SUBJECTS
|
BROWSE
|
CAREER CENTER
|
POPULAR
|
JOIN
|
LOGIN
Business Skills
|
Soft Skills
|
Basic Literacy
|
Certifications
About
|
Help
|
Privacy
|
Terms
|
Email
Search
Test your basic knowledge |
Engineering Materials
Start Test
Study First
Subject
:
engineering
Instructions:
Answer 50 questions in 15 minutes.
If you are not ready to take this test, you can
study here
.
Match each statement with the correct term.
Don't refresh. All questions and answers are randomly picked and ordered every time you load a test.
This is a study tool. The 3 wrong answers for each question are randomly chosen from answers to other questions. So, you might find at times the answers obvious, but you will see it re-enforces your understanding as you take the test each time.
1. Loss of image transmission - You get no image - There is no light transmission - and therefore reflects - scatters - or absorbs ALL of it. Both mirrors and carbon black are opaque.
Soft Magnetic Materials
Lithography
Plastic Deformation (Metals)
Opaque
2. Large coercivities - Used for permanent magnets - Add particles/voids to inhibit domain wall motion - Example: tungsten steel
Rockwell
Hard Magnetic Materials
Sparkle of Diamonds
Yield and Reliability
3. Transformer cores require soft magnetic materials - which are easily magnetized and de-magnetized - and have high electrical resistivity - Energy losses in transformers could be minimized if their cores were fabricated such that the easy magnetizatio
Hardness
Electromigration
Iron-Silicon Alloy in Transformer Cores
Color
4. Not ALL the light is refracted - SOME is reflected. Materials with a high index of refraction also have high reflectance - High R is bad for lens applications - since this leads to undesirable light losses or interference.
Shear and Tensile Stress
Translucent
Hard Magnetic Materials
Reflectance of Non-Metals
5. Defines the ability of a material to resist fracture even when a flaw exists - Directly depends on size of flaw and material properties - K(ic) is a materials constant
Modulus of Rupture (MOR)
Internal magnetic moments
Stress Intensity Factor
Extrinsic Semiconductors
6. # of thermally generated electrons = # of holes (broken bonds)
The three modes of crack surface displacement
Intrinsic Semiconductors
The Transistor
Stages of Failure: Ductile Fracture
7. Resistance to plastic deformation of cracking in compression - and better wear properties.
Ductile Fracture
Color
Large Hardness
Refraction
8. 1. Yield = ratio of functional chips to total # of chips - Most yield loss during wafer processing - b/c of complex 2. Reliability - No device has infinite lifetime. Statistical methods to predict expected lifetime - Failure mechanisms: Diffusion reg
Ductile-to-Brittle Transition
Ductile Fracture
Yield and Reliability
Work Hardening
9. ...occurs in bcc metals but not in fcc metals.
Stress Intensity Factor
Modulus of Rupture (MOR)
Ductile Materials
Where does DBTT occur?
10. 1. Impose a compressive surface stress (to suppress surface cracks from growing) - Method 1: shot peening - Method 2: carburizing 2.Remove stress concentrators.
Sparkle of Diamonds
Elastic Deformation
To improve fatigue life
Extrinsic Semiconductors
11. 1. Tensile (opening) 2. Sliding 3. Tearing
Paramagnetic Materials
The three modes of crack surface displacement
Fatigue
Thermal Shock Resistance
12. Increase temperature - increase in interatomic separation - thermal expansion
Ductile-to-Brittle Transition
Thermal Expansion: Asymmetric curve
Response to a Magnetic Field
Bending tests
13. - The emission of light from a substance due to the absorption of energy. (Could be radiation - mechanical - or chemical energy. Could also be energetic particles.) - Traps and activator levels are produced by impurity additions to the material - Whe
Holloman Equation
Plastic Deformation (Metals)
Translucent
Luminescence
14. The Magnetization of the material - and is essentially the dipole moment per unit volume. It is proportional to the applied field. Xm is the magnetic susceptibility.
Reflection of Light for Metals
Internal magnetic moments
M is known as what?
Ductile Materials
15. - Metals that exhibit high ductility - exhibit high toughness. Ceramics are very strong - but have low ductility and low toughness - Polymers are very ductile but are not generally very strong in shear (compared to metals and ceramics). They have low
Charpy or Izod test
Stress Intensity values
Coherent
Rockwell
16. Emitted light is in phase
There is no perfect material?
Transgranular Fracture
HB (Brinell Hardness)
Coherent
17. They are used to assess properties of ceramics & glasses.
Conduction & Electron Transport
Hysteresis and Permanent Magnetization
Plastic Deformation (Metals)
Bending tests
18. (sigma)=K(sigma)^n . K = strength coefficient - n = work hardening rate or strain hardening exponent. Large n value increases strength and hardness.
Holloman Equation
Thermal Expansion: Asymmetric curve
HB (Brinell Hardness)
Magnetic Storage Media Types
19. Heat capacity.....- increases with temperature -for solids it reaches a limiting value of 3R
Dependence of Heat Capacity on Temperature
Slip Bands
Ductile-to-Brittle Transition
Thermal Conductivity
20. The size of the material changes with a change in temperature - polymers have the largest values
Engineering Fracture Performance
Refraction
Coefficient of Thermal Expansion
To improve fatigue life
21. 1. Hard disk drives (granular/perpendicular media) 2. Recording tape (particulate media)
Magnetic Storage Media Types
Diamagnetic Materials
High impact energy
Why fracture surfaces have faceted texture
22. As the applied field (H) increases the magnetic domains change shape and size by movement of domain boundaries.
Generation of a Magnetic Field - Vacuum
Refraction
Superconductivity
Domains in Ferromagnetic & Ferrimagnetic Materials
23. Superconductors expel magnetic fields - This is why a superconductor will float above a magnet.
Dependence of Heat Capacity on Temperature
Thermal Expansion: Asymmetric curve
Meissner Effect
Ductile Fracture
24. 1. Insulators: Higher energy states NOT ACCESSIBLE due to gap 2. Semiconductors: Higher energy states separated by a smaller gap.
