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Test your basic knowledge |
Engineering Materials
Start Test
Study First
Subject
:
engineering
Instructions:
Answer 50 questions in 15 minutes.
If you are not ready to take this test, you can
study here
.
Match each statement with the correct term.
Don't refresh. All questions and answers are randomly picked and ordered every time you load a test.
This is a study tool. The 3 wrong answers for each question are randomly chosen from answers to other questions. So, you might find at times the answers obvious, but you will see it re-enforces your understanding as you take the test each time.
1. Sigma=ln(li/lo)
Work Hardening
Diamagnetic Materials
Thermal Stresses
True Strain
2. Loss of image transmission - You get no image - There is no light transmission - and therefore reflects - scatters - or absorbs ALL of it. Both mirrors and carbon black are opaque.
Impact - Toughness
Influence of Temperature on Magnetic Behavior
Insulators
Opaque
3. Is reflected - absorbed - scattered - and/or transmitted: Io=It+Ia+Ir+Is
Luminescence examples
Metals: Resistivity vs. T - Impurities
Incident Light
Rockwell
4. Ability to transmit a clear image - The image is clear.
Influence of Temperature on Magnetic Behavior
IC Devices: P-N Rectifying Junction
Transparent
Conduction & Electron Transport
5. Is analogous to toughness.
Reflectance of Non-Metals
HB (Brinell Hardness)
Impact energy
Linewidth
6. Second phase particles with n > glass.
Film Deposition
Ductile-to-Brittle Transition
Brittle Fracture
Opacifiers
7. ...occurs in bcc metals but not in fcc metals.
Sparkle of Diamonds
Where does DBTT occur?
Generation of a Magnetic Field - Vacuum
Magnetic Storage
8. Light Amplification by Stimulated Emission of Radiation
Heat Capacity from an Atomic Prospective
LASER
Hardness
Metallization
9. Not ALL the light is refracted - SOME is reflected. Materials with a high index of refraction also have high reflectance - High R is bad for lens applications - since this leads to undesirable light losses or interference.
Opacity
Thermal Stresses
Reflectance of Non-Metals
Hard Magnetic Materials
10. Allows flow of electrons in one direction only (useful to convert alternating current to direct current) - Result: no net current flow
Coefficient of Thermal Expansion
The Transistor
IC Devices: P-N Rectifying Junction
Response to a Magnetic Field
11. Measures Hardness 1. psia = 500 x HB 2. MPa = 3.45 x HB
HB (Brinell Hardness)
Magnetic Storage
Linewidth
Oxidation
12. - The emission of light from a substance due to the absorption of energy. (Could be radiation - mechanical - or chemical energy. Could also be energetic particles.) - Traps and activator levels are produced by impurity additions to the material - Whe
Luminescence
Large Hardness
Impact - Toughness
Force Decomposition
13. Growth of an oxide layer by the reaction of oxygen with the substrate - Provides dopant masking and device isolation - IC technology uses 1. Thermal grown oxidation (dry) 2. Wet Oxidation 3. Selective Oxidation
Oxidation
Charpy or Izod test
Generation of a Magnetic Field - Within a Solid Material
Magnetic Storage Media Types
14. 1. Data for Pure Silicon - electrical conductivity increases with T - opposite to metals
Pure Semiconductors: Conductivity vs. T
Iron-Silicon Alloy in Transformer Cores
Metals: Resistivity vs. T - Impurities
The three modes of crack surface displacement
15. Cp: Heat capacity at constant pressure Cv: Heat capacity at constant volume.
Magnetic Storage Media Types
Sparkle of Diamonds
Two ways to measure heat capacity
The Transistor
16. Stress concentration at a crack tips
Griffith Crack Model
Magnetic Storage
Relative Permeability
Critical Properties of Superconductive Materials
17. Cracks pass through grains - often along specific crystal planes.
Sparkle of Diamonds
Transgranular Fracture
Superconductivity
Color
18. Growing interconnections to connect devices -Low electrical resistance - good adhesion to dielectric insulators.
Shear and Tensile Stress
Metallization
Fatigue
Thermal Expansion: Symmetric curve
19. 1. Diamagnetic (Xm ~ 10^-5) - small and negative magnetic susceptibilities 2. Paramagnetic (Xm ~ 10^-4) - small and positive magnetic susceptibilities 3. Ferromagnetic - large magnetic susceptibilities 4. Ferrimagnetic (Xm as large as 10^6) - large m
Oxidation
Thermal expansion
4 Types of Magnetism
LASER
20. Measures impact energy 1. Strike a notched sample with an anvil 2. Measure how far the anvil travels following impact 3. Distance traveled is related to energy required to break the sample 4. Very high rate of loading. Makes materials more "brittle."
LASER
Incoherent
Etching
Charpy or Izod test
21. Becomes harder (more strain) to stretch (elongate)
Brittle Fracture
Intrinsic Semiconductors
Meissner Effect
Work Hardening
22. Digitalized data in the form of electrical signals are transferred to and recorded digitally on a magnetic medium (tape or disk) - This transference is accomplished by a recording system that consists of a read/write head - "write" or record data by
Magnetic Storage
Bending tests
Why materials fail in service
HB (Brinell Hardness)
23. Dramatic change in impact energy is associated with a change in fracture mode from brittle to ductile.
Work Hardening
Extrinsic Semiconductors
Pure Semiconductors: Conductivity vs. T
Ductile-to-Brittle Transition
24. Allows you to calculate what happened G=F' x cos(lambda) - F=F' x cos(phi)
There is no perfect material?
