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Engineering Materials
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Subject
:
engineering
Instructions:
Answer 50 questions in 15 minutes.
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Match each statement with the correct term.
Don't refresh. All questions and answers are randomly picked and ordered every time you load a test.
This is a study tool. The 3 wrong answers for each question are randomly chosen from answers to other questions. So, you might find at times the answers obvious, but you will see it re-enforces your understanding as you take the test each time.
1. -> fluorescent light - electron transitions occur randomly - light waves are out of phase with each other.
IC Devices: P-N Rectifying Junction
Opaque
Pure Semiconductors: Conductivity vs. T
Incoherent
2. Materials change size when temperature is changed
Thermal expansion
Influence of Temperature on Magnetic Behavior
Shear and Tensile Stress
Why do ceramics have larger bonding energy?
3. Hardness is the resistance of a material to deformation by indentation - Useful in quality control - Hardness can provide a qualitative assessment of strength - Hardness cannot be used to quantitatively infer strength or ductility.
Heat Capacity from an Atomic Prospective
Hardness
Not severe
Coefficient of Thermal Expansion
4. 1. Necking 2. Cavity formation 3. Cavity coalescence to form cracks 4. Crack propagation (growth) 5. Fracture
Not severe
Two ways to measure heat capacity
Stages of Failure: Ductile Fracture
Electrical Conduction
5. Another optical property - Depends on the wavelength of the visible spectrum.
Oxidation
Color
Magnetic Storage Media Types
Magnetic Storage
6. (sigma)=F/Ai (rho)=(rho)'(1+(epsilon))
Thermal expansion
Domains in Ferromagnetic & Ferrimagnetic Materials
True Stress
Internal magnetic moments
7. Dimples on fracture surface correspond to microcavities that initiate crack formation.
How to gage the extent of plastic deformation
Thermal Stresses
Liquid Crystal Displays (LCD's)
Ductile Fracture
8. Occurs at a single pore or other solid by refraction n = 1 for pore (air) n > 1 for the solid - n ~ 1.5 for glass - Scattering effect is maximized by pore/particle size within 400-700 nm range - Reason for Opacity in ceramics - glasses and polymers.
Why fracture surfaces have faceted texture
Yield and Reliability
Color
Scattering
9. Growing interconnections to connect devices -Low electrical resistance - good adhesion to dielectric insulators.
Engineering Fracture Performance
Color
Metallization
Intergranular Fracture
10. Measures Hardness - No major sample damage - Each scales runs to 130 but only useful in range 20-100 - Minor load is 10 kg - Major load: 60 kg (diamond) - 100 kg (1/16 in. ball) - 150 kg (diamond)
Color
Work Hardening
Bending tests
Rockwell
11. Loss of image transmission - You get no image - There is no light transmission - and therefore reflects - scatters - or absorbs ALL of it. Both mirrors and carbon black are opaque.
Opaque
Brittle Ceramics
Luminescence examples
Not severe
12. Specular: light reflecting off a mirror (average) - Diffuse: light reflecting off a white wall (local)
How to gage the extent of plastic deformation
Stress Intensity Factor
Two kinds of Reflection
Film Deposition
13. 1. Insulators: Higher energy states NOT ACCESSIBLE due to gap 2. Semiconductors: Higher energy states separated by a smaller gap.
Heat Capacity from an Atomic Prospective
Color
Energy States: Insulators and Semiconductors
Intergranular Fracture
14. Not ALL the light is refracted - SOME is reflected. Materials with a high index of refraction also have high reflectance - High R is bad for lens applications - since this leads to undesirable light losses or interference.
IC Devices: P-N Rectifying Junction
Reflectance of Non-Metals
Stages of Failure: Ductile Fracture
LASER
15. Different orientation of cleavage planes in grains.
Why fracture surfaces have faceted texture
Where does DBTT occur?
Pure Semiconductors: Conductivity vs. T
Why materials fail in service
16. Specific heat = energy input/(mass*temperature change)
Brittle Ceramics
Thermal Expansion: Asymmetric curve
Ductile Fracture
Specific Heat
17. Second phase particles with n > glass.
Conduction & Electron Transport
Intrinsic Semiconductors
Opacifiers
Specific Heat
18. Allows you to calculate what happened G=F' x cos(lambda) - F=F' x cos(phi)
Force Decomposition
Fatigue
High impact energy
Transparent
19. Diffuse image
The Transistor
Translucent
Why materials fail in service
Where does DBTT occur?
20. 1. Data for Pure Silicon - electrical conductivity increases with T - opposite to metals
Diamagnetic Materials
Energy States: Insulators and Semiconductors
Thermal expansion
Pure Semiconductors: Conductivity vs. T
21. Small Coercivities - Used for electric motors - Example: commercial iron 99.95 Fe
Soft Magnetic Materials
Meissner Effect
Shear and Tensile Stress
Luminescence examples
22. They are used to assess properties of ceramics & glasses.
Bending tests
Refraction
Not severe
IC Devices: P-N Rectifying Junction
23. Typical loading conditions are _____ enough to break all inter-atomic bonds
Brittle Materials
Not severe
Coefficient of Thermal Expansion
Etching
24. Undergo little or no plastic deformation.
Thermal Expansion: Asymmetric curve
Thermal Expansion: Symmetric curve
Refraction
Brittle Materials
25. The ability of a material to transport heat - Atomic Perspective: Atomic vibrations and free electrons in hotter regions transport energy to cooler regions - Metals have the largest values
Oxidation
Modulus of Rupture (MOR)
Thermal Conductivity
Plastic Deformation (Metals)
26. Because of ionic & covalent-type bonding.
Force Decomposition
Refraction
Why do ceramics have larger bonding energy?
