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Engineering Materials

Subject : engineering
Instructions:
  • Answer 50 questions in 15 minutes.
  • If you are not ready to take this test, you can study here.
  • Match each statement with the correct term.
  • Don't refresh. All questions and answers are randomly picked and ordered every time you load a test.

This is a study tool. The 3 wrong answers for each question are randomly chosen from answers to other questions. So, you might find at times the answers obvious, but you will see it re-enforces your understanding as you take the test each time.
1. The size of the material changes with a change in temperature - polymers have the largest values






2. 1. Data for Pure Silicon - electrical conductivity increases with T - opposite to metals






3. Metals are good conductors since their _______is only partially filled.






4. Typical loading conditions are _____ enough to break all inter-atomic bonds






5. Undergo extensive plastic deformation prior to failure.






6. Different orientation of cleavage planes in grains.






7. Allows you to calculate what happened G=F' x cos(lambda) - F=F' x cos(phi)






8. Created by current through a coil N= total number of turns L= length of turns (m) I= current (ampere) H= applied magnetic field (ampere-turns/m) Bo= magnetic flux density in a vacuum (tesla)






9. They are used to assess properties of ceramics & glasses.






10. Transformer cores require soft magnetic materials - which are easily magnetized and de-magnetized - and have high electrical resistivity - Energy losses in transformers could be minimized if their cores were fabricated such that the easy magnetizatio






11. Failure under cyclic stress 1. It can cause part failure - even though (sigma)max < (sigma)c 2. Causes ~90% of mechanical engineering failures.






12. (sigma)=F/Ai (rho)=(rho)'(1+(epsilon))






13. No appreciable plastic deformation. The crack propagates very fast; nearly perpendicular to applied stress. Cracks often propagate along specific crystal planes or boundaries.






14. High toughness; material resists crack propagation.






15. Occur when lots of dislocations move.






16. Measures Hardness 1. psia = 500 x HB 2. MPa = 3.45 x HB






17. 1. Stress-strain behavior is not usually determined via tensile tests 2. Material fails before it yields 3. Bend/flexure tests are often used instead.






18. 1. General yielding occurs if flaw size a < a(critical) 2. Catastrophic fast fracture occurs if flaw size a > a(critical)






19. Wet: isotropic - under cut Dry: ansiotropic - directional






20. 1. Hard disk drives (granular/perpendicular media) 2. Recording tape (particulate media)






21. Impurities added to the semiconductor that contribute to excess electrons or holes. Doping = intentional impurities.






22. 1. Imperfections increase resistivity - grain boundaries - dislocations - impurity atoms - vacancies 2. Resistivity - increases with temperature - wt% impurity - and %CW






23. Diffuse image






24. Specular: light reflecting off a mirror (average) - Diffuse: light reflecting off a white wall (local)






25. Found in 26 metals and hundreds of alloys & compounds - Tc= critical temperature = termperature below which material is superconductive.






26. Stress concentration at a crack tips






27. With Increasing temperature - the saturation magnetization diminishes gradually and then abruptly drops to zero at Curie Temperature - Tc.






28. Occurs at a single pore or other solid by refraction n = 1 for pore (air) n > 1 for the solid - n ~ 1.5 for glass - Scattering effect is maximized by pore/particle size within 400-700 nm range - Reason for Opacity in ceramics - glasses and polymers.






29. Width of smallest feature obtainable on Si surface






30. Increase temperature - increase in interatomic separation - thermal expansion






31. 1. Tensile (opening) 2. Sliding 3. Tearing






32. Is analogous to toughness.






33. Small Coercivities - Used for electric motors - Example: commercial iron 99.95 Fe






34. Degree of opacity depends on size and number of particles - Opacity of metals is the result of conduction electrons absorbing photons in the visible range.






35. - A magnetic field is induced in the material B= Magnetic Induction (tesla) inside the material mu= permeability of a solid






36. Elastic means reversible! This is not a permanent deformation.






37. 1. Yield = ratio of functional chips to total # of chips - Most yield loss during wafer processing - b/c of complex 2. Reliability - No device has infinite lifetime. Statistical methods to predict expected lifetime - Failure mechanisms: Diffusion reg






38. The magnetic hysteresis phenomenon: Stage 1: Initial (unmagnetized state) Stage 2: Apply H - align domains Stage 3: Remove H - alignment remains => Permanent magnet Stage 4: Coercivity - Hc negative H needed to demagnitize Stage 5: Apply -H - align d






39. Resistance to plastic deformation of cracking in compression - and better wear properties.






40. The ability of a material to be rapidly cooled and not fracture






41. Defines the ability of a material to resist fracture even when a flaw exists - Directly depends on size of flaw and material properties - K(ic) is a materials constant






42. Without passing a current a continually varying magnetic field will cause a current to flow






43. 1. Necking 2. Cavity formation 3. Cavity coalescence to form cracks 4. Crack propagation (growth) 5. Fracture






44. Reflectiviy is between 0.90 and 0.95 - Metal surfaces appear shiny - Most of absorbed light is reflected at the same wavelength (NO REFRACTION) - Small fraction of light may be absorbed - Color of reflected light depends on wavelength distribution of






45. As the applied field (H) increases the magnetic domains change shape and size by movement of domain boundaries.






46. A three terminal device that acts like a simple "on-off" switch. (the basis of Integrated Circuits (IC) technology - used in computers - cell phones - automotive control - etc) - If voltage (potential) applied to the "gate" - current flows between th






47. A high index of refraction (n value) allows for multiple internal reactions.






48. These are liquid crystal polymers- not your normal "crystal" -Rigid - rod shaped molecules are aligned even in liquid form.

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49. 1. Ductility- % elongation - % reduction in area - may be of use in metal forming operations (e.g. - stretch forming). This is convenient for mechanical testing - but not very meaningful for most deformation processing. 2. Toughness- Area beneath str






50. Becomes harder (more strain) to stretch (elongate)






Can you answer 50 questions in 15 minutes?



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