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Test your basic knowledge |
Engineering Materials
Start Test
Study First
Subject
:
engineering
Instructions:
Answer 50 questions in 15 minutes.
If you are not ready to take this test, you can
study here
.
Match each statement with the correct term.
Don't refresh. All questions and answers are randomly picked and ordered every time you load a test.
This is a study tool. The 3 wrong answers for each question are randomly chosen from answers to other questions. So, you might find at times the answers obvious, but you will see it re-enforces your understanding as you take the test each time.
1. Defines the ability of a material to resist fracture even when a flaw exists - Directly depends on size of flaw and material properties - K(ic) is a materials constant
HB (Brinell Hardness)
Oxidation
Stress Intensity Factor
Relative Permeability
2. The ability of a material to transport heat - Atomic Perspective: Atomic vibrations and free electrons in hotter regions transport energy to cooler regions - Metals have the largest values
Thermal Conductivity
Diamagnetic Materials
Transgranular Fracture
Opaque
3. A measure of the ease with which a B field can be induced inside a material.
Thermal Conductivity
Intrinsic Semiconductors
Two kinds of Reflection
Relative Permeability
4. Resistance to plastic deformation of cracking in compression - and better wear properties.
Slip Bands
Large Hardness
Thermal Shock Resistance
Metallization
5. Different orientation of cleavage planes in grains.
Why fracture surfaces have faceted texture
Oxidation
Metals: Resistivity vs. T - Impurities
Coefficient of Thermal Expansion
6. Is analogous to toughness.
Brittle Ceramics
Force Decomposition
Impact energy
How an LCD works
7. (sigma)=K(sigma)^n . K = strength coefficient - n = work hardening rate or strain hardening exponent. Large n value increases strength and hardness.
Energy States: Insulators and Semiconductors
How to gage the extent of plastic deformation
Holloman Equation
Conduction & Electron Transport
8. The Magnetization of the material - and is essentially the dipole moment per unit volume. It is proportional to the applied field. Xm is the magnetic susceptibility.
Thermal Conductivity
Fourier's Law
M is known as what?
Stages of Failure: Ductile Fracture
9. Ability to transmit a clear image - The image is clear.
Influence of Temperature on Magnetic Behavior
Sparkle of Diamonds
Transparent
Film Deposition
10. Growing interconnections to connect devices -Low electrical resistance - good adhesion to dielectric insulators.
Generation of a Magnetic Field - Vacuum
Color
Metallization
Thermal Conductivity
11. 1. Ability of the material to absorb energy prior to fracture 2. Short term dynamic stressing - Car collisions - Bullets - Athletic equipment 3. This is different than toughness; energy necessary to push a crack (flaw) through a material 4. Useful in
Color
Impact - Toughness
How an LCD works
Engineering Fracture Performance
12. Dimples on fracture surface correspond to microcavities that initiate crack formation.
Intergranular Fracture
Ductile Fracture
Elastic Deformation
Internal magnetic moments
13. Because of ionic & covalent-type bonding.
Where does DBTT occur?
Why do ceramics have larger bonding energy?
Fatigue
Luminescence examples
14. 1. Data for Pure Silicon - electrical conductivity increases with T - opposite to metals
Not severe
Pure Semiconductors: Conductivity vs. T
Work Hardening
Thermal Stresses
15. Heat capacity.....- increases with temperature -for solids it reaches a limiting value of 3R
Brittle Fracture
Dependence of Heat Capacity on Temperature
Ductile Fracture
Two ways to measure heat capacity
16. Loss of image transmission - You get no image - There is no light transmission - and therefore reflects - scatters - or absorbs ALL of it. Both mirrors and carbon black are opaque.
Slip Bands
Elastic Deformation
Charpy or Izod test
Opaque
17. 1. Imperfections increase resistivity - grain boundaries - dislocations - impurity atoms - vacancies 2. Resistivity - increases with temperature - wt% impurity - and %CW
Metals: Resistivity vs. T - Impurities
Influence of Temperature on Magnetic Behavior
Transparent
Soft Magnetic Materials
18. Reflectiviy is between 0.90 and 0.95 - Metal surfaces appear shiny - Most of absorbed light is reflected at the same wavelength (NO REFRACTION) - Small fraction of light may be absorbed - Color of reflected light depends on wavelength distribution of
Metals: Resistivity vs. T - Impurities
Reflection of Light for Metals
Thermal expansion
Brittle Materials
19. Rho=F/A - tau=G/A . Depending on what angle the force is applied - and what angle the crystal is at - it takes different amounts of force to induce plastic deformation.
Ductile Fracture
Domains in Ferromagnetic & Ferrimagnetic Materials
HB (Brinell Hardness)
Shear and Tensile Stress
20. For a metal - there is no ______ - only reflection
Refraction
Hard Magnetic Materials
How to gage the extent of plastic deformation
Work Hardening
21. Increase temperature - no increase in interatomic separation - no thermal expansion
Thermal Expansion: Symmetric curve
Metallization
Pure Semiconductors: Conductivity vs. T
Coefficient of Thermal Expansion
22. To build a device - various thin metal or insulating films are grown on top of each other - Evaporation - MBE - Sputtering - CVD (ALD)
How an LCD works
Metals: Resistivity vs. T - Impurities
Film Deposition
Refraction
23. Width of smallest feature obtainable on Si surface
Brittle Fracture
Magnetic Storage Media Types
Thermal Expansion: Symmetric curve
Linewidth
24. # of thermally generated electrons = # of holes (broken bonds)
Slip Bands
Where does DBTT occur?
