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Test your basic knowledge |
Engineering Materials
Start Test
Study First
Subject
:
engineering
Instructions:
Answer 50 questions in 15 minutes.
If you are not ready to take this test, you can
study here
.
Match each statement with the correct term.
Don't refresh. All questions and answers are randomly picked and ordered every time you load a test.
This is a study tool. The 3 wrong answers for each question are randomly chosen from answers to other questions. So, you might find at times the answers obvious, but you will see it re-enforces your understanding as you take the test each time.
1. Occur when lots of dislocations move.
Sparkle of Diamonds
Charpy or Izod test
Specific Heat
Slip Bands
2. Resistance to plastic deformation of cracking in compression - and better wear properties.
Large Hardness
Two kinds of Reflection
Generation of a Magnetic Field - Vacuum
Coefficient of Thermal Expansion
3. To build a device - various thin metal or insulating films are grown on top of each other - Evaporation - MBE - Sputtering - CVD (ALD)
Superconductivity
Film Deposition
Linewidth
Force Decomposition
4. Becomes harder (more strain) to stretch (elongate)
Color
Two ways to measure heat capacity
Work Hardening
IC Devices: P-N Rectifying Junction
5. 1. General yielding occurs if flaw size a < a(critical) 2. Catastrophic fast fracture occurs if flaw size a > a(critical)
Magnetic Storage Media Types
Magnetic Storage
Superconductivity
Engineering Fracture Performance
6. Different orientation of cleavage planes in grains.
Stages of Failure: Ductile Fracture
Modulus of Rupture (MOR)
Why fracture surfaces have faceted texture
The three modes of crack surface displacement
7. Diffuse image
Shear and Tensile Stress
There is no perfect material?
Translucent
Stress Intensity values
8. Digitalized data in the form of electrical signals are transferred to and recorded digitally on a magnetic medium (tape or disk) - This transference is accomplished by a recording system that consists of a read/write head - "write" or record data by
Meissner Effect
Holloman Equation
Magnetic Storage
LASER
9. There is always some statistical distribution of flaws or defects.
True Stress
M is known as what?
Ductile Materials
There is no perfect material?
10. Plastic means permanent! When a small load is applied - bonds stretch & planes shear. Then when the load is no longer applied - the planes are still sheared.
Liquid Crystal Displays (LCD's)
Plastic Deformation (Metals)
Modulus of Rupture (MOR)
IC Devices: P-N Rectifying Junction
11. A three terminal device that acts like a simple "on-off" switch. (the basis of Integrated Circuits (IC) technology - used in computers - cell phones - automotive control - etc) - If voltage (potential) applied to the "gate" - current flows between th
Color
Brittle Ceramics
The Transistor
Opaque
12. Typical loading conditions are _____ enough to break all inter-atomic bonds
Magnetic Storage
Specific Heat
Not severe
Superconductivity
13. The Magnetization of the material - and is essentially the dipole moment per unit volume. It is proportional to the applied field. Xm is the magnetic susceptibility.
Holloman Equation
Influence of Temperature on Magnetic Behavior
True Stress
M is known as what?
14. 1. Electron motions 2. The spins on electrons - Net atomic magnetic moment: sum of moments from all electrons.
M is known as what?
What do magnetic moments arise from?
Hard Magnetic Materials
Film Deposition
15. Reflectiviy is between 0.90 and 0.95 - Metal surfaces appear shiny - Most of absorbed light is reflected at the same wavelength (NO REFRACTION) - Small fraction of light may be absorbed - Color of reflected light depends on wavelength distribution of
Linewidth
Transgranular Fracture
Domains in Ferromagnetic & Ferrimagnetic Materials
Reflection of Light for Metals
16. No appreciable plastic deformation. The crack propagates very fast; nearly perpendicular to applied stress. Cracks often propagate along specific crystal planes or boundaries.
Oxidation
Brittle Fracture
Heat Capacity
Refraction
17. A high index of refraction (n value) allows for multiple internal reactions.
Generation of a Magnetic Field - Within a Solid Material
Sparkle of Diamonds
Stress Intensity Factor
Meissner Effect
18. Elastic means reversible! This is not a permanent deformation.
Soft Magnetic Materials
Charpy or Izod test
Transgranular Fracture
Elastic Deformation
19. Growth of an oxide layer by the reaction of oxygen with the substrate - Provides dopant masking and device isolation - IC technology uses 1. Thermal grown oxidation (dry) 2. Wet Oxidation 3. Selective Oxidation
Opaque
The three modes of crack surface displacement
Why do ceramics have larger bonding energy?
Oxidation
20. heat flux = -(thermal conductivity)(temperature gradient) - Defines heat transfer by CONDUCTION
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21. Ability to transmit a clear image - The image is clear.
Generation of a Magnetic Field - Vacuum
Griffith Crack Model
Transparent
Color
22. Increase temperature - no increase in interatomic separation - no thermal expansion
Thermal Expansion: Symmetric curve
Heat Capacity from an Atomic Prospective
Bending tests
Metals: Resistivity vs. T - Impurities
23. Energy is stored as atomic vibrations - As temperature increases - the average energy of atomic vibrations increases.
Heat Capacity from an Atomic Prospective
Soft Magnetic Materials
Response to a Magnetic Field
Rockwell
24. Wet: isotropic - under cut Dry: ansiotropic - directional
Elastic Deformation
Transparent
The Transistor
Etching
25. Large coercivities - Used for permanent magnets - Add particles/voids to inhibit domain wall motion - Example: tungsten steel
Generation of a Magnetic Field - Within a Solid Material
Hard Magnetic Materials
Translucent
Holloman Equation
26. -> fluorescent light - electron transitions occur randomly - light waves are out of phase with each other.
