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Engineering Materials
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Subject
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engineering
Instructions:
Answer 50 questions in 15 minutes.
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Match each statement with the correct term.
Don't refresh. All questions and answers are randomly picked and ordered every time you load a test.
This is a study tool. The 3 wrong answers for each question are randomly chosen from answers to other questions. So, you might find at times the answers obvious, but you will see it re-enforces your understanding as you take the test each time.
1. Undergo little or no plastic deformation.
Brittle Ceramics
Bending tests
Electromigration
Brittle Materials
2. 1. Data for Pure Silicon - electrical conductivity increases with T - opposite to metals
Coefficient of Thermal Expansion
Pure Semiconductors: Conductivity vs. T
Thermal Conductivity
Why materials fail in service
3. The ability of a material to absorb heat - Quantitatively: The energy required to produce a unit rise in temperature for one mole of a material.
Stress Intensity values
Heat Capacity
Thermal expansion
Work Hardening
4. The ability of a material to be rapidly cooled and not fracture
Shear and Tensile Stress
Thermal Shock Resistance
Two ways to measure heat capacity
Force Decomposition
5. These are liquid crystal polymers- not your normal "crystal" -Rigid - rod shaped molecules are aligned even in liquid form.
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6. Typical loading conditions are _____ enough to break all inter-atomic bonds
Extrinsic Semiconductors
Yield and Reliability
Not severe
Luminescence
7. Materials change size when temperature is changed
HB (Brinell Hardness)
Metals: Resistivity vs. T - Impurities
Modulus of Rupture (MOR)
Thermal expansion
8. Because of ionic & covalent-type bonding.
Transparent
Sparkle of Diamonds
Modulus of Rupture (MOR)
Why do ceramics have larger bonding energy?
9. Dramatic change in impact energy is associated with a change in fracture mode from brittle to ductile.
How an LCD works
Refraction
Stress Intensity values
Ductile-to-Brittle Transition
10. - A magnetic field is induced in the material B= Magnetic Induction (tesla) inside the material mu= permeability of a solid
Refraction
Electrical Conduction
Generation of a Magnetic Field - Within a Solid Material
Extrinsic Semiconductors
11. Ability to transmit a clear image - The image is clear.
Internal magnetic moments
Why materials fail in service
Transparent
Brittle Ceramics
12. This strength parameter is similar in magnitude to a tensile strength. Fracture occurs along the outermost sample edge - which is under a tensile load.
IC Devices: P-N Rectifying Junction
Hard Magnetic Materials
Reflectance of Non-Metals
Modulus of Rupture (MOR)
13. Without passing a current a continually varying magnetic field will cause a current to flow
Stages of Failure: Ductile Fracture
Thermal expansion
Shear and Tensile Stress
Response to a Magnetic Field
14. They are used to assess properties of ceramics & glasses.
Energy States: Insulators and Semiconductors
Bending tests
Ductile Fracture
Influence of Temperature on Magnetic Behavior
15. Created by current through a coil N= total number of turns L= length of turns (m) I= current (ampere) H= applied magnetic field (ampere-turns/m) Bo= magnetic flux density in a vacuum (tesla)
Generation of a Magnetic Field - Vacuum
Heat Capacity
Brittle Materials
Valence band
16. Dimples on fracture surface correspond to microcavities that initiate crack formation.
Influence of Temperature on Magnetic Behavior
Work Hardening
Ductile Fracture
Impact - Toughness
17. 1. Electron motions 2. The spins on electrons - Net atomic magnetic moment: sum of moments from all electrons.
There is no perfect material?
Meissner Effect
What do magnetic moments arise from?
Superconductivity
18. - Metals that exhibit high ductility - exhibit high toughness. Ceramics are very strong - but have low ductility and low toughness - Polymers are very ductile but are not generally very strong in shear (compared to metals and ceramics). They have low
Lithography
Engineering Fracture Performance
Work Hardening
Stress Intensity values
19. Allows you to calculate what happened G=F' x cos(lambda) - F=F' x cos(phi)
Force Decomposition
4 Types of Magnetism
Domains in Ferromagnetic & Ferrimagnetic Materials
Critical Properties of Superconductive Materials
20. Second phase particles with n > glass.
Impact energy
Large Hardness
Plastic Deformation (Metals)
Opacifiers
21. 1. Yield = ratio of functional chips to total # of chips - Most yield loss during wafer processing - b/c of complex 2. Reliability - No device has infinite lifetime. Statistical methods to predict expected lifetime - Failure mechanisms: Diffusion reg
Domains in Ferromagnetic & Ferrimagnetic Materials
Scattering
Yield and Reliability
Bending tests
22. Cracks pass through grains - often along specific crystal planes.
Transgranular Fracture
Griffith Crack Model
Intrinsic Semiconductors
Lithography
23. Impurities added to the semiconductor that contribute to excess electrons or holes. Doping = intentional impurities.
Valence band
Refraction
Extrinsic Semiconductors
Relative Permeability
24. Becomes harder (more strain) to stretch (elongate)
Domains in Ferromagnetic & Ferrimagnetic Materials
Stress Intensity values
Work Hardening
Magnetic Storage Media Types
25. Digitalized data in the form of electrical signals are transferred to and recorded digitally on a magnetic medium (tape or disk) - This transference is accomplished by a recording system that consists of a read/write head - "write" or record data by
Magnetic Storage
Brittle Fracture
M is known as what?
