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Test your basic knowledge |
Engineering Materials
Start Test
Study First
Subject
:
engineering
Instructions:
Answer 50 questions in 15 minutes.
If you are not ready to take this test, you can
study here
.
Match each statement with the correct term.
Don't refresh. All questions and answers are randomly picked and ordered every time you load a test.
This is a study tool. The 3 wrong answers for each question are randomly chosen from answers to other questions. So, you might find at times the answers obvious, but you will see it re-enforces your understanding as you take the test each time.
1. Growth of an oxide layer by the reaction of oxygen with the substrate - Provides dopant masking and device isolation - IC technology uses 1. Thermal grown oxidation (dry) 2. Wet Oxidation 3. Selective Oxidation
The three modes of crack surface displacement
Oxidation
LASER
True Stress
2. (sigma)=F/Ai (rho)=(rho)'(1+(epsilon))
The Transistor
Thermal Stresses
True Stress
Thermal expansion
3. heat flux = -(thermal conductivity)(temperature gradient) - Defines heat transfer by CONDUCTION
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4. - The emission of light from a substance due to the absorption of energy. (Could be radiation - mechanical - or chemical energy. Could also be energetic particles.) - Traps and activator levels are produced by impurity additions to the material - Whe
Energy States: Insulators and Semiconductors
Heat Capacity
Luminescence
Large Hardness
5. Metals are good conductors since their _______is only partially filled.
Valence band
Superconductivity
Intrinsic Semiconductors
Domains in Ferromagnetic & Ferrimagnetic Materials
6. Becomes harder (more strain) to stretch (elongate)
Intergranular Fracture
Work Hardening
Magnetic Storage
4 Types of Magnetism
7. Increase temperature - no increase in interatomic separation - no thermal expansion
Why materials fail in service
How to gage the extent of plastic deformation
Why do ceramics have larger bonding energy?
Thermal Expansion: Symmetric curve
8. The ability of a material to transport heat - Atomic Perspective: Atomic vibrations and free electrons in hotter regions transport energy to cooler regions - Metals have the largest values
Pure Semiconductors: Conductivity vs. T
Transgranular Fracture
Thermal Conductivity
Fourier's Law
9. Light Amplification by Stimulated Emission of Radiation
Modulus of Rupture (MOR)
Film Deposition
LASER
Thermal expansion
10. 1. General yielding occurs if flaw size a < a(critical) 2. Catastrophic fast fracture occurs if flaw size a > a(critical)
Engineering Fracture Performance
Why materials fail in service
Two ways to measure heat capacity
Two kinds of Reflection
11. Cp: Heat capacity at constant pressure Cv: Heat capacity at constant volume.
Why fracture surfaces have faceted texture
Force Decomposition
Electromigration
Two ways to measure heat capacity
12. These materials are relatively unaffected by magnetic fields.
Generation of a Magnetic Field - Vacuum
Lithography
Work Hardening
Diamagnetic Materials
13. Flaws and Defects - They concentrate stress locally to levels high enough to rupture bonds.
Griffith Crack Model
Transparent
Why do ceramics have larger bonding energy?
Why materials fail in service
14. Specific heat = energy input/(mass*temperature change)
Magnetic Storage Media Types
Fatigue
Specific Heat
Brittle Ceramics
15. Width of smallest feature obtainable on Si surface
Linewidth
Thermal Expansion: Asymmetric curve
Heat Capacity from an Atomic Prospective
To improve fatigue life
16. These are liquid crystal polymers- not your normal "crystal" -Rigid - rod shaped molecules are aligned even in liquid form.
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17. Cracks pass through grains - often along specific crystal planes.
Transgranular Fracture
Reflection of Light for Metals
Reflectance of Non-Metals
Charpy or Izod test
18. Transformer cores require soft magnetic materials - which are easily magnetized and de-magnetized - and have high electrical resistivity - Energy losses in transformers could be minimized if their cores were fabricated such that the easy magnetizatio
Holloman Equation
The three modes of crack surface displacement
Fatigue
Iron-Silicon Alloy in Transformer Cores
19. (sigma)=K(sigma)^n . K = strength coefficient - n = work hardening rate or strain hardening exponent. Large n value increases strength and hardness.
Holloman Equation
Elastic Deformation
Thermal Shock Resistance
Heat Capacity
20. Different orientation of cleavage planes in grains.
Conduction & Electron Transport
Why fracture surfaces have faceted texture
Heat Capacity
LASER
21. Ohms Law: voltage drop = current * resistance
Holloman Equation
Electrical Conduction
Influence of Temperature on Magnetic Behavior
Rockwell
22. Plastic means permanent! When a small load is applied - bonds stretch & planes shear. Then when the load is no longer applied - the planes are still sheared.
Plastic Deformation (Metals)
High impact energy
Energy States: Insulators and Semiconductors
Thermal Expansion: Asymmetric curve
23. 1. Tc= critical temperature- if T>Tc not superconducting 2. Jc= critical current density - if J>Jc not superconducting 3. Hc= critical magnetic field - if H > Hc not superconducting
Elastic Deformation
Domains in Ferromagnetic & Ferrimagnetic Materials
Critical Properties of Superconductive Materials
Valence band
24. Increase temperature - increase in interatomic separation - thermal expansion
Thermal Expansion: Asymmetric curve
M is known as what?
