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Test your basic knowledge |
Engineering Materials
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Subject
:
engineering
Instructions:
Answer 50 questions in 15 minutes.
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Match each statement with the correct term.
Don't refresh. All questions and answers are randomly picked and ordered every time you load a test.
This is a study tool. The 3 wrong answers for each question are randomly chosen from answers to other questions. So, you might find at times the answers obvious, but you will see it re-enforces your understanding as you take the test each time.
1. Loss of image transmission - You get no image - There is no light transmission - and therefore reflects - scatters - or absorbs ALL of it. Both mirrors and carbon black are opaque.
M is known as what?
Reflection of Light for Metals
4 Types of Magnetism
Opaque
2. Undergo extensive plastic deformation prior to failure.
Thermal Shock Resistance
Critical Properties of Superconductive Materials
Stages of Failure: Ductile Fracture
Ductile Materials
3. Flaws and Defects - They concentrate stress locally to levels high enough to rupture bonds.
Why materials fail in service
Large Hardness
The Transistor
Magnetic Storage
4. Defines the ability of a material to resist fracture even when a flaw exists - Directly depends on size of flaw and material properties - K(ic) is a materials constant
Magnetic Storage Media Types
True Strain
Extrinsic Semiconductors
Stress Intensity Factor
5. These materials are "attracted" to magnetic fields.
Bending tests
Stress Intensity values
Paramagnetic Materials
Modulus of Rupture (MOR)
6. Elastic means reversible! This is not a permanent deformation.
Metallization
Two kinds of Reflection
Hard Magnetic Materials
Elastic Deformation
7. Measures impact energy 1. Strike a notched sample with an anvil 2. Measure how far the anvil travels following impact 3. Distance traveled is related to energy required to break the sample 4. Very high rate of loading. Makes materials more "brittle."
Translucent
Charpy or Izod test
Ductile Fracture
Hardness
8. Impurities added to the semiconductor that contribute to excess electrons or holes. Doping = intentional impurities.
Elastic Deformation
Extrinsic Semiconductors
Response to a Magnetic Field
Incoherent
9. Hardness is the resistance of a material to deformation by indentation - Useful in quality control - Hardness can provide a qualitative assessment of strength - Hardness cannot be used to quantitatively infer strength or ductility.
Reflection of Light for Metals
True Strain
Hardness
Large Hardness
10. 1. Metals: Thermal energy puts many electrons into a higher energy state. 2. Energy States: Nearby energy states are accessible by thermal fluctuations.
HB (Brinell Hardness)
Refraction
Oxidation
Conduction & Electron Transport
11. 1. Insulators: Higher energy states NOT ACCESSIBLE due to gap 2. Semiconductors: Higher energy states separated by a smaller gap.
Meissner Effect
Iron-Silicon Alloy in Transformer Cores
Energy States: Insulators and Semiconductors
Elastic Deformation
12. Wet: isotropic - under cut Dry: ansiotropic - directional
Etching
Magnetic Storage
Transgranular Fracture
There is no perfect material?
13. Energy is stored as atomic vibrations - As temperature increases - the average energy of atomic vibrations increases.
True Stress
Luminescence
To improve fatigue life
Heat Capacity from an Atomic Prospective
14. Because of ionic & covalent-type bonding.
Why do ceramics have larger bonding energy?
Work Hardening
The Transistor
Dependence of Heat Capacity on Temperature
15. Allows you to calculate what happened G=F' x cos(lambda) - F=F' x cos(phi)
Linewidth
HB (Brinell Hardness)
M is known as what?
Force Decomposition
16. 1. Tensile (opening) 2. Sliding 3. Tearing
The three modes of crack surface displacement
Griffith Crack Model
Iron-Silicon Alloy in Transformer Cores
LASER
17. Transmitted light distorts electron clouds - The velocity of light in a material is lower than in a vacuum - Adding large ions to glass decreases the speed of light in the glass - Light can be "bent" (or refracted) as it passes through a transparent
Brittle Materials
Shear and Tensile Stress
Refraction
Soft Magnetic Materials
18. They are used to assess properties of ceramics & glasses.
Fourier's Law
Bending tests
Transgranular Fracture
Modulus of Rupture (MOR)
19. Without passing a current a continually varying magnetic field will cause a current to flow
Response to a Magnetic Field
Relative Permeability
Electromigration
Incident Light
20. Second phase particles with n > glass.
Opacifiers
Opaque
Extrinsic Semiconductors
Heat Capacity
21. Occur due to: restrained thermal expansion/contraction -temperature gradients that lead to differential dimensional changes sigma = Thermal Stress
Meissner Effect
Engineering Fracture Performance
Transparent
Thermal Stresses
22. Different orientation of cleavage planes in grains.
Why fracture surfaces have faceted texture
Incoherent
Internal magnetic moments
Diamagnetic Materials
23. 1. Ability of the material to absorb energy prior to fracture 2. Short term dynamic stressing - Car collisions - Bullets - Athletic equipment 3. This is different than toughness; energy necessary to push a crack (flaw) through a material 4. Useful in
Thermal Expansion: Symmetric curve
Etching
Translucent
Impact - Toughness
24. A parallel-plate capacitor involves an insulator - or dielectric - between two metal electrodes. The charge density buildup at the capacitor surface is related to the dielectric constant of the material.