Incoherent
Soft Magnetic Materials
Where does DBTT occur?
How to gage the extent of plastic deformation
27. Ohms Law: voltage drop = current * resistance
Conduction & Electron Transport
Electrical Conduction
Thermal Stresses
Thermal Expansion: Asymmetric curve
28. Occur due to: restrained thermal expansion/contraction -temperature gradients that lead to differential dimensional changes sigma = Thermal Stress
Intrinsic Semiconductors
Where does DBTT occur?
Thermal Stresses
Intergranular Fracture
29. The ability of a material to transport heat - Atomic Perspective: Atomic vibrations and free electrons in hotter regions transport energy to cooler regions - Metals have the largest values
Brittle Fracture
Ductile Materials
Thermal Conductivity
Translucent
30. Small Coercivities - Used for electric motors - Example: commercial iron 99.95 Fe
Incoherent
Magnetic Storage
Soft Magnetic Materials
Intrinsic Semiconductors
31. Measures Hardness 1. psia = 500 x HB 2. MPa = 3.45 x HB
Transgranular Fracture
Influence of Temperature on Magnetic Behavior
HB (Brinell Hardness)
Shear and Tensile Stress
32. Defines the ability of a material to resist fracture even when a flaw exists - Directly depends on size of flaw and material properties - K(ic) is a materials constant
Oxidation
Meissner Effect
Stress Intensity Factor
Magnetic Storage Media Types
33. 1. Diamagnetic (Xm ~ 10^-5) - small and negative magnetic susceptibilities 2. Paramagnetic (Xm ~ 10^-4) - small and positive magnetic susceptibilities 3. Ferromagnetic - large magnetic susceptibilities 4. Ferrimagnetic (Xm as large as 10^6) - large m
Ductile Fracture
Bending tests
4 Types of Magnetism
Energy States: Insulators and Semiconductors
34. 1. Ability of the material to absorb energy prior to fracture 2. Short term dynamic stressing - Car collisions - Bullets - Athletic equipment 3. This is different than toughness; energy necessary to push a crack (flaw) through a material 4. Useful in
Influence of Temperature on Magnetic Behavior
Response to a Magnetic Field
Impact - Toughness
Two kinds of Reflection
35. A parallel-plate capacitor involves an insulator - or dielectric - between two metal electrodes. The charge density buildup at the capacitor surface is related to the dielectric constant of the material.
Translucent
Thermal Stresses
Insulators
Valence band
36. High toughness; material resists crack propagation.
Response to a Magnetic Field
Thermal Conductivity
High impact energy
Conduction & Electron Transport
37. 1. Tc= critical temperature- if T>Tc not superconducting 2. Jc= critical current density - if J>Jc not superconducting 3. Hc= critical magnetic field - if H > Hc not superconducting
Reflectance of Non-Metals
Metallization
Critical Properties of Superconductive Materials
True Strain
38. Measures impact energy 1. Strike a notched sample with an anvil 2. Measure how far the anvil travels following impact 3. Distance traveled is related to energy required to break the sample 4. Very high rate of loading. Makes materials more "brittle."
Metals: Resistivity vs. T - Impurities
Charpy or Izod test
Shear and Tensile Stress
Superconductivity
39. 1. Necking 2. Cavity formation 3. Cavity coalescence to form cracks 4. Crack propagation (growth) 5. Fracture
Opacity
Reflectance of Non-Metals
Refraction
Stages of Failure: Ductile Fracture
40. Is reflected - absorbed - scattered - and/or transmitted: Io=It+Ia+Ir+Is
Two ways to measure heat capacity
Why fracture surfaces have faceted texture
Incident Light
Ductile Materials
41. Heat capacity.....- increases with temperature -for solids it reaches a limiting value of 3R
Specific Heat
The three modes of crack surface displacement
Dependence of Heat Capacity on Temperature
Thermal expansion
42. # of thermally generated electrons = # of holes (broken bonds)
Ductile Fracture
Brittle Fracture
Extrinsic Semiconductors
Intrinsic Semiconductors
43. Degree of opacity depends on size and number of particles - Opacity of metals is the result of conduction electrons absorbing photons in the visible range.
Scattering
Linewidth
Thermal Stresses
Opacity
44. Another optical property - Depends on the wavelength of the visible spectrum.
Film Deposition
Luminescence examples
Color
To improve fatigue life
45. 1. Impose a compressive surface stress (to suppress surface cracks from growing) - Method 1: shot peening - Method 2: carburizing 2.Remove stress concentrators.
To improve fatigue life
Two kinds of Reflection
Extrinsic Semiconductors
There is no perfect material?
46. These are liquid crystal polymers- not your normal "crystal" -Rigid - rod shaped molecules are aligned even in liquid form.
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47. Created by current through a coil N= total number of turns L= length of turns (m) I= current (ampere) H= applied magnetic field (ampere-turns/m) Bo= magnetic flux density in a vacuum (tesla)
Intrinsic Semiconductors
Generation of a Magnetic Field - Vacuum
Color
Thermal Conductivity
48. 1. Tensile (opening) 2. Sliding 3. Tearing
Intrinsic Semiconductors
To improve fatigue life
The three modes of crack surface displacement
Energy States: Insulators and Semiconductors
49. A measure of the ease with which a B field can be induced inside a material.
Relative Permeability
Metallization
Superconductivity
Yield and Reliability
50. Process by which geometric patterns are transferred from a mask (reticle) to a surface of a chip to form the device.
Film Deposition
Diamagnetic Materials
Thermal Expansion: Symmetric curve
Lithography