Brittle Fracture
Work Hardening
25. No appreciable plastic deformation. The crack propagates very fast; nearly perpendicular to applied stress. Cracks often propagate along specific crystal planes or boundaries.
Thermal Expansion: Asymmetric curve
Brittle Fracture
How an LCD works
Magnetic Storage Media Types
26. Elastic means reversible! This is not a permanent deformation.
Elastic Deformation
Superconductivity
Domains in Ferromagnetic & Ferrimagnetic Materials
Paramagnetic Materials
27. Measures Hardness - No major sample damage - Each scales runs to 130 but only useful in range 20-100 - Minor load is 10 kg - Major load: 60 kg (diamond) - 100 kg (1/16 in. ball) - 150 kg (diamond)
Rockwell
How an LCD works
LASER
Why do ceramics have larger bonding energy?
28. Growing interconnections to connect devices -Low electrical resistance - good adhesion to dielectric insulators.
Elastic Deformation
Metallization
Critical Properties of Superconductive Materials
Thermal Expansion: Symmetric curve
29. 1. Tensile (opening) 2. Sliding 3. Tearing
Ductile Fracture
The three modes of crack surface displacement
Iron-Silicon Alloy in Transformer Cores
Lithography
30. Diffuse image
Translucent
Thermal Expansion: Asymmetric curve
Modulus of Rupture (MOR)
Plastic Deformation (Metals)
31. Rho=F/A - tau=G/A . Depending on what angle the force is applied - and what angle the crystal is at - it takes different amounts of force to induce plastic deformation.
Engineering Fracture Performance
Shear and Tensile Stress
Response to a Magnetic Field
Fatigue
32. Typical loading conditions are _____ enough to break all inter-atomic bonds
Luminescence
Thermal Stresses
Bending tests
Not severe
33. 1. Diamagnetic (Xm ~ 10^-5) - small and negative magnetic susceptibilities 2. Paramagnetic (Xm ~ 10^-4) - small and positive magnetic susceptibilities 3. Ferromagnetic - large magnetic susceptibilities 4. Ferrimagnetic (Xm as large as 10^6) - large m
4 Types of Magnetism
Relative Permeability
Scattering
Impact energy
34. Sigma=ln(li/lo)
Elastic Deformation
True Strain
Generation of a Magnetic Field - Within a Solid Material
Why fracture surfaces have faceted texture
35. Stress concentration at a crack tips
Griffith Crack Model
Refraction
Intrinsic Semiconductors
Elastic Deformation
36. Liquid polymer at room T - sandwiched between two sheets of glass - coated with transparent - electrically conductive film. - Character forming letters/ numbers etched on the face - Voltage applied disrupts the orientation of the rod- shaped molecule
Yield and Reliability
Impact - Toughness
Why fracture surfaces have faceted texture
How an LCD works
37. These materials are "attracted" to magnetic fields.
Internal magnetic moments
Paramagnetic Materials
Extrinsic Semiconductors
Ductile Fracture
38. ...occurs in bcc metals but not in fcc metals.
Where does DBTT occur?
Coherent
The three modes of crack surface displacement
Thermal expansion
39. This strength parameter is similar in magnitude to a tensile strength. Fracture occurs along the outermost sample edge - which is under a tensile load.
Etching
Transparent
Critical Properties of Superconductive Materials
Modulus of Rupture (MOR)
40. Allows flow of electrons in one direction only (useful to convert alternating current to direct current) - Result: no net current flow
IC Devices: P-N Rectifying Junction
Iron-Silicon Alloy in Transformer Cores
Internal magnetic moments
Lithography
41. Process by which geometric patterns are transferred from a mask (reticle) to a surface of a chip to form the device.
Fatigue
Lithography
Dependence of Heat Capacity on Temperature
Etching
42. -> fluorescent light - electron transitions occur randomly - light waves are out of phase with each other.
Work Hardening
Electromigration
Generation of a Magnetic Field - Within a Solid Material
Incoherent
43. Materials change size when temperature is changed
How to gage the extent of plastic deformation
Opacity
Incident Light
Thermal expansion
44. Because of ionic & covalent-type bonding.
Specific Heat
Why do ceramics have larger bonding energy?
Where does DBTT occur?
Oxidation
45. Undergo extensive plastic deformation prior to failure.
Ductile Materials
Meissner Effect
Refraction
Stress Intensity values
46. Created by current through a coil N= total number of turns L= length of turns (m) I= current (ampere) H= applied magnetic field (ampere-turns/m) Bo= magnetic flux density in a vacuum (tesla)
To improve fatigue life
Thermal Expansion: Asymmetric curve
Generation of a Magnetic Field - Vacuum
The Transistor
47. The ability of a material to absorb heat - Quantitatively: The energy required to produce a unit rise in temperature for one mole of a material.
Two ways to measure heat capacity
True Strain
Heat Capacity
Transgranular Fracture
48. Degree of opacity depends on size and number of particles - Opacity of metals is the result of conduction electrons absorbing photons in the visible range.
How an LCD works
Opacity
Thermal Stresses
Thermal Expansion: Symmetric curve
49. Occur when lots of dislocations move.
Slip Bands
Fatigue
Pure Semiconductors: Conductivity vs. T
The Transistor
50. 1. Insulators: Higher energy states NOT ACCESSIBLE due to gap 2. Semiconductors: Higher energy states separated by a smaller gap.
Energy States: Insulators and Semiconductors
Meissner Effect
Superconductivity
Transgranular Fracture