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Test your basic knowledge |
Engineering Materials
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Subject
:
engineering
Instructions:
Answer 50 questions in 15 minutes.
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Match each statement with the correct term.
Don't refresh. All questions and answers are randomly picked and ordered every time you load a test.
This is a study tool. The 3 wrong answers for each question are randomly chosen from answers to other questions. So, you might find at times the answers obvious, but you will see it re-enforces your understanding as you take the test each time.
1. 1. Electron motions 2. The spins on electrons - Net atomic magnetic moment: sum of moments from all electrons.
Why materials fail in service
The Transistor
What do magnetic moments arise from?
Slip Bands
2. Specific heat = energy input/(mass*temperature change)
Opacifiers
Specific Heat
Iron-Silicon Alloy in Transformer Cores
Metallization
3. Diffuse image
Electrical Conduction
Translucent
Fatigue
Color
4. Degree of opacity depends on size and number of particles - Opacity of metals is the result of conduction electrons absorbing photons in the visible range.
Thermal Stresses
4 Types of Magnetism
Opacity
Two ways to measure heat capacity
5. Plastic means permanent! When a small load is applied - bonds stretch & planes shear. Then when the load is no longer applied - the planes are still sheared.
There is no perfect material?
Slip Bands
Plastic Deformation (Metals)
Dependence of Heat Capacity on Temperature
6. The size of the material changes with a change in temperature - polymers have the largest values
Coefficient of Thermal Expansion
Transparent
Transgranular Fracture
Where does DBTT occur?
7. There is always some statistical distribution of flaws or defects.
There is no perfect material?
IC Devices: P-N Rectifying Junction
Why materials fail in service
Why do ceramics have larger bonding energy?
8. To build a device - various thin metal or insulating films are grown on top of each other - Evaporation - MBE - Sputtering - CVD (ALD)
Film Deposition
Stress Intensity Factor
Color
Ductile Materials
9. Measures Hardness 1. psia = 500 x HB 2. MPa = 3.45 x HB
Color
HB (Brinell Hardness)
Holloman Equation
Relative Permeability
10. - Metals that exhibit high ductility - exhibit high toughness. Ceramics are very strong - but have low ductility and low toughness - Polymers are very ductile but are not generally very strong in shear (compared to metals and ceramics). They have low
Pure Semiconductors: Conductivity vs. T
Diamagnetic Materials
Stress Intensity values
Paramagnetic Materials
11. The Magnetization of the material - and is essentially the dipole moment per unit volume. It is proportional to the applied field. Xm is the magnetic susceptibility.
M is known as what?
How to gage the extent of plastic deformation
Relative Permeability
Where does DBTT occur?
12. Allows flow of electrons in one direction only (useful to convert alternating current to direct current) - Result: no net current flow
Modulus of Rupture (MOR)
True Stress
What do magnetic moments arise from?
IC Devices: P-N Rectifying Junction
13. This strength parameter is similar in magnitude to a tensile strength. Fracture occurs along the outermost sample edge - which is under a tensile load.
Modulus of Rupture (MOR)
HB (Brinell Hardness)
Force Decomposition
Iron-Silicon Alloy in Transformer Cores
14. Cracks pass through grains - often along specific crystal planes.
Transgranular Fracture
Reflectance of Non-Metals
Lithography
Stages of Failure: Ductile Fracture
15. Second phase particles with n > glass.
Liquid Crystal Displays (LCD's)
Opacifiers
Plastic Deformation (Metals)
Coefficient of Thermal Expansion
16. Process by which metal atoms diffuse because of a potential.
Engineering Fracture Performance
How to gage the extent of plastic deformation
Shear and Tensile Stress
Electromigration
17. -> fluorescent light - electron transitions occur randomly - light waves are out of phase with each other.
Metallization
Thermal Conductivity
Incoherent
To improve fatigue life
18. 1. Impose a compressive surface stress (to suppress surface cracks from growing) - Method 1: shot peening - Method 2: carburizing 2.Remove stress concentrators.
To improve fatigue life
Relative Permeability
Metallization
M is known as what?
19. Increase temperature - increase in interatomic separation - thermal expansion
Lithography
Thermal Expansion: Asymmetric curve
Shear and Tensile Stress
Plastic Deformation (Metals)
20. Allows you to calculate what happened G=F' x cos(lambda) - F=F' x cos(phi)
Diamagnetic Materials
Response to a Magnetic Field
Modulus of Rupture (MOR)
Force Decomposition
21. Large coercivities - Used for permanent magnets - Add particles/voids to inhibit domain wall motion - Example: tungsten steel
Hard Magnetic Materials
Shear and Tensile Stress
Soft Magnetic Materials
How an LCD works
22. A high index of refraction (n value) allows for multiple internal reactions.
The three modes of crack surface displacement
Dependence of Heat Capacity on Temperature
Sparkle of Diamonds
Work Hardening
23. Materials change size when temperature is changed
Thermal Stresses
LASER
Luminescence
Thermal expansion
24. Ability to transmit a clear image - The image is clear.
Transparent
Heat Capacity from an Atomic Prospective
What do magnetic moments arise from?
