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Test your basic knowledge |
Engineering Materials
Start Test
Study First
Subject
:
engineering
Instructions:
Answer 50 questions in 15 minutes.
If you are not ready to take this test, you can
study here
.
Match each statement with the correct term.
Don't refresh. All questions and answers are randomly picked and ordered every time you load a test.
This is a study tool. The 3 wrong answers for each question are randomly chosen from answers to other questions. So, you might find at times the answers obvious, but you will see it re-enforces your understanding as you take the test each time.
1. heat flux = -(thermal conductivity)(temperature gradient) - Defines heat transfer by CONDUCTION
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2. Cracks pass through grains - often along specific crystal planes.
Conduction & Electron Transport
Refraction
Heat Capacity from an Atomic Prospective
Transgranular Fracture
3. # of thermally generated electrons = # of holes (broken bonds)
Intrinsic Semiconductors
Hard Magnetic Materials
Stress Intensity Factor
Reflectance of Non-Metals
4. Typical loading conditions are _____ enough to break all inter-atomic bonds
Not severe
Color
Stress Intensity Factor
Extrinsic Semiconductors
5. 1. Fluorescent Lamp - tungstate or silicate coating on inside of tube emits white light due to UV light generated inside the tube. 2. TV screen - emits light as electron beam is scanned back and forth.
Etching
Luminescence examples
Generation of a Magnetic Field - Within a Solid Material
Hardness
6. -> fluorescent light - electron transitions occur randomly - light waves are out of phase with each other.
The three modes of crack surface displacement
Liquid Crystal Displays (LCD's)
Incoherent
Two kinds of Reflection
7. Growth of an oxide layer by the reaction of oxygen with the substrate - Provides dopant masking and device isolation - IC technology uses 1. Thermal grown oxidation (dry) 2. Wet Oxidation 3. Selective Oxidation
Hard Magnetic Materials
Dependence of Heat Capacity on Temperature
LASER
Oxidation
8. Superconductors expel magnetic fields - This is why a superconductor will float above a magnet.
Impact - Toughness
Meissner Effect
Influence of Temperature on Magnetic Behavior
Brittle Fracture
9. Is analogous to toughness.
Work Hardening
Charpy or Izod test
Impact energy
Slip Bands
10. Flaws and Defects - They concentrate stress locally to levels high enough to rupture bonds.
Ductile-to-Brittle Transition
M is known as what?
Work Hardening
Why materials fail in service
11. Resistance to plastic deformation of cracking in compression - and better wear properties.
Large Hardness
Refraction
Specific Heat
Fourier's Law
12. Large coercivities - Used for permanent magnets - Add particles/voids to inhibit domain wall motion - Example: tungsten steel
Electrical Conduction
Griffith Crack Model
Fourier's Law
Hard Magnetic Materials
13. The size of the material changes with a change in temperature - polymers have the largest values
Lithography
Where does DBTT occur?
Coefficient of Thermal Expansion
Fatigue
14. Ability to transmit a clear image - The image is clear.
Large Hardness
Transparent
Modulus of Rupture (MOR)
Elastic Deformation
15. - Metals that exhibit high ductility - exhibit high toughness. Ceramics are very strong - but have low ductility and low toughness - Polymers are very ductile but are not generally very strong in shear (compared to metals and ceramics). They have low
Film Deposition
Stress Intensity values
Slip Bands
Shear and Tensile Stress
16. 1. Imperfections increase resistivity - grain boundaries - dislocations - impurity atoms - vacancies 2. Resistivity - increases with temperature - wt% impurity - and %CW
Metals: Resistivity vs. T - Impurities
Coefficient of Thermal Expansion
Lithography
To improve fatigue life
17. The ability of a material to absorb heat - Quantitatively: The energy required to produce a unit rise in temperature for one mole of a material.
Transparent
Engineering Fracture Performance
Heat Capacity
Elastic Deformation
18. They are used to assess properties of ceramics & glasses.
True Strain
Paramagnetic Materials
Bending tests
Hard Magnetic Materials
19. 1. Yield = ratio of functional chips to total # of chips - Most yield loss during wafer processing - b/c of complex 2. Reliability - No device has infinite lifetime. Statistical methods to predict expected lifetime - Failure mechanisms: Diffusion reg
Specific Heat
Relative Permeability
Iron-Silicon Alloy in Transformer Cores
Yield and Reliability
20. If a material has ________ - then the field generated by those moments must be added to the induced field.
Pure Semiconductors: Conductivity vs. T
Transparent
Luminescence examples
Internal magnetic moments
21. 1. General yielding occurs if flaw size a < a(critical) 2. Catastrophic fast fracture occurs if flaw size a > a(critical)
Not severe
Engineering Fracture Performance
Electromigration
Oxidation
22. Plastic means permanent! When a small load is applied - bonds stretch & planes shear. Then when the load is no longer applied - the planes are still sheared.
Magnetic Storage
Plastic Deformation (Metals)
Holloman Equation
Work Hardening
23. The ability of a material to be rapidly cooled and not fracture
Thermal Shock Resistance
Domains in Ferromagnetic & Ferrimagnetic Materials
Electrical Conduction
Oxidation
24. A measure of the ease with which a B field can be induced inside a material.
IC Devices: P-N Rectifying Junction
Relative Permeability
Opaque
Hysteresis and Permanent Magnetization
25. Degree of opacity depends on size and number of particles - Opacity of metals is the result of conduction electrons absorbing photons in the visible range.