Superconductivity
Refraction
Force Decomposition
25. These materials are relatively unaffected by magnetic fields.
Stages of Failure: Ductile Fracture
Oxidation
Diamagnetic Materials
Impact energy
26. Measures Hardness - No major sample damage - Each scales runs to 130 but only useful in range 20-100 - Minor load is 10 kg - Major load: 60 kg (diamond) - 100 kg (1/16 in. ball) - 150 kg (diamond)
Ductile Fracture
There is no perfect material?
Rockwell
The Transistor
27. A measure of the ease with which a B field can be induced inside a material.
Scattering
Sparkle of Diamonds
The Transistor
Relative Permeability
28. Impurities added to the semiconductor that contribute to excess electrons or holes. Doping = intentional impurities.
Refraction
HB (Brinell Hardness)
Extrinsic Semiconductors
Thermal Shock Resistance
29. They are used to assess properties of ceramics & glasses.
Holloman Equation
Hysteresis and Permanent Magnetization
Bending tests
Soft Magnetic Materials
30. - Metals that exhibit high ductility - exhibit high toughness. Ceramics are very strong - but have low ductility and low toughness - Polymers are very ductile but are not generally very strong in shear (compared to metals and ceramics). They have low
IC Devices: P-N Rectifying Junction
Stress Intensity values
Coefficient of Thermal Expansion
Superconductivity
31. The Magnetization of the material - and is essentially the dipole moment per unit volume. It is proportional to the applied field. Xm is the magnetic susceptibility.
M is known as what?
Coherent
Where does DBTT occur?
Stages of Failure: Ductile Fracture
32. Process by which metal atoms diffuse because of a potential.
Holloman Equation
Film Deposition
Electromigration
HB (Brinell Hardness)
33. There is always some statistical distribution of flaws or defects.
Rockwell
There is no perfect material?
Where does DBTT occur?
The three modes of crack surface displacement
34. Elastic means reversible! This is not a permanent deformation.
Elastic Deformation
Bending tests
Shear and Tensile Stress
Thermal expansion
35. Dimples on fracture surface correspond to microcavities that initiate crack formation.
LASER
Stress Intensity values
Ductile Fracture
Heat Capacity from an Atomic Prospective
36. Metals are good conductors since their _______is only partially filled.
Valence band
Translucent
Intrinsic Semiconductors
There is no perfect material?
37. A parallel-plate capacitor involves an insulator - or dielectric - between two metal electrodes. The charge density buildup at the capacitor surface is related to the dielectric constant of the material.
Stages of Failure: Ductile Fracture
Stress Intensity values
Insulators
Domains in Ferromagnetic & Ferrimagnetic Materials
38. The magnetic hysteresis phenomenon: Stage 1: Initial (unmagnetized state) Stage 2: Apply H - align domains Stage 3: Remove H - alignment remains => Permanent magnet Stage 4: Coercivity - Hc negative H needed to demagnitize Stage 5: Apply -H - align d
Holloman Equation
Generation of a Magnetic Field - Vacuum
Hysteresis and Permanent Magnetization
Opacifiers
39. 1. Insulators: Higher energy states NOT ACCESSIBLE due to gap 2. Semiconductors: Higher energy states separated by a smaller gap.
Griffith Crack Model
Energy States: Insulators and Semiconductors
Reflectance of Non-Metals
Work Hardening
40. Flaws and Defects - They concentrate stress locally to levels high enough to rupture bonds.
Elastic Deformation
Why materials fail in service
Large Hardness
Color
41. Undergo little or no plastic deformation.
Brittle Materials
Fatigue
Why do ceramics have larger bonding energy?
Oxidation
42. - A magnetic field is induced in the material B= Magnetic Induction (tesla) inside the material mu= permeability of a solid
Thermal expansion
Coefficient of Thermal Expansion
Opaque
Generation of a Magnetic Field - Within a Solid Material
43. Resistance to plastic deformation of cracking in compression - and better wear properties.
Large Hardness
Generation of a Magnetic Field - Within a Solid Material
Heat Capacity
Metals: Resistivity vs. T - Impurities
44. Created by current through a coil N= total number of turns L= length of turns (m) I= current (ampere) H= applied magnetic field (ampere-turns/m) Bo= magnetic flux density in a vacuum (tesla)
Luminescence
Scattering
Generation of a Magnetic Field - Vacuum
Paramagnetic Materials
45. Rho=F/A - tau=G/A . Depending on what angle the force is applied - and what angle the crystal is at - it takes different amounts of force to induce plastic deformation.
Refraction
Conduction & Electron Transport
True Strain
Shear and Tensile Stress
46. Small Coercivities - Used for electric motors - Example: commercial iron 99.95 Fe
Plastic Deformation (Metals)
There is no perfect material?
4 Types of Magnetism
Soft Magnetic Materials
47. Ohms Law: voltage drop = current * resistance
Electrical Conduction
Ductile-to-Brittle Transition
Slip Bands
Thermal Stresses
48. 1. Necking 2. Cavity formation 3. Cavity coalescence to form cracks 4. Crack propagation (growth) 5. Fracture
Holloman Equation
Stages of Failure: Ductile Fracture
Translucent
How an LCD works
49. 1. Tensile (opening) 2. Sliding 3. Tearing
Opacity
The three modes of crack surface displacement
Relative Permeability
Heat Capacity from an Atomic Prospective
50. Defines the ability of a material to resist fracture even when a flaw exists - Directly depends on size of flaw and material properties - K(ic) is a materials constant
Fatigue
Meissner Effect
Stress Intensity Factor
Elastic Deformation