Force Decomposition
25. Growing interconnections to connect devices -Low electrical resistance - good adhesion to dielectric insulators.
Sparkle of Diamonds
Metallization
Intrinsic Semiconductors
Plastic Deformation (Metals)
26. Stress concentration at a crack tips
Transgranular Fracture
Stages of Failure: Ductile Fracture
Griffith Crack Model
Film Deposition
27. Increase temperature - no increase in interatomic separation - no thermal expansion
Large Hardness
Shear and Tensile Stress
Thermal expansion
Thermal Expansion: Symmetric curve
28. 1. Imperfections increase resistivity - grain boundaries - dislocations - impurity atoms - vacancies 2. Resistivity - increases with temperature - wt% impurity - and %CW
Transparent
Liquid Crystal Displays (LCD's)
Meissner Effect
Metals: Resistivity vs. T - Impurities
29. # of thermally generated electrons = # of holes (broken bonds)
Intrinsic Semiconductors
Why do ceramics have larger bonding energy?
Brittle Fracture
Thermal Expansion: Symmetric curve
30. These materials are relatively unaffected by magnetic fields.
LASER
Ductile-to-Brittle Transition
Diamagnetic Materials
Thermal Expansion: Asymmetric curve
31. A measure of the ease with which a B field can be induced inside a material.
Relative Permeability
Hard Magnetic Materials
Soft Magnetic Materials
HB (Brinell Hardness)
32. A three terminal device that acts like a simple "on-off" switch. (the basis of Integrated Circuits (IC) technology - used in computers - cell phones - automotive control - etc) - If voltage (potential) applied to the "gate" - current flows between th
The Transistor
True Strain
Two kinds of Reflection
Not severe
33. Not ALL the light is refracted - SOME is reflected. Materials with a high index of refraction also have high reflectance - High R is bad for lens applications - since this leads to undesirable light losses or interference.
Thermal Expansion: Asymmetric curve
Magnetic Storage
Coherent
Reflectance of Non-Metals
34. 1. Metals: Thermal energy puts many electrons into a higher energy state. 2. Energy States: Nearby energy states are accessible by thermal fluctuations.
Opacifiers
Conduction & Electron Transport
Incoherent
Lithography
35. (sigma)=F/Ai (rho)=(rho)'(1+(epsilon))
True Stress
The three modes of crack surface displacement
HB (Brinell Hardness)
Not severe
36. They are used to assess properties of ceramics & glasses.
Why materials fail in service
Brittle Ceramics
Bending tests
Rockwell
37. ...occurs in bcc metals but not in fcc metals.
Relative Permeability
Linewidth
Plastic Deformation (Metals)
Where does DBTT occur?
38. Light Amplification by Stimulated Emission of Radiation
LASER
The Transistor
Brittle Materials
Ductile Fracture
39. The ability of a material to transport heat - Atomic Perspective: Atomic vibrations and free electrons in hotter regions transport energy to cooler regions - Metals have the largest values
Translucent
Electromigration
Thermal Conductivity
Impact - Toughness
40. Is analogous to toughness.
Soft Magnetic Materials
Magnetic Storage Media Types
Brittle Materials
Impact energy
41. Typical loading conditions are _____ enough to break all inter-atomic bonds
Metallization
Extrinsic Semiconductors
Rockwell
Not severe
42. Without passing a current a continually varying magnetic field will cause a current to flow
Not severe
Film Deposition
Response to a Magnetic Field
Slip Bands
43. The ability of a material to be rapidly cooled and not fracture
Thermal Shock Resistance
Plastic Deformation (Metals)
Refraction
Heat Capacity from an Atomic Prospective
44. Liquid polymer at room T - sandwiched between two sheets of glass - coated with transparent - electrically conductive film. - Character forming letters/ numbers etched on the face - Voltage applied disrupts the orientation of the rod- shaped molecule
Not severe
Electrical Conduction
Why materials fail in service
How an LCD works
45. The magnetic hysteresis phenomenon: Stage 1: Initial (unmagnetized state) Stage 2: Apply H - align domains Stage 3: Remove H - alignment remains => Permanent magnet Stage 4: Coercivity - Hc negative H needed to demagnitize Stage 5: Apply -H - align d
Brittle Fracture
Large Hardness
Hysteresis and Permanent Magnetization
Incident Light
46. 1. General yielding occurs if flaw size a < a(critical) 2. Catastrophic fast fracture occurs if flaw size a > a(critical)
Charpy or Izod test
Engineering Fracture Performance
Magnetic Storage
Bending tests
47. Ohms Law: voltage drop = current * resistance
Electromigration
Electrical Conduction
4 Types of Magnetism
Valence band
48. Transformer cores require soft magnetic materials - which are easily magnetized and de-magnetized - and have high electrical resistivity - Energy losses in transformers could be minimized if their cores were fabricated such that the easy magnetizatio
Generation of a Magnetic Field - Vacuum
Ductile-to-Brittle Transition
High impact energy
Iron-Silicon Alloy in Transformer Cores
49. Rho=F/A - tau=G/A . Depending on what angle the force is applied - and what angle the crystal is at - it takes different amounts of force to induce plastic deformation.
Engineering Fracture Performance
Force Decomposition
Shear and Tensile Stress
Metals: Resistivity vs. T - Impurities
50. A parallel-plate capacitor involves an insulator - or dielectric - between two metal electrodes. The charge density buildup at the capacitor surface is related to the dielectric constant of the material.
Force Decomposition
Insulators
Magnetic Storage
Thermal Shock Resistance
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