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Test your basic knowledge |
Engineering Materials
Start Test
Study First
Subject
:
engineering
Instructions:
Answer 50 questions in 15 minutes.
If you are not ready to take this test, you can
study here
.
Match each statement with the correct term.
Don't refresh. All questions and answers are randomly picked and ordered every time you load a test.
This is a study tool. The 3 wrong answers for each question are randomly chosen from answers to other questions. So, you might find at times the answers obvious, but you will see it re-enforces your understanding as you take the test each time.
1. Transformer cores require soft magnetic materials - which are easily magnetized and de-magnetized - and have high electrical resistivity - Energy losses in transformers could be minimized if their cores were fabricated such that the easy magnetizatio
Electrical Conduction
Iron-Silicon Alloy in Transformer Cores
Magnetic Storage
Why do ceramics have larger bonding energy?
2. Defines the ability of a material to resist fracture even when a flaw exists - Directly depends on size of flaw and material properties - K(ic) is a materials constant
Ductile Fracture
Stress Intensity Factor
Stages of Failure: Ductile Fracture
To improve fatigue life
3. Resistance to plastic deformation of cracking in compression - and better wear properties.
High impact energy
Thermal Conductivity
Large Hardness
Thermal Shock Resistance
4. heat flux = -(thermal conductivity)(temperature gradient) - Defines heat transfer by CONDUCTION
5. Liquid polymer at room T - sandwiched between two sheets of glass - coated with transparent - electrically conductive film. - Character forming letters/ numbers etched on the face - Voltage applied disrupts the orientation of the rod- shaped molecule
Why do ceramics have larger bonding energy?
Linewidth
How an LCD works
Thermal Conductivity
6. Reflectiviy is between 0.90 and 0.95 - Metal surfaces appear shiny - Most of absorbed light is reflected at the same wavelength (NO REFRACTION) - Small fraction of light may be absorbed - Color of reflected light depends on wavelength distribution of
The three modes of crack surface displacement
Lithography
Reflection of Light for Metals
Oxidation
7. Cracks pass through grains - often along specific crystal planes.
Stress Intensity values
Opaque
Why materials fail in service
Transgranular Fracture
8. Energy is stored as atomic vibrations - As temperature increases - the average energy of atomic vibrations increases.
Energy States: Insulators and Semiconductors
Internal magnetic moments
Holloman Equation
Heat Capacity from an Atomic Prospective
9. 1. Stress-strain behavior is not usually determined via tensile tests 2. Material fails before it yields 3. Bend/flexure tests are often used instead.
Thermal Shock Resistance
Response to a Magnetic Field
Conduction & Electron Transport
Brittle Ceramics
10. Created by current through a coil N= total number of turns L= length of turns (m) I= current (ampere) H= applied magnetic field (ampere-turns/m) Bo= magnetic flux density in a vacuum (tesla)
Generation of a Magnetic Field - Vacuum
Charpy or Izod test
Opacity
Iron-Silicon Alloy in Transformer Cores
11. Allows flow of electrons in one direction only (useful to convert alternating current to direct current) - Result: no net current flow
Linewidth
IC Devices: P-N Rectifying Junction
Opaque
What do magnetic moments arise from?
12. 1. Necking 2. Cavity formation 3. Cavity coalescence to form cracks 4. Crack propagation (growth) 5. Fracture
Stages of Failure: Ductile Fracture
Magnetic Storage
Response to a Magnetic Field
Where does DBTT occur?
13. -> fluorescent light - electron transitions occur randomly - light waves are out of phase with each other.
Soft Magnetic Materials
Modulus of Rupture (MOR)
Charpy or Izod test
Incoherent
14. The magnetic hysteresis phenomenon: Stage 1: Initial (unmagnetized state) Stage 2: Apply H - align domains Stage 3: Remove H - alignment remains => Permanent magnet Stage 4: Coercivity - Hc negative H needed to demagnitize Stage 5: Apply -H - align d
Large Hardness
Magnetic Storage
Hysteresis and Permanent Magnetization
Reflectance of Non-Metals
15. Cracks propagate along grain boundaries.
Intergranular Fracture
Griffith Crack Model
Engineering Fracture Performance
Fourier's Law
16. As the applied field (H) increases the magnetic domains change shape and size by movement of domain boundaries.
M is known as what?
Holloman Equation
How to gage the extent of plastic deformation
Domains in Ferromagnetic & Ferrimagnetic Materials
17. Small Coercivities - Used for electric motors - Example: commercial iron 99.95 Fe
Extrinsic Semiconductors
Soft Magnetic Materials
Fourier's Law
Conduction & Electron Transport
18. (sigma)=F/Ai (rho)=(rho)'(1+(epsilon))
Paramagnetic Materials
True Stress
High impact energy
Impact - Toughness
19. There is always some statistical distribution of flaws or defects.
There is no perfect material?
Diamagnetic Materials
To improve fatigue life
Heat Capacity
20. 1. Hard disk drives (granular/perpendicular media) 2. Recording tape (particulate media)
Refraction
Modulus of Rupture (MOR)
Magnetic Storage Media Types
Brittle Fracture
21. A parallel-plate capacitor involves an insulator - or dielectric - between two metal electrodes. The charge density buildup at the capacitor surface is related to the dielectric constant of the material.