Thermal Conductivity
27. 1. Metals: Thermal energy puts many electrons into a higher energy state. 2. Energy States: Nearby energy states are accessible by thermal fluctuations.
Conduction & Electron Transport
M is known as what?
Reflection of Light for Metals
Intergranular Fracture
28. The ability of a material to absorb heat - Quantitatively: The energy required to produce a unit rise in temperature for one mole of a material.
Thermal Stresses
Heat Capacity
Liquid Crystal Displays (LCD's)
What do magnetic moments arise from?
29. A three terminal device that acts like a simple "on-off" switch. (the basis of Integrated Circuits (IC) technology - used in computers - cell phones - automotive control - etc) - If voltage (potential) applied to the "gate" - current flows between th
The Transistor
Meissner Effect
Heat Capacity
Reflection of Light for Metals
30. 1. Diamagnetic (Xm ~ 10^-5) - small and negative magnetic susceptibilities 2. Paramagnetic (Xm ~ 10^-4) - small and positive magnetic susceptibilities 3. Ferromagnetic - large magnetic susceptibilities 4. Ferrimagnetic (Xm as large as 10^6) - large m
Charpy or Izod test
4 Types of Magnetism
Work Hardening
Force Decomposition
31. A measure of the ease with which a B field can be induced inside a material.
Generation of a Magnetic Field - Within a Solid Material
Relative Permeability
Insulators
Internal magnetic moments
32. 1. Yield = ratio of functional chips to total # of chips - Most yield loss during wafer processing - b/c of complex 2. Reliability - No device has infinite lifetime. Statistical methods to predict expected lifetime - Failure mechanisms: Diffusion reg
How to gage the extent of plastic deformation
Ductile-to-Brittle Transition
Specific Heat
Yield and Reliability
33. Is analogous to toughness.
Elastic Deformation
Slip Bands
Impact energy
Plastic Deformation (Metals)
34. No appreciable plastic deformation. The crack propagates very fast; nearly perpendicular to applied stress. Cracks often propagate along specific crystal planes or boundaries.
Work Hardening
Critical Properties of Superconductive Materials
Brittle Fracture
HB (Brinell Hardness)
35. Emitted light is in phase
Coherent
Lithography
Pure Semiconductors: Conductivity vs. T
Hard Magnetic Materials
36. Becomes harder (more strain) to stretch (elongate)
Slip Bands
Generation of a Magnetic Field - Vacuum
Work Hardening
Refraction
37. Process by which geometric patterns are transferred from a mask (reticle) to a surface of a chip to form the device.
Energy States: Insulators and Semiconductors
Where does DBTT occur?
True Strain
Lithography
38. 1. Ductility- % elongation - % reduction in area - may be of use in metal forming operations (e.g. - stretch forming). This is convenient for mechanical testing - but not very meaningful for most deformation processing. 2. Toughness- Area beneath str
Sparkle of Diamonds
How to gage the extent of plastic deformation
Rockwell
Generation of a Magnetic Field - Within a Solid Material
39. - A magnetic field is induced in the material B= Magnetic Induction (tesla) inside the material mu= permeability of a solid
Hard Magnetic Materials
Large Hardness
Bending tests
Generation of a Magnetic Field - Within a Solid Material
40. Heat capacity.....- increases with temperature -for solids it reaches a limiting value of 3R
Two ways to measure heat capacity
Slip Bands
Energy States: Insulators and Semiconductors
Dependence of Heat Capacity on Temperature
41. Dramatic change in impact energy is associated with a change in fracture mode from brittle to ductile.
Ductile-to-Brittle Transition
Hardness
Holloman Equation
Opacifiers
42. Is reflected - absorbed - scattered - and/or transmitted: Io=It+Ia+Ir+Is
Plastic Deformation (Metals)
Superconductivity
Shear and Tensile Stress
Incident Light
43. 1. Hard disk drives (granular/perpendicular media) 2. Recording tape (particulate media)
Why materials fail in service
Ductile-to-Brittle Transition
Magnetic Storage Media Types
Dependence of Heat Capacity on Temperature
44. Metals are good conductors since their _______is only partially filled.
Thermal Stresses
Metallization
True Stress
Valence band
45. There is always some statistical distribution of flaws or defects.
Force Decomposition
Stress Intensity values
Electromigration
There is no perfect material?
46. Energy is stored as atomic vibrations - As temperature increases - the average energy of atomic vibrations increases.
Influence of Temperature on Magnetic Behavior
Intrinsic Semiconductors
Brittle Materials
Heat Capacity from an Atomic Prospective
47. Elastic means reversible! This is not a permanent deformation.
Charpy or Izod test
Elastic Deformation
Two kinds of Reflection
Metals: Resistivity vs. T - Impurities
48. Cracks pass through grains - often along specific crystal planes.
What do magnetic moments arise from?
Transgranular Fracture
Translucent
Hysteresis and Permanent Magnetization
49. The Magnetization of the material - and is essentially the dipole moment per unit volume. It is proportional to the applied field. Xm is the magnetic susceptibility.
M is known as what?
Electromigration
Shear and Tensile Stress
Refraction
50. These materials are "attracted" to magnetic fields.
Slip Bands
Luminescence examples
The three modes of crack surface displacement
Paramagnetic Materials
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