with temperature -for solids it reaches a limiting value of 3R
To improve fatigue life
Translucent
Dependence of Heat Capacity on Temperature
Specific Heat
21. Sigma=ln(li/lo)
Meissner Effect
Film Deposition
True Strain
Impact energy
22. The size of the material changes with a change in temperature - polymers have the largest values
Sparkle of Diamonds
Oxidation
Coefficient of Thermal Expansion
Yield and Reliability
23. Dramatic change in impact energy is associated with a change in fracture mode from brittle to ductile.
Coherent
There is no perfect material?
Force Decomposition
Ductile-to-Brittle Transition
24. Allows flow of electrons in one direction only (useful to convert alternating current to direct current) - Result: no net current flow
Response to a Magnetic Field
IC Devices: P-N Rectifying Junction
Translucent
Holloman Equation
25. Superconductors expel magnetic fields - This is why a superconductor will float above a magnet.
Coefficient of Thermal Expansion
Meissner Effect
Impact - Toughness
Intrinsic Semiconductors
26. Large coercivities - Used for permanent magnets - Add particles/voids to inhibit domain wall motion - Example: tungsten steel
Hard Magnetic Materials
HB (Brinell Hardness)
Thermal Stresses
What do magnetic moments arise from?
27. 1. Diamagnetic (Xm ~ 10^-5) - small and negative magnetic susceptibilities 2. Paramagnetic (Xm ~ 10^-4) - small and positive magnetic susceptibilities 3. Ferromagnetic - large magnetic susceptibilities 4. Ferrimagnetic (Xm as large as 10^6) - large m
Transgranular Fracture
Reflection of Light for Metals
Refraction
4 Types of Magnetism
28. The ability of a material to absorb heat - Quantitatively: The energy required to produce a unit rise in temperature for one mole of a material.
Metals: Resistivity vs. T - Impurities
Valence band
Heat Capacity
True Stress
29. This strength parameter is similar in magnitude to a tensile strength. Fracture occurs along the outermost sample edge - which is under a tensile load.
Modulus of Rupture (MOR)
Valence band
Sparkle of Diamonds
Ductile Fracture
30. High toughness; material resists crack propagation.
Domains in Ferromagnetic & Ferrimagnetic Materials
Coefficient of Thermal Expansion
High impact energy
Hardness
31. 1. Tensile (opening) 2. Sliding 3. Tearing
The three modes of crack surface displacement
Reflectance of Non-Metals
Why do ceramics have larger bonding energy?
Influence of Temperature on Magnetic Behavior
32. There is always some statistical distribution of flaws or defects.
Engineering Fracture Performance
There is no perfect material?
High impact energy
Plastic Deformation (Metals)
33. Light Amplification by Stimulated Emission of Radiation
Bending tests
Impact energy
Stress Intensity values
LASER
34. Measures impact energy 1. Strike a notched sample with an anvil 2. Measure how far the anvil travels following impact 3. Distance traveled is related to energy required to break the sample 4. Very high rate of loading. Makes materials more "brittle."
Yield and Reliability
Thermal expansion
Diamagnetic Materials
Charpy or Izod test
35. Dimples on fracture surface correspond to microcavities that initiate crack formation.
Specific Heat
Ductile Fracture
How to gage the extent of plastic deformation
Insulators
36. (sigma)=K(sigma)^n . K = strength coefficient - n = work hardening rate or strain hardening exponent. Large n value increases strength and hardness.
Holloman Equation
Plastic Deformation (Metals)
Slip Bands
Elastic Deformation
37. Not ALL the light is refracted - SOME is reflected. Materials with a high index of refraction also have high reflectance - High R is bad for lens applications - since this leads to undesirable light losses or interference.
Force Decomposition
Why fracture surfaces have faceted texture
Griffith Crack Model
Reflectance of Non-Metals
38. These materials are relatively unaffected by magnetic fields.
Diamagnetic Materials
Opacifiers
Shear and Tensile Stress
Reflectance of Non-Metals
39. Liquid polymer at room T - sandwiched between two sheets of glass - coated with transparent - electrically conductive film. - Character forming letters/ numbers etched on the face - Voltage applied disrupts the orientation of the rod- shaped molecule
Fourier's Law
Superconductivity
How an LCD works
Where does DBTT occur?
40. -> fluorescent light - electron transitions occur randomly - light waves are out of phase with each other.
Griffith Crack Model
Incoherent
How to gage the extent of plastic deformation
Rockwell
41. 1. Yield = ratio of functional chips to total # of chips - Most yield loss during wafer processing - b/c of complex 2. Reliability - No device has infinite lifetime. Statistical methods to predict expected lifetime - Failure mechanisms: Diffusion reg
Yield and Reliability
Coefficient of Thermal Expansion
Hardness
High impact energy
42. Undergo extensive plastic deformation prior to failure.
Ductile Materials
True Strain
Electromigration
Two kinds of Reflection
43. For a metal - there is no ______ - only reflection
Slip Bands
4 Types of Magnetism
Translucent
Refraction
44. Flaws and Defects - They concentrate stress locally to levels high enough to rupture bonds.
Why materials fail in service
Heat Capacity from an Atomic Prospective
Luminescence examples
Refraction
45. Undergo little or no plastic deformation.
Critical Properties of Superconductive Materials
Not severe
Brittle Materials
Plastic Deformation (Metals)
46. Process by which geometric patterns are transferred from a mask (reticle) to a surface of a chip to form the device.
Hardness
Diamagnetic Materials
Lithography
Insulators
47. A parallel-plate capacitor involves an insulator - or dielectric - between two metal electrodes. The charge density buildup at the capacitor surface is related to the dielectric constant of the material.
Linewidth
Large Hardness
Insulators
Stress Intensity Factor
48. These materials are "attracted" to magnetic fields.
Ductile Materials
Thermal Expansion: Asymmetric curve
Opacity
Paramagnetic Materials
49. 1. Hard disk drives (granular/perpendicular media) 2. Recording tape (particulate media)
Hysteresis and Permanent Magnetization
Charpy or Izod test
Iron-Silicon Alloy in Transformer Cores
Magnetic Storage Media Types
50. Specific heat = energy input/(mass*temperature change)
Intrinsic Semiconductors
Why do ceramics have larger bonding energy?
Specific Heat
Hysteresis and Permanent Magnetization