Luminescence
Magnetic Storage
Insulators
Sparkle of Diamonds
25. A three terminal device that acts like a simple "on-off" switch. (the basis of Integrated Circuits (IC) technology - used in computers - cell phones - automotive control - etc) - If voltage (potential) applied to the "gate" - current flows between th
The Transistor
Fatigue
How to gage the extent of plastic deformation
Intergranular Fracture
26. # of thermally generated electrons = # of holes (broken bonds)
Linewidth
Intrinsic Semiconductors
High impact energy
Thermal Expansion: Asymmetric curve
27. Dimples on fracture surface correspond to microcavities that initiate crack formation.
Incident Light
Valence band
Ductile Fracture
Heat Capacity
28. Ability to transmit a clear image - The image is clear.
Thermal expansion
Stress Intensity values
Transparent
Incident Light
29. Increase temperature - no increase in interatomic separation - no thermal expansion
4 Types of Magnetism
Electromigration
Thermal Expansion: Symmetric curve
Coefficient of Thermal Expansion
30. Occurs at a single pore or other solid by refraction n = 1 for pore (air) n > 1 for the solid - n ~ 1.5 for glass - Scattering effect is maximized by pore/particle size within 400-700 nm range - Reason for Opacity in ceramics - glasses and polymers.
Hardness
Critical Properties of Superconductive Materials
Scattering
Where does DBTT occur?
31. Found in 26 metals and hundreds of alloys & compounds - Tc= critical temperature = termperature below which material is superconductive.
The three modes of crack surface displacement
Influence of Temperature on Magnetic Behavior
Film Deposition
Superconductivity
32. These materials are relatively unaffected by magnetic fields.
Diamagnetic Materials
Slip Bands
Luminescence examples
Luminescence
33. Specific heat = energy input/(mass*temperature change)
Luminescence examples
Incoherent
Specific Heat
Conduction & Electron Transport
34. ...occurs in bcc metals but not in fcc metals.
Where does DBTT occur?
Luminescence
Extrinsic Semiconductors
Engineering Fracture Performance
35. Process by which metal atoms diffuse because of a potential.
Electromigration
Linewidth
Transgranular Fracture
What do magnetic moments arise from?
36. 1. Impose a compressive surface stress (to suppress surface cracks from growing) - Method 1: shot peening - Method 2: carburizing 2.Remove stress concentrators.
Iron-Silicon Alloy in Transformer Cores
To improve fatigue life
Two kinds of Reflection
Generation of a Magnetic Field - Vacuum
37. Light Amplification by Stimulated Emission of Radiation
M is known as what?
Fourier's Law
LASER
Incoherent
38. The ability of a material to absorb heat - Quantitatively: The energy required to produce a unit rise in temperature for one mole of a material.
Brittle Fracture
Engineering Fracture Performance
Heat Capacity
Modulus of Rupture (MOR)
39. Stress concentration at a crack tips
Sparkle of Diamonds
Griffith Crack Model
Holloman Equation
Heat Capacity
40. 1. General yielding occurs if flaw size a < a(critical) 2. Catastrophic fast fracture occurs if flaw size a > a(critical)
Why do ceramics have larger bonding energy?
Engineering Fracture Performance
Extrinsic Semiconductors
Energy States: Insulators and Semiconductors
41. Occur when lots of dislocations move.
Electromigration
True Stress
Slip Bands
Internal magnetic moments
42. Sigma=ln(li/lo)
True Strain
Charpy or Izod test
The three modes of crack surface displacement
Linewidth
43. The magnetic hysteresis phenomenon: Stage 1: Initial (unmagnetized state) Stage 2: Apply H - align domains Stage 3: Remove H - alignment remains => Permanent magnet Stage 4: Coercivity - Hc negative H needed to demagnitize Stage 5: Apply -H - align d
Hysteresis and Permanent Magnetization
Coefficient of Thermal Expansion
Thermal Conductivity
Electromigration
44. Large coercivities - Used for permanent magnets - Add particles/voids to inhibit domain wall motion - Example: tungsten steel
Opacity
HB (Brinell Hardness)
Hard Magnetic Materials
Plastic Deformation (Metals)
45. High toughness; material resists crack propagation.
High impact energy
Lithography
Thermal Conductivity
Scattering
46. -> fluorescent light - electron transitions occur randomly - light waves are out of phase with each other.
Pure Semiconductors: Conductivity vs. T
Oxidation
M is known as what?
Incoherent
47. (sigma)=K(sigma)^n . K = strength coefficient - n = work hardening rate or strain hardening exponent. Large n value increases strength and hardness.
Ductile Materials
Plastic Deformation (Metals)
Elastic Deformation
Holloman Equation
48. Another optical property - Depends on the wavelength of the visible spectrum.
Reflection of Light for Metals
Color
Superconductivity
Oxidation
49. Heat capacity.....- increases with temperature -for solids it reaches a limiting value of 3R
Dependence of Heat Capacity on Temperature
Metallization
Why do ceramics have larger bonding energy?
Luminescence
50. Undergo little or no plastic deformation.
Brittle Fracture
Linewidth
Brittle Materials
Relative Permeability
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