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Engineering Materials

Subject : engineering
Instructions:
  • Answer 50 questions in 15 minutes.
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  • Match each statement with the correct term.
  • Don't refresh. All questions and answers are randomly picked and ordered every time you load a test.

This is a study tool. The 3 wrong answers for each question are randomly chosen from answers to other questions. So, you might find at times the answers obvious, but you will see it re-enforces your understanding as you take the test each time.
1. Measures Hardness - No major sample damage - Each scales runs to 130 but only useful in range 20-100 - Minor load is 10 kg - Major load: 60 kg (diamond) - 100 kg (1/16 in. ball) - 150 kg (diamond)






2. Loss of image transmission - You get no image - There is no light transmission - and therefore reflects - scatters - or absorbs ALL of it. Both mirrors and carbon black are opaque.






3. Typical loading conditions are _____ enough to break all inter-atomic bonds






4. Defines the ability of a material to resist fracture even when a flaw exists - Directly depends on size of flaw and material properties - K(ic) is a materials constant






5. Found in 26 metals and hundreds of alloys & compounds - Tc= critical temperature = termperature below which material is superconductive.






6. Cracks pass through grains - often along specific crystal planes.






7. Undergo little or no plastic deformation.






8. Sigma=ln(li/lo)






9. These are liquid crystal polymers- not your normal "crystal" -Rigid - rod shaped molecules are aligned even in liquid form.

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10. Dimples on fracture surface correspond to microcavities that initiate crack formation.






11. Small Coercivities - Used for electric motors - Example: commercial iron 99.95 Fe






12. Metals are good conductors since their _______is only partially filled.






13. (sigma)=K(sigma)^n . K = strength coefficient - n = work hardening rate or strain hardening exponent. Large n value increases strength and hardness.






14. As the applied field (H) increases the magnetic domains change shape and size by movement of domain boundaries.






15. Rho=F/A - tau=G/A . Depending on what angle the force is applied - and what angle the crystal is at - it takes different amounts of force to induce plastic deformation.






16. The magnetic hysteresis phenomenon: Stage 1: Initial (unmagnetized state) Stage 2: Apply H - align domains Stage 3: Remove H - alignment remains => Permanent magnet Stage 4: Coercivity - Hc negative H needed to demagnitize Stage 5: Apply -H - align d






17. Is reflected - absorbed - scattered - and/or transmitted: Io=It+Ia+Ir+Is






18. Different orientation of cleavage planes in grains.






19. Hardness is the resistance of a material to deformation by indentation - Useful in quality control - Hardness can provide a qualitative assessment of strength - Hardness cannot be used to quantitatively infer strength or ductility.






20. 1. Ductility- % elongation - % reduction in area - may be of use in metal forming operations (e.g. - stretch forming). This is convenient for mechanical testing - but not very meaningful for most deformation processing. 2. Toughness- Area beneath str






21. 1. Stress-strain behavior is not usually determined via tensile tests 2. Material fails before it yields 3. Bend/flexure tests are often used instead.






22. 1. Fluorescent Lamp - tungstate or silicate coating on inside of tube emits white light due to UV light generated inside the tube. 2. TV screen - emits light as electron beam is scanned back and forth.






23. Specular: light reflecting off a mirror (average) - Diffuse: light reflecting off a white wall (local)






24. 1. Tensile (opening) 2. Sliding 3. Tearing






25. Emitted light is in phase






26. These materials are "attracted" to magnetic fields.






27. Large coercivities - Used for permanent magnets - Add particles/voids to inhibit domain wall motion - Example: tungsten steel






28. Becomes harder (more strain) to stretch (elongate)






29. The ability of a material to be rapidly cooled and not fracture






30. Specific heat = energy input/(mass*temperature change)






31. Undergo extensive plastic deformation prior to failure.






32. Ohms Law: voltage drop = current * resistance






33. Light Amplification by Stimulated Emission of Radiation






34. A high index of refraction (n value) allows for multiple internal reactions.






35. Heat capacity.....- increases with temperature -for solids it reaches a limiting value of 3R






36. Because of ionic & covalent-type bonding.






37. Flaws and Defects - They concentrate stress locally to levels high enough to rupture bonds.






38. Diffuse image






39. For a metal - there is no ______ - only reflection






40. Cp: Heat capacity at constant pressure Cv: Heat capacity at constant volume.






41. 1. Diamagnetic (Xm ~ 10^-5) - small and negative magnetic susceptibilities 2. Paramagnetic (Xm ~ 10^-4) - small and positive magnetic susceptibilities 3. Ferromagnetic - large magnetic susceptibilities 4. Ferrimagnetic (Xm as large as 10^6) - large m






42. -> fluorescent light - electron transitions occur randomly - light waves are out of phase with each other.






43. Another optical property - Depends on the wavelength of the visible spectrum.






44. Process by which metal atoms diffuse because of a potential.






45. Materials change size when temperature is changed






46. 1. Impose a compressive surface stress (to suppress surface cracks from growing) - Method 1: shot peening - Method 2: carburizing 2.Remove stress concentrators.






47. Impurities added to the semiconductor that contribute to excess electrons or holes. Doping = intentional impurities.






48. With Increasing temperature - the saturation magnetization diminishes gradually and then abruptly drops to zero at Curie Temperature - Tc.






49. Second phase particles with n > glass.






50. Liquid polymer at room T - sandwiched between two sheets of glass - coated with transparent - electrically conductive film. - Character forming letters/ numbers etched on the face - Voltage applied disrupts the orientation of the rod- shaped molecule






Can you answer 50 questions in 15 minutes?



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