Opacity
What do magnetic moments arise from?
Griffith Crack Model
Why materials fail in service
26. To build a device - various thin metal or insulating films are grown on top of each other - Evaporation - MBE - Sputtering - CVD (ALD)
Film Deposition
4 Types of Magnetism
Brittle Fracture
Stress Intensity values
27. Not ALL the light is refracted - SOME is reflected. Materials with a high index of refraction also have high reflectance - High R is bad for lens applications - since this leads to undesirable light losses or interference.
Not severe
Superconductivity
Influence of Temperature on Magnetic Behavior
Reflectance of Non-Metals
28. Created by current through a coil N= total number of turns L= length of turns (m) I= current (ampere) H= applied magnetic field (ampere-turns/m) Bo= magnetic flux density in a vacuum (tesla)
Generation of a Magnetic Field - Vacuum
Ductile-to-Brittle Transition
Superconductivity
Luminescence
29. Undergo extensive plastic deformation prior to failure.
True Strain
Ductile Materials
Why do ceramics have larger bonding energy?
Elastic Deformation
30. Hardness is the resistance of a material to deformation by indentation - Useful in quality control - Hardness can provide a qualitative assessment of strength - Hardness cannot be used to quantitatively infer strength or ductility.
Hardness
Stress Intensity values
Bending tests
M is known as what?
31. Allows flow of electrons in one direction only (useful to convert alternating current to direct current) - Result: no net current flow
Electrical Conduction
Incoherent
Opaque
IC Devices: P-N Rectifying Junction
32. - The emission of light from a substance due to the absorption of energy. (Could be radiation - mechanical - or chemical energy. Could also be energetic particles.) - Traps and activator levels are produced by impurity additions to the material - Whe
Not severe
Luminescence
Thermal Expansion: Asymmetric curve
Sparkle of Diamonds
33. Wet: isotropic - under cut Dry: ansiotropic - directional
How to gage the extent of plastic deformation
Ductile Materials
Etching
Extrinsic Semiconductors
34. Measures Hardness 1. psia = 500 x HB 2. MPa = 3.45 x HB
The Transistor
Intrinsic Semiconductors
Hardness
HB (Brinell Hardness)
35. Different orientation of cleavage planes in grains.
Why fracture surfaces have faceted texture
Yield and Reliability
Magnetic Storage Media Types
Meissner Effect
36. Found in 26 metals and hundreds of alloys & compounds - Tc= critical temperature = termperature below which material is superconductive.
Ductile Materials
Scattering
Influence of Temperature on Magnetic Behavior
Superconductivity
37. There is always some statistical distribution of flaws or defects.
Electromigration
Pure Semiconductors: Conductivity vs. T
There is no perfect material?
Critical Properties of Superconductive Materials
38. The ability of a material to transport heat - Atomic Perspective: Atomic vibrations and free electrons in hotter regions transport energy to cooler regions - Metals have the largest values
Stages of Failure: Ductile Fracture
Thermal Conductivity
There is no perfect material?
Reflectance of Non-Metals
39. For a metal - there is no ______ - only reflection
Elastic Deformation
Refraction
Transparent
Thermal expansion
40. Rho=F/A - tau=G/A . Depending on what angle the force is applied - and what angle the crystal is at - it takes different amounts of force to induce plastic deformation.
The three modes of crack surface displacement
Elastic Deformation
Shear and Tensile Stress
Thermal Stresses
41. Process by which geometric patterns are transferred from a mask (reticle) to a surface of a chip to form the device.
Lithography
LASER
Force Decomposition
High impact energy
42. Increase temperature - increase in interatomic separation - thermal expansion
Electrical Conduction
There is no perfect material?
Superconductivity
Thermal Expansion: Asymmetric curve
43. Cracks propagate along grain boundaries.
Critical Properties of Superconductive Materials
Energy States: Insulators and Semiconductors
Intergranular Fracture
Incoherent
44. Materials change size when temperature is changed
To improve fatigue life
Magnetic Storage
Intergranular Fracture
Thermal expansion
45. Liquid polymer at room T - sandwiched between two sheets of glass - coated with transparent - electrically conductive film. - Character forming letters/ numbers etched on the face - Voltage applied disrupts the orientation of the rod- shaped molecule
Stages of Failure: Ductile Fracture
How an LCD works
Stress Intensity values
Coefficient of Thermal Expansion
46. Allows you to calculate what happened G=F' x cos(lambda) - F=F' x cos(phi)
Dependence of Heat Capacity on Temperature
Force Decomposition
Superconductivity
M is known as what?
47. Impurities added to the semiconductor that contribute to excess electrons or holes. Doping = intentional impurities.
Bending tests
Extrinsic Semiconductors
Influence of Temperature on Magnetic Behavior
Internal magnetic moments
48. These materials are relatively unaffected by magnetic fields.
Thermal Expansion: Symmetric curve
Oxidation
HB (Brinell Hardness)
Diamagnetic Materials
49. Cp: Heat capacity at constant pressure Cv: Heat capacity at constant volume.
Two ways to measure heat capacity
Luminescence examples
Charpy or Izod test
Incident Light
50. This strength parameter is similar in magnitude to a tensile strength. Fracture occurs along the outermost sample edge - which is under a tensile load.
Thermal Stresses
Electrical Conduction
Coefficient of Thermal Expansion
Modulus of Rupture (MOR)