Test your basic knowledge |

Engineering Materials

Subject : engineering
Instructions:
  • Answer 50 questions in 15 minutes.
  • If you are not ready to take this test, you can study here.
  • Match each statement with the correct term.
  • Don't refresh. All questions and answers are randomly picked and ordered every time you load a test.

This is a study tool. The 3 wrong answers for each question are randomly chosen from answers to other questions. So, you might find at times the answers obvious, but you will see it re-enforces your understanding as you take the test each time.
1. The ability of a material to be rapidly cooled and not fracture






2. The ability of a material to absorb heat - Quantitatively: The energy required to produce a unit rise in temperature for one mole of a material.






3. Superconductors expel magnetic fields - This is why a superconductor will float above a magnet.






4. Stress concentration at a crack tips






5. Plastic means permanent! When a small load is applied - bonds stretch & planes shear. Then when the load is no longer applied - the planes are still sheared.






6. 1. Yield = ratio of functional chips to total # of chips - Most yield loss during wafer processing - b/c of complex 2. Reliability - No device has infinite lifetime. Statistical methods to predict expected lifetime - Failure mechanisms: Diffusion reg






7. (sigma)=F/Ai (rho)=(rho)'(1+(epsilon))






8. Increase temperature - no increase in interatomic separation - no thermal expansion






9. Small Coercivities - Used for electric motors - Example: commercial iron 99.95 Fe






10. (sigma)=K(sigma)^n . K = strength coefficient - n = work hardening rate or strain hardening exponent. Large n value increases strength and hardness.






11. With Increasing temperature - the saturation magnetization diminishes gradually and then abruptly drops to zero at Curie Temperature - Tc.






12. A parallel-plate capacitor involves an insulator - or dielectric - between two metal electrodes. The charge density buildup at the capacitor surface is related to the dielectric constant of the material.






13. Specific heat = energy input/(mass*temperature change)






14. Second phase particles with n > glass.






15. Emitted light is in phase






16. A measure of the ease with which a B field can be induced inside a material.






17. Measures Hardness - No major sample damage - Each scales runs to 130 but only useful in range 20-100 - Minor load is 10 kg - Major load: 60 kg (diamond) - 100 kg (1/16 in. ball) - 150 kg (diamond)






18. Defines the ability of a material to resist fracture even when a flaw exists - Directly depends on size of flaw and material properties - K(ic) is a materials constant






19. Diffuse image






20. For a metal - there is no ______ - only reflection






21. The magnetic hysteresis phenomenon: Stage 1: Initial (unmagnetized state) Stage 2: Apply H - align domains Stage 3: Remove H - alignment remains => Permanent magnet Stage 4: Coercivity - Hc negative H needed to demagnitize Stage 5: Apply -H - align d






22. Allows flow of electrons in one direction only (useful to convert alternating current to direct current) - Result: no net current flow






23. A three terminal device that acts like a simple "on-off" switch. (the basis of Integrated Circuits (IC) technology - used in computers - cell phones - automotive control - etc) - If voltage (potential) applied to the "gate" - current flows between th






24. Specular: light reflecting off a mirror (average) - Diffuse: light reflecting off a white wall (local)






25. Different orientation of cleavage planes in grains.






26. - Metals that exhibit high ductility - exhibit high toughness. Ceramics are very strong - but have low ductility and low toughness - Polymers are very ductile but are not generally very strong in shear (compared to metals and ceramics). They have low






27. This strength parameter is similar in magnitude to a tensile strength. Fracture occurs along the outermost sample edge - which is under a tensile load.






28. 1. Hard disk drives (granular/perpendicular media) 2. Recording tape (particulate media)






29. There is always some statistical distribution of flaws or defects.






30. The size of the material changes with a change in temperature - polymers have the largest values






31. A high index of refraction (n value) allows for multiple internal reactions.






32. Another optical property - Depends on the wavelength of the visible spectrum.






33. Typical loading conditions are _____ enough to break all inter-atomic bonds






34. # of thermally generated electrons = # of holes (broken bonds)






35. 1. Metals: Thermal energy puts many electrons into a higher energy state. 2. Energy States: Nearby energy states are accessible by thermal fluctuations.






36. Elastic means reversible! This is not a permanent deformation.






37. Is analogous to toughness.






38. Undergo extensive plastic deformation prior to failure.






39. Process by which geometric patterns are transferred from a mask (reticle) to a surface of a chip to form the device.






40. - The emission of light from a substance due to the absorption of energy. (Could be radiation - mechanical - or chemical energy. Could also be energetic particles.) - Traps and activator levels are produced by impurity additions to the material - Whe






41. Because of ionic & covalent-type bonding.






42. 1. Tensile (opening) 2. Sliding 3. Tearing






43. Undergo little or no plastic deformation.






44. The ability of a material to transport heat - Atomic Perspective: Atomic vibrations and free electrons in hotter regions transport energy to cooler regions - Metals have the largest values






45. Dramatic change in impact energy is associated with a change in fracture mode from brittle to ductile.






46. Transformer cores require soft magnetic materials - which are easily magnetized and de-magnetized - and have high electrical resistivity - Energy losses in transformers could be minimized if their cores were fabricated such that the easy magnetizatio






47. Measures Hardness 1. psia = 500 x HB 2. MPa = 3.45 x HB






48. Width of smallest feature obtainable on Si surface






49. Growth of an oxide layer by the reaction of oxygen with the substrate - Provides dopant masking and device isolation - IC technology uses 1. Thermal grown oxidation (dry) 2. Wet Oxidation 3. Selective Oxidation






50. Is reflected - absorbed - scattered - and/or transmitted: Io=It+Ia+Ir+Is






Can you answer 50 questions in 15 minutes?



Let me suggest you:

Browse all subjects

Browse all tests

Most popular tests



Major Subjects

Tests & Exams


AP
CLEP
DSST
GRE
SAT
GMAT

Browse all subjects

Browse all tests

Most popular tests