Impact energy
26. 1. General yielding occurs if flaw size a < a(critical) 2. Catastrophic fast fracture occurs if flaw size a > a(critical)
Engineering Fracture Performance
Insulators
Luminescence
To improve fatigue life
27. Degree of opacity depends on size and number of particles - Opacity of metals is the result of conduction electrons absorbing photons in the visible range.
Hard Magnetic Materials
Metallization
Opacity
Electrical Conduction
28. Failure under cyclic stress 1. It can cause part failure - even though (sigma)max < (sigma)c 2. Causes ~90% of mechanical engineering failures.
4 Types of Magnetism
Work Hardening
Dependence of Heat Capacity on Temperature
Fatigue
29. The size of the material changes with a change in temperature - polymers have the largest values
Coefficient of Thermal Expansion
Opacifiers
Shear and Tensile Stress
Iron-Silicon Alloy in Transformer Cores
30. Measures Hardness - No major sample damage - Each scales runs to 130 but only useful in range 20-100 - Minor load is 10 kg - Major load: 60 kg (diamond) - 100 kg (1/16 in. ball) - 150 kg (diamond)
How to gage the extent of plastic deformation
Elastic Deformation
Generation of a Magnetic Field - Vacuum
Rockwell
31. Increase temperature - no increase in interatomic separation - no thermal expansion
Thermal Expansion: Symmetric curve
Stress Intensity Factor
Iron-Silicon Alloy in Transformer Cores
Relative Permeability
32. A measure of the ease with which a B field can be induced inside a material.
Transgranular Fracture
Stages of Failure: Ductile Fracture
Valence band
Relative Permeability
33. Small Coercivities - Used for electric motors - Example: commercial iron 99.95 Fe
Soft Magnetic Materials
Metallization
Not severe
Pure Semiconductors: Conductivity vs. T
34. Defines the ability of a material to resist fracture even when a flaw exists - Directly depends on size of flaw and material properties - K(ic) is a materials constant
Why do ceramics have larger bonding energy?
Stress Intensity Factor
True Strain
Electrical Conduction
35. Reflectiviy is between 0.90 and 0.95 - Metal surfaces appear shiny - Most of absorbed light is reflected at the same wavelength (NO REFRACTION) - Small fraction of light may be absorbed - Color of reflected light depends on wavelength distribution of
Engineering Fracture Performance
Domains in Ferromagnetic & Ferrimagnetic Materials
Reflection of Light for Metals
Two ways to measure heat capacity
36. Ohms Law: voltage drop = current * resistance
Relative Permeability
Hard Magnetic Materials
Electrical Conduction
Transgranular Fracture
37. Process by which geometric patterns are transferred from a mask (reticle) to a surface of a chip to form the device.
Heat Capacity
Lithography
Hardness
Electromigration
38. Occur due to: restrained thermal expansion/contraction -temperature gradients that lead to differential dimensional changes sigma = Thermal Stress
Stress Intensity Factor
Brittle Fracture
Thermal Stresses
LASER
39. 1. Necking 2. Cavity formation 3. Cavity coalescence to form cracks 4. Crack propagation (growth) 5. Fracture
Brittle Ceramics
Film Deposition
Stages of Failure: Ductile Fracture
Response to a Magnetic Field
40. Increase temperature - increase in interatomic separation - thermal expansion
Thermal Expansion: Asymmetric curve
Reflectance of Non-Metals
Griffith Crack Model
Intrinsic Semiconductors
41. 1. Insulators: Higher energy states NOT ACCESSIBLE due to gap 2. Semiconductors: Higher energy states separated by a smaller gap.
Refraction
Yield and Reliability
Reflection of Light for Metals
Energy States: Insulators and Semiconductors
42. Liquid polymer at room T - sandwiched between two sheets of glass - coated with transparent - electrically conductive film. - Character forming letters/ numbers etched on the face - Voltage applied disrupts the orientation of the rod- shaped molecule
How an LCD works
Soft Magnetic Materials
Metals: Resistivity vs. T - Impurities
Impact energy
43. Occur when lots of dislocations move.
Fatigue
High impact energy
To improve fatigue life
Slip Bands
44. 1. Metals: Thermal energy puts many electrons into a higher energy state. 2. Energy States: Nearby energy states are accessible by thermal fluctuations.
True Stress
Incident Light
Conduction & Electron Transport
What do magnetic moments arise from?
45. The Magnetization of the material - and is essentially the dipole moment per unit volume. It is proportional to the applied field. Xm is the magnetic susceptibility.
Luminescence
Transgranular Fracture
M is known as what?
Thermal Expansion: Symmetric curve
46. Measures impact energy 1. Strike a notched sample with an anvil 2. Measure how far the anvil travels following impact 3. Distance traveled is related to energy required to break the sample 4. Very high rate of loading. Makes materials more "brittle."
Charpy or Izod test
Engineering Fracture Performance
Internal magnetic moments
Thermal expansion
47. For a metal - there is no ______ - only reflection
Opacifiers
True Stress
Refraction
Thermal Conductivity
48. Light Amplification by Stimulated Emission of Radiation
Opaque
Holloman Equation
LASER
Thermal Shock Resistance
49. Is analogous to toughness.
Film Deposition
Impact energy
Two kinds of Reflection
Metals: Resistivity vs. T - Impurities
50. Transformer cores require soft magnetic materials - which are easily magnetized and de-magnetized - and have high electrical resistivity - Energy losses in transformers could be minimized if their cores were fabricated such that the easy magnetizatio
Modulus of Rupture (MOR)
Thermal Expansion: Asymmetric curve
Insulators
Iron-Silicon Alloy in Transformer Cores
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