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Engineering Materials

Subject : engineering
Instructions:
  • Answer 50 questions in 15 minutes.
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  • Match each statement with the correct term.
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This is a study tool. The 3 wrong answers for each question are randomly chosen from answers to other questions. So, you might find at times the answers obvious, but you will see it re-enforces your understanding as you take the test each time.
1. Found in 26 metals and hundreds of alloys & compounds - Tc= critical temperature = termperature below which material is superconductive.






2. Flaws and Defects - They concentrate stress locally to levels high enough to rupture bonds.






3. 1. Stress-strain behavior is not usually determined via tensile tests 2. Material fails before it yields 3. Bend/flexure tests are often used instead.






4. The ability of a material to transport heat - Atomic Perspective: Atomic vibrations and free electrons in hotter regions transport energy to cooler regions - Metals have the largest values






5. Heat capacity.....- increases with temperature -for solids it reaches a limiting value of 3R






6. # of thermally generated electrons = # of holes (broken bonds)






7. 1. Tensile (opening) 2. Sliding 3. Tearing






8. 1. Ability of the material to absorb energy prior to fracture 2. Short term dynamic stressing - Car collisions - Bullets - Athletic equipment 3. This is different than toughness; energy necessary to push a crack (flaw) through a material 4. Useful in






9. 1. Hard disk drives (granular/perpendicular media) 2. Recording tape (particulate media)






10. Occur when lots of dislocations move.






11. Occur due to: restrained thermal expansion/contraction -temperature gradients that lead to differential dimensional changes sigma = Thermal Stress






12. Different orientation of cleavage planes in grains.






13. These materials are relatively unaffected by magnetic fields.






14. Digitalized data in the form of electrical signals are transferred to and recorded digitally on a magnetic medium (tape or disk) - This transference is accomplished by a recording system that consists of a read/write head - "write" or record data by






15. Resistance to plastic deformation of cracking in compression - and better wear properties.






16. Metals are good conductors since their _______is only partially filled.






17. The size of the material changes with a change in temperature - polymers have the largest values






18. Undergo little or no plastic deformation.






19. - Metals that exhibit high ductility - exhibit high toughness. Ceramics are very strong - but have low ductility and low toughness - Polymers are very ductile but are not generally very strong in shear (compared to metals and ceramics). They have low






20. 1. Ductility- % elongation - % reduction in area - may be of use in metal forming operations (e.g. - stretch forming). This is convenient for mechanical testing - but not very meaningful for most deformation processing. 2. Toughness- Area beneath str






21. There is always some statistical distribution of flaws or defects.






22. This strength parameter is similar in magnitude to a tensile strength. Fracture occurs along the outermost sample edge - which is under a tensile load.






23. Loss of image transmission - You get no image - There is no light transmission - and therefore reflects - scatters - or absorbs ALL of it. Both mirrors and carbon black are opaque.






24. 1. Necking 2. Cavity formation 3. Cavity coalescence to form cracks 4. Crack propagation (growth) 5. Fracture






25. To build a device - various thin metal or insulating films are grown on top of each other - Evaporation - MBE - Sputtering - CVD (ALD)






26. Because of ionic & covalent-type bonding.






27. Process by which metal atoms diffuse because of a potential.






28. Failure under cyclic stress 1. It can cause part failure - even though (sigma)max < (sigma)c 2. Causes ~90% of mechanical engineering failures.






29. No appreciable plastic deformation. The crack propagates very fast; nearly perpendicular to applied stress. Cracks often propagate along specific crystal planes or boundaries.






30. Measures Hardness 1. psia = 500 x HB 2. MPa = 3.45 x HB






31. Rho=F/A - tau=G/A . Depending on what angle the force is applied - and what angle the crystal is at - it takes different amounts of force to induce plastic deformation.






32. If a material has ________ - then the field generated by those moments must be added to the induced field.






33. Is reflected - absorbed - scattered - and/or transmitted: Io=It+Ia+Ir+Is






34. Allows you to calculate what happened G=F' x cos(lambda) - F=F' x cos(phi)






35. The Magnetization of the material - and is essentially the dipole moment per unit volume. It is proportional to the applied field. Xm is the magnetic susceptibility.






36. 1. General yielding occurs if flaw size a < a(critical) 2. Catastrophic fast fracture occurs if flaw size a > a(critical)






37. 1. Imperfections increase resistivity - grain boundaries - dislocations - impurity atoms - vacancies 2. Resistivity - increases with temperature - wt% impurity - and %CW






38. Specular: light reflecting off a mirror (average) - Diffuse: light reflecting off a white wall (local)






39. Growth of an oxide layer by the reaction of oxygen with the substrate - Provides dopant masking and device isolation - IC technology uses 1. Thermal grown oxidation (dry) 2. Wet Oxidation 3. Selective Oxidation






40. The magnetic hysteresis phenomenon: Stage 1: Initial (unmagnetized state) Stage 2: Apply H - align domains Stage 3: Remove H - alignment remains => Permanent magnet Stage 4: Coercivity - Hc negative H needed to demagnitize Stage 5: Apply -H - align d






41. Not ALL the light is refracted - SOME is reflected. Materials with a high index of refraction also have high reflectance - High R is bad for lens applications - since this leads to undesirable light losses or interference.






42. For a metal - there is no ______ - only reflection






43. 1. Diamagnetic (Xm ~ 10^-5) - small and negative magnetic susceptibilities 2. Paramagnetic (Xm ~ 10^-4) - small and positive magnetic susceptibilities 3. Ferromagnetic - large magnetic susceptibilities 4. Ferrimagnetic (Xm as large as 10^6) - large m






44. A high index of refraction (n value) allows for multiple internal reactions.






45. Increase temperature - no increase in interatomic separation - no thermal expansion






46. Process by which geometric patterns are transferred from a mask (reticle) to a surface of a chip to form the device.






47. 1. Data for Pure Silicon - electrical conductivity increases with T - opposite to metals






48. As the applied field (H) increases the magnetic domains change shape and size by movement of domain boundaries.






49. heat flux = -(thermal conductivity)(temperature gradient) - Defines heat transfer by CONDUCTION

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50. Cp: Heat capacity at constant pressure Cv: Heat capacity at constant volume.







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