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Engineering Materials

Subject : engineering
Instructions:
  • Answer 50 questions in 15 minutes.
  • If you are not ready to take this test, you can study here.
  • Match each statement with the correct term.
  • Don't refresh. All questions and answers are randomly picked and ordered every time you load a test.

This is a study tool. The 3 wrong answers for each question are randomly chosen from answers to other questions. So, you might find at times the answers obvious, but you will see it re-enforces your understanding as you take the test each time.
1. Allows you to calculate what happened G=F' x cos(lambda) - F=F' x cos(phi)






2. Sigma=ln(li/lo)






3. 1. Impose a compressive surface stress (to suppress surface cracks from growing) - Method 1: shot peening - Method 2: carburizing 2.Remove stress concentrators.






4. Typical loading conditions are _____ enough to break all inter-atomic bonds






5. Transmitted light distorts electron clouds - The velocity of light in a material is lower than in a vacuum - Adding large ions to glass decreases the speed of light in the glass - Light can be "bent" (or refracted) as it passes through a transparent






6. Cracks propagate along grain boundaries.






7. Occur when lots of dislocations move.






8. Increase temperature - increase in interatomic separation - thermal expansion






9. Measures Hardness 1. psia = 500 x HB 2. MPa = 3.45 x HB






10. Second phase particles with n > glass.






11. 1. Yield = ratio of functional chips to total # of chips - Most yield loss during wafer processing - b/c of complex 2. Reliability - No device has infinite lifetime. Statistical methods to predict expected lifetime - Failure mechanisms: Diffusion reg






12. (sigma)=K(sigma)^n . K = strength coefficient - n = work hardening rate or strain hardening exponent. Large n value increases strength and hardness.






13. Plastic means permanent! When a small load is applied - bonds stretch & planes shear. Then when the load is no longer applied - the planes are still sheared.






14. Growing interconnections to connect devices -Low electrical resistance - good adhesion to dielectric insulators.






15. Increase temperature - no increase in interatomic separation - no thermal expansion






16. A measure of the ease with which a B field can be induced inside a material.






17. Is reflected - absorbed - scattered - and/or transmitted: Io=It+Ia+Ir+Is






18. 1. Insulators: Higher energy states NOT ACCESSIBLE due to gap 2. Semiconductors: Higher energy states separated by a smaller gap.






19. 1. Ability of the material to absorb energy prior to fracture 2. Short term dynamic stressing - Car collisions - Bullets - Athletic equipment 3. This is different than toughness; energy necessary to push a crack (flaw) through a material 4. Useful in






20. They are used to assess properties of ceramics & glasses.






21. Defines the ability of a material to resist fracture even when a flaw exists - Directly depends on size of flaw and material properties - K(ic) is a materials constant






22. Heat capacity.....- increases with temperature -for solids it reaches a limiting value of 3R






23. - Metals that exhibit high ductility - exhibit high toughness. Ceramics are very strong - but have low ductility and low toughness - Polymers are very ductile but are not generally very strong in shear (compared to metals and ceramics). They have low






24. The size of the material changes with a change in temperature - polymers have the largest values






25. 1. Fluorescent Lamp - tungstate or silicate coating on inside of tube emits white light due to UV light generated inside the tube. 2. TV screen - emits light as electron beam is scanned back and forth.






26. Reflectiviy is between 0.90 and 0.95 - Metal surfaces appear shiny - Most of absorbed light is reflected at the same wavelength (NO REFRACTION) - Small fraction of light may be absorbed - Color of reflected light depends on wavelength distribution of






27. Liquid polymer at room T - sandwiched between two sheets of glass - coated with transparent - electrically conductive film. - Character forming letters/ numbers etched on the face - Voltage applied disrupts the orientation of the rod- shaped molecule






28. These materials are relatively unaffected by magnetic fields.






29. Cp: Heat capacity at constant pressure Cv: Heat capacity at constant volume.






30. # of thermally generated electrons = # of holes (broken bonds)






31. 1. Tc= critical temperature- if T>Tc not superconducting 2. Jc= critical current density - if J>Jc not superconducting 3. Hc= critical magnetic field - if H > Hc not superconducting






32. Growth of an oxide layer by the reaction of oxygen with the substrate - Provides dopant masking and device isolation - IC technology uses 1. Thermal grown oxidation (dry) 2. Wet Oxidation 3. Selective Oxidation






33. This strength parameter is similar in magnitude to a tensile strength. Fracture occurs along the outermost sample edge - which is under a tensile load.






34. The ability of a material to absorb heat - Quantitatively: The energy required to produce a unit rise in temperature for one mole of a material.






35. The magnetic hysteresis phenomenon: Stage 1: Initial (unmagnetized state) Stage 2: Apply H - align domains Stage 3: Remove H - alignment remains => Permanent magnet Stage 4: Coercivity - Hc negative H needed to demagnitize Stage 5: Apply -H - align d






36. Undergo extensive plastic deformation prior to failure.






37. Becomes harder (more strain) to stretch (elongate)






38. Emitted light is in phase






39. 1. Electron motions 2. The spins on electrons - Net atomic magnetic moment: sum of moments from all electrons.






40. Cracks pass through grains - often along specific crystal planes.






41. There is always some statistical distribution of flaws or defects.






42. Hardness is the resistance of a material to deformation by indentation - Useful in quality control - Hardness can provide a qualitative assessment of strength - Hardness cannot be used to quantitatively infer strength or ductility.






43. As the applied field (H) increases the magnetic domains change shape and size by movement of domain boundaries.






44. No appreciable plastic deformation. The crack propagates very fast; nearly perpendicular to applied stress. Cracks often propagate along specific crystal planes or boundaries.






45. Specific heat = energy input/(mass*temperature change)






46. A parallel-plate capacitor involves an insulator - or dielectric - between two metal electrodes. The charge density buildup at the capacitor surface is related to the dielectric constant of the material.






47. Ability to transmit a clear image - The image is clear.






48. Specular: light reflecting off a mirror (average) - Diffuse: light reflecting off a white wall (local)






49. ...occurs in bcc metals but not in fcc metals.






50. Because of ionic & covalent-type bonding.







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