Coefficient of Thermal Expansion
Valence band
Heat Capacity from an Atomic Prospective
Insulators
22. To build a device - various thin metal or insulating films are grown on top of each other - Evaporation - MBE - Sputtering - CVD (ALD)
Pure Semiconductors: Conductivity vs. T
Film Deposition
Liquid Crystal Displays (LCD's)
Insulators
23. For a metal - there is no ______ - only reflection
Refraction
Fourier's Law
IC Devices: P-N Rectifying Junction
Two kinds of Reflection
24. Flaws and Defects - They concentrate stress locally to levels high enough to rupture bonds.
Film Deposition
Why materials fail in service
Critical Properties of Superconductive Materials
Ductile-to-Brittle Transition
25. Dimples on fracture surface correspond to microcavities that initiate crack formation.
Rockwell
Impact - Toughness
Ductile Fracture
Slip Bands
26. Cp: Heat capacity at constant pressure Cv: Heat capacity at constant volume.
Not severe
Two ways to measure heat capacity
Coefficient of Thermal Expansion
Incoherent
27. A measure of the ease with which a B field can be induced inside a material.
Relative Permeability
Etching
Pure Semiconductors: Conductivity vs. T
The three modes of crack surface displacement
28. Heat capacity.....- increases with temperature -for solids it reaches a limiting value of 3R
Griffith Crack Model
Dependence of Heat Capacity on Temperature
Metallization
The three modes of crack surface displacement
29. A high index of refraction (n value) allows for multiple internal reactions.
Valence band
Sparkle of Diamonds
Relative Permeability
To improve fatigue life
30. # of thermally generated electrons = # of holes (broken bonds)
Intrinsic Semiconductors
Dependence of Heat Capacity on Temperature
How an LCD works
LASER
31. 1. Fluorescent Lamp - tungstate or silicate coating on inside of tube emits white light due to UV light generated inside the tube. 2. TV screen - emits light as electron beam is scanned back and forth.
Metals: Resistivity vs. T - Impurities
LASER
Luminescence examples
Impact - Toughness
32. Another optical property - Depends on the wavelength of the visible spectrum.
Griffith Crack Model
Two kinds of Reflection
Color
Generation of a Magnetic Field - Vacuum
33. Transmitted light distorts electron clouds - The velocity of light in a material is lower than in a vacuum - Adding large ions to glass decreases the speed of light in the glass - Light can be "bent" (or refracted) as it passes through a transparent
Relative Permeability
Insulators
Refraction
Modulus of Rupture (MOR)
34. Failure under cyclic stress 1. It can cause part failure - even though (sigma)max < (sigma)c 2. Causes ~90% of mechanical engineering failures.
Opacifiers
Fatigue
Metals: Resistivity vs. T - Impurities
Thermal Shock Resistance
35. Growth of an oxide layer by the reaction of oxygen with the substrate - Provides dopant masking and device isolation - IC technology uses 1. Thermal grown oxidation (dry) 2. Wet Oxidation 3. Selective Oxidation
Large Hardness
Oxidation
Electrical Conduction
Intergranular Fracture
36. Growing interconnections to connect devices -Low electrical resistance - good adhesion to dielectric insulators.
Heat Capacity
Holloman Equation
Metallization
Force Decomposition
37. Large coercivities - Used for permanent magnets - Add particles/voids to inhibit domain wall motion - Example: tungsten steel
Thermal Expansion: Asymmetric curve
Not severe
Hard Magnetic Materials
Color
38. 1. Impose a compressive surface stress (to suppress surface cracks from growing) - Method 1: shot peening - Method 2: carburizing 2.Remove stress concentrators.
To improve fatigue life
Influence of Temperature on Magnetic Behavior
Griffith Crack Model
True Strain
39. Allows you to calculate what happened G=F' x cos(lambda) - F=F' x cos(phi)
Force Decomposition
Brittle Ceramics
Slip Bands
How an LCD works
40. Loss of image transmission - You get no image - There is no light transmission - and therefore reflects - scatters - or absorbs ALL of it. Both mirrors and carbon black are opaque.
Heat Capacity
Opaque
Lithography
Stress Intensity Factor
41. Light Amplification by Stimulated Emission of Radiation
Electrical Conduction
The Transistor
Critical Properties of Superconductive Materials
LASER
42. The Magnetization of the material - and is essentially the dipole moment per unit volume. It is proportional to the applied field. Xm is the magnetic susceptibility.
Oxidation
Rockwell
M is known as what?
Bending tests
43. Measures Hardness 1. psia = 500 x HB 2. MPa = 3.45 x HB
HB (Brinell Hardness)
Electromigration
Why materials fail in service
Modulus of Rupture (MOR)
44. Wet: isotropic - under cut Dry: ansiotropic - directional
Iron-Silicon Alloy in Transformer Cores
Heat Capacity from an Atomic Prospective
The three modes of crack surface displacement
Etching
45. Sigma=ln(li/lo)
Refraction
True Strain
Superconductivity
True Stress
46. 1. Tensile (opening) 2. Sliding 3. Tearing
Incoherent
The three modes of crack surface displacement
How an LCD works
Metals: Resistivity vs. T - Impurities
47. Diffuse image
Large Hardness
Transgranular Fracture
M is known as what?
Translucent
48. Second phase particles with n > glass.
Brittle Fracture
Liquid Crystal Displays (LCD's)
True Stress
Opacifiers
49. Process by which metal atoms diffuse because of a potential.
Paramagnetic Materials
Electromigration
What do magnetic moments arise from?
Thermal Shock Resistance
50. ...occurs in bcc metals but not in fcc metals.
Diamagnetic Materials
Where does DBTT occur?
Refraction
Critical Properties of Superconductive Materials