How to gage the extent of plastic deformation
Energy States: Insulators and Semiconductors
Why fracture surfaces have faceted texture
Iron-Silicon Alloy in Transformer Cores
25. 1. Fluorescent Lamp - tungstate or silicate coating on inside of tube emits white light due to UV light generated inside the tube. 2. TV screen - emits light as electron beam is scanned back and forth.
Valence band
Luminescence examples
Refraction
Two ways to measure heat capacity
26. Different orientation of cleavage planes in grains.
Internal magnetic moments
Stages of Failure: Ductile Fracture
There is no perfect material?
Why fracture surfaces have faceted texture
27. heat flux = -(thermal conductivity)(temperature gradient) - Defines heat transfer by CONDUCTION
Warning
: Invalid argument supplied for foreach() in
/var/www/html/basicversity.com/show_quiz.php
on line
183
28. These materials are relatively unaffected by magnetic fields.
Diamagnetic Materials
Why materials fail in service
Bending tests
Stress Intensity Factor
29. Cracks pass through grains - often along specific crystal planes.
Etching
Transgranular Fracture
Plastic Deformation (Metals)
Charpy or Izod test
30. Metals are good conductors since their _______is only partially filled.
HB (Brinell Hardness)
Valence band
Impact energy
Reflection of Light for Metals
31. Growing interconnections to connect devices -Low electrical resistance - good adhesion to dielectric insulators.
Two ways to measure heat capacity
Intergranular Fracture
Lithography
Metallization
32. Undergo little or no plastic deformation.
Brittle Materials
Ductile Fracture
Plastic Deformation (Metals)
LASER
33. Increase temperature - no increase in interatomic separation - no thermal expansion
Thermal Stresses
Translucent
Thermal Expansion: Symmetric curve
Reflectance of Non-Metals
34. A three terminal device that acts like a simple "on-off" switch. (the basis of Integrated Circuits (IC) technology - used in computers - cell phones - automotive control - etc) - If voltage (potential) applied to the "gate" - current flows between th
Work Hardening
The Transistor
Metallization
Valence band
35. Stress concentration at a crack tips
Response to a Magnetic Field
Hysteresis and Permanent Magnetization
Charpy or Izod test
Griffith Crack Model
36. Digitalized data in the form of electrical signals are transferred to and recorded digitally on a magnetic medium (tape or disk) - This transference is accomplished by a recording system that consists of a read/write head - "write" or record data by
4 Types of Magnetism
Paramagnetic Materials
Engineering Fracture Performance
Magnetic Storage
37. Cp: Heat capacity at constant pressure Cv: Heat capacity at constant volume.
Generation of a Magnetic Field - Within a Solid Material
Two ways to measure heat capacity
Coefficient of Thermal Expansion
How an LCD works
38. Second phase particles with n > glass.
Heat Capacity from an Atomic Prospective
Opacifiers
Modulus of Rupture (MOR)
Lithography
39. Occurs at a single pore or other solid by refraction n = 1 for pore (air) n > 1 for the solid - n ~ 1.5 for glass - Scattering effect is maximized by pore/particle size within 400-700 nm range - Reason for Opacity in ceramics - glasses and polymers.
Stress Intensity Factor
Two kinds of Reflection
Luminescence examples
Scattering
40. Diffuse image
Translucent
Work Hardening
Liquid Crystal Displays (LCD's)
Scattering
41. Cracks propagate along grain boundaries.
Opacifiers
Intergranular Fracture
Insulators
Diamagnetic Materials
42. The ability of a material to absorb heat - Quantitatively: The energy required to produce a unit rise in temperature for one mole of a material.
Pure Semiconductors: Conductivity vs. T
Heat Capacity
What do magnetic moments arise from?
Large Hardness
43. Specular: light reflecting off a mirror (average) - Diffuse: light reflecting off a white wall (local)
Holloman Equation
Two kinds of Reflection
Oxidation
Metallization
44. Measures Hardness 1. psia = 500 x HB 2. MPa = 3.45 x HB
Elastic Deformation
Engineering Fracture Performance
HB (Brinell Hardness)
Force Decomposition
45. Becomes harder (more strain) to stretch (elongate)
Opacity
There is no perfect material?
Work Hardening
Conduction & Electron Transport
46. There is always some statistical distribution of flaws or defects.
There is no perfect material?
Magnetic Storage Media Types
Conduction & Electron Transport
Intrinsic Semiconductors
47. Typical loading conditions are _____ enough to break all inter-atomic bonds
Dependence of Heat Capacity on Temperature
Elastic Deformation
Diamagnetic Materials
Not severe
48. Materials change size when temperature is changed
Coefficient of Thermal Expansion
Thermal expansion
Modulus of Rupture (MOR)
Luminescence
49. This strength parameter is similar in magnitude to a tensile strength. Fracture occurs along the outermost sample edge - which is under a tensile load.
Reflectance of Non-Metals
Brittle Materials
Charpy or Izod test
Modulus of Rupture (MOR)
50. Width of smallest feature obtainable on Si surface
Fatigue
There is no perfect material?
Domains in Ferromagnetic & Ferrimagnetic Materials
Linewidth