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Engineering Materials

Subject : engineering
Instructions:
  • Answer 50 questions in 15 minutes.
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  • Match each statement with the correct term.
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This is a study tool. The 3 wrong answers for each question are randomly chosen from answers to other questions. So, you might find at times the answers obvious, but you will see it re-enforces your understanding as you take the test each time.
1. Degree of opacity depends on size and number of particles - Opacity of metals is the result of conduction electrons absorbing photons in the visible range.






2. -> fluorescent light - electron transitions occur randomly - light waves are out of phase with each other.






3. Materials change size when temperature is changed






4. Hardness is the resistance of a material to deformation by indentation - Useful in quality control - Hardness can provide a qualitative assessment of strength - Hardness cannot be used to quantitatively infer strength or ductility.






5. A parallel-plate capacitor involves an insulator - or dielectric - between two metal electrodes. The charge density buildup at the capacitor surface is related to the dielectric constant of the material.






6. Wet: isotropic - under cut Dry: ansiotropic - directional






7. ...occurs in bcc metals but not in fcc metals.






8. No appreciable plastic deformation. The crack propagates very fast; nearly perpendicular to applied stress. Cracks often propagate along specific crystal planes or boundaries.






9. Different orientation of cleavage planes in grains.






10. Loss of image transmission - You get no image - There is no light transmission - and therefore reflects - scatters - or absorbs ALL of it. Both mirrors and carbon black are opaque.






11. Specific heat = energy input/(mass*temperature change)






12. If a material has ________ - then the field generated by those moments must be added to the induced field.






13. Resistance to plastic deformation of cracking in compression - and better wear properties.






14. Without passing a current a continually varying magnetic field will cause a current to flow






15. 1. Yield = ratio of functional chips to total # of chips - Most yield loss during wafer processing - b/c of complex 2. Reliability - No device has infinite lifetime. Statistical methods to predict expected lifetime - Failure mechanisms: Diffusion reg






16. 1. Tc= critical temperature- if T>Tc not superconducting 2. Jc= critical current density - if J>Jc not superconducting 3. Hc= critical magnetic field - if H > Hc not superconducting






17. Liquid polymer at room T - sandwiched between two sheets of glass - coated with transparent - electrically conductive film. - Character forming letters/ numbers etched on the face - Voltage applied disrupts the orientation of the rod- shaped molecule






18. Allows you to calculate what happened G=F' x cos(lambda) - F=F' x cos(phi)






19. Allows flow of electrons in one direction only (useful to convert alternating current to direct current) - Result: no net current flow






20. Measures Hardness 1. psia = 500 x HB 2. MPa = 3.45 x HB






21. The ability of a material to absorb heat - Quantitatively: The energy required to produce a unit rise in temperature for one mole of a material.






22. Ability to transmit a clear image - The image is clear.






23. High toughness; material resists crack propagation.






24. Failure under cyclic stress 1. It can cause part failure - even though (sigma)max < (sigma)c 2. Causes ~90% of mechanical engineering failures.






25. Energy is stored as atomic vibrations - As temperature increases - the average energy of atomic vibrations increases.






26. 1. Necking 2. Cavity formation 3. Cavity coalescence to form cracks 4. Crack propagation (growth) 5. Fracture






27. Measures impact energy 1. Strike a notched sample with an anvil 2. Measure how far the anvil travels following impact 3. Distance traveled is related to energy required to break the sample 4. Very high rate of loading. Makes materials more "brittle."






28. Plastic means permanent! When a small load is applied - bonds stretch & planes shear. Then when the load is no longer applied - the planes are still sheared.






29. Cracks pass through grains - often along specific crystal planes.






30. The Magnetization of the material - and is essentially the dipole moment per unit volume. It is proportional to the applied field. Xm is the magnetic susceptibility.






31. Ohms Law: voltage drop = current * resistance






32. Small Coercivities - Used for electric motors - Example: commercial iron 99.95 Fe






33. The ability of a material to be rapidly cooled and not fracture






34. Elastic means reversible! This is not a permanent deformation.






35. A high index of refraction (n value) allows for multiple internal reactions.






36. These materials are relatively unaffected by magnetic fields.






37. Large coercivities - Used for permanent magnets - Add particles/voids to inhibit domain wall motion - Example: tungsten steel






38. Transmitted light distorts electron clouds - The velocity of light in a material is lower than in a vacuum - Adding large ions to glass decreases the speed of light in the glass - Light can be "bent" (or refracted) as it passes through a transparent






39. Process by which geometric patterns are transferred from a mask (reticle) to a surface of a chip to form the device.






40. Growth of an oxide layer by the reaction of oxygen with the substrate - Provides dopant masking and device isolation - IC technology uses 1. Thermal grown oxidation (dry) 2. Wet Oxidation 3. Selective Oxidation






41. Dramatic change in impact energy is associated with a change in fracture mode from brittle to ductile.






42. Occur due to: restrained thermal expansion/contraction -temperature gradients that lead to differential dimensional changes sigma = Thermal Stress






43. Dimples on fracture surface correspond to microcavities that initiate crack formation.






44. heat flux = -(thermal conductivity)(temperature gradient) - Defines heat transfer by CONDUCTION

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45. (sigma)=F/Ai (rho)=(rho)'(1+(epsilon))






46. Emitted light is in phase






47. 1. Imperfections increase resistivity - grain boundaries - dislocations - impurity atoms - vacancies 2. Resistivity - increases with temperature - wt% impurity - and %CW






48. Specular: light reflecting off a mirror (average) - Diffuse: light reflecting off a white wall (local)






49. Occur when lots of dislocations move.






50. Typical loading conditions are _____ enough to break all inter-atomic bonds







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