Generation of a Magnetic Field - Within a Solid Material
Intrinsic Semiconductors
25. Large coercivities - Used for permanent magnets - Add particles/voids to inhibit domain wall motion - Example: tungsten steel
Transgranular Fracture
Hard Magnetic Materials
Electrical Conduction
Griffith Crack Model
26. Small Coercivities - Used for electric motors - Example: commercial iron 99.95 Fe
Why fracture surfaces have faceted texture
Liquid Crystal Displays (LCD's)
Soft Magnetic Materials
Meissner Effect
27. These are liquid crystal polymers- not your normal "crystal" -Rigid - rod shaped molecules are aligned even in liquid form.
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28. A parallel-plate capacitor involves an insulator - or dielectric - between two metal electrodes. The charge density buildup at the capacitor surface is related to the dielectric constant of the material.
Yield and Reliability
Translucent
True Strain
Insulators
29. With Increasing temperature - the saturation magnetization diminishes gradually and then abruptly drops to zero at Curie Temperature - Tc.
Not severe
Paramagnetic Materials
Iron-Silicon Alloy in Transformer Cores
Influence of Temperature on Magnetic Behavior
30. Is reflected - absorbed - scattered - and/or transmitted: Io=It+Ia+Ir+Is
Incident Light
Opaque
Linewidth
Thermal Stresses
31. 1. Ductility- % elongation - % reduction in area - may be of use in metal forming operations (e.g. - stretch forming). This is convenient for mechanical testing - but not very meaningful for most deformation processing. 2. Toughness- Area beneath str
How to gage the extent of plastic deformation
The Transistor
Rockwell
Holloman Equation
32. Stress concentration at a crack tips
The Transistor
Griffith Crack Model
M is known as what?
Thermal Expansion: Asymmetric curve
33. 1. Diamagnetic (Xm ~ 10^-5) - small and negative magnetic susceptibilities 2. Paramagnetic (Xm ~ 10^-4) - small and positive magnetic susceptibilities 3. Ferromagnetic - large magnetic susceptibilities 4. Ferrimagnetic (Xm as large as 10^6) - large m
M is known as what?
Yield and Reliability
Transparent
4 Types of Magnetism
34. The magnetic hysteresis phenomenon: Stage 1: Initial (unmagnetized state) Stage 2: Apply H - align domains Stage 3: Remove H - alignment remains => Permanent magnet Stage 4: Coercivity - Hc negative H needed to demagnitize Stage 5: Apply -H - align d
4 Types of Magnetism
Brittle Materials
LASER
Hysteresis and Permanent Magnetization
35. Found in 26 metals and hundreds of alloys & compounds - Tc= critical temperature = termperature below which material is superconductive.
Etching
Superconductivity
Force Decomposition
Brittle Materials
36. Materials change size when temperature is changed
Thermal expansion
Film Deposition
Luminescence examples
Coefficient of Thermal Expansion
37. 1. Hard disk drives (granular/perpendicular media) 2. Recording tape (particulate media)
Magnetic Storage Media Types
Coherent
Response to a Magnetic Field
Refraction
38. Plastic means permanent! When a small load is applied - bonds stretch & planes shear. Then when the load is no longer applied - the planes are still sheared.
Plastic Deformation (Metals)
Thermal Expansion: Symmetric curve
Generation of a Magnetic Field - Vacuum
Stress Intensity values
39. 1. General yielding occurs if flaw size a < a(critical) 2. Catastrophic fast fracture occurs if flaw size a > a(critical)
Impact - Toughness
Engineering Fracture Performance
Yield and Reliability
Ductile Fracture
40. - The emission of light from a substance due to the absorption of energy. (Could be radiation - mechanical - or chemical energy. Could also be energetic particles.) - Traps and activator levels are produced by impurity additions to the material - Whe
Pure Semiconductors: Conductivity vs. T
Transgranular Fracture
Impact - Toughness
Luminescence
41. Becomes harder (more strain) to stretch (elongate)
Ductile-to-Brittle Transition
Intergranular Fracture
Linewidth
Work Hardening
42. Dramatic change in impact energy is associated with a change in fracture mode from brittle to ductile.
Ductile-to-Brittle Transition
Bending tests
Rockwell
Magnetic Storage
43. 1. Insulators: Higher energy states NOT ACCESSIBLE due to gap 2. Semiconductors: Higher energy states separated by a smaller gap.
Generation of a Magnetic Field - Vacuum
Shear and Tensile Stress
Energy States: Insulators and Semiconductors
Film Deposition
44. Allows flow of electrons in one direction only (useful to convert alternating current to direct current) - Result: no net current flow
Refraction
Etching
IC Devices: P-N Rectifying Junction
Transgranular Fracture
45. Typical loading conditions are _____ enough to break all inter-atomic bonds
Not severe
Translucent
Paramagnetic Materials
Opaque
46. Process by which geometric patterns are transferred from a mask (reticle) to a surface of a chip to form the device.
Lithography
Not severe
Large Hardness
High impact energy
47. Metals are good conductors since their _______is only partially filled.
Internal magnetic moments
Response to a Magnetic Field
Luminescence
Valence band
48. Second phase particles with n > glass.
Opacifiers
Brittle Ceramics
The three modes of crack surface displacement
Lithography
49. As the applied field (H) increases the magnetic domains change shape and size by movement of domain boundaries.
Work Hardening
Domains in Ferromagnetic & Ferrimagnetic Materials
Intrinsic Semiconductors
Diamagnetic Materials
50. The size of the material changes with a change in temperature - polymers have the largest values
Rockwell
Holloman Equation
Coefficient of Thermal Expansion
Two kinds of Reflection