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Engineering Materials

Subject : engineering
Instructions:
  • Answer 50 questions in 15 minutes.
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  • Match each statement with the correct term.
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This is a study tool. The 3 wrong answers for each question are randomly chosen from answers to other questions. So, you might find at times the answers obvious, but you will see it re-enforces your understanding as you take the test each time.
1. Light Amplification by Stimulated Emission of Radiation






2. -> fluorescent light - electron transitions occur randomly - light waves are out of phase with each other.






3. With Increasing temperature - the saturation magnetization diminishes gradually and then abruptly drops to zero at Curie Temperature - Tc.






4. There is always some statistical distribution of flaws or defects.






5. 1. Yield = ratio of functional chips to total # of chips - Most yield loss during wafer processing - b/c of complex 2. Reliability - No device has infinite lifetime. Statistical methods to predict expected lifetime - Failure mechanisms: Diffusion reg






6. Occur due to: restrained thermal expansion/contraction -temperature gradients that lead to differential dimensional changes sigma = Thermal Stress






7. 1. Necking 2. Cavity formation 3. Cavity coalescence to form cracks 4. Crack propagation (growth) 5. Fracture






8. Another optical property - Depends on the wavelength of the visible spectrum.






9. Emitted light is in phase






10. Small Coercivities - Used for electric motors - Example: commercial iron 99.95 Fe






11. Wet: isotropic - under cut Dry: ansiotropic - directional






12. Dramatic change in impact energy is associated with a change in fracture mode from brittle to ductile.






13. Ability to transmit a clear image - The image is clear.






14. Created by current through a coil N= total number of turns L= length of turns (m) I= current (ampere) H= applied magnetic field (ampere-turns/m) Bo= magnetic flux density in a vacuum (tesla)






15. Dimples on fracture surface correspond to microcavities that initiate crack formation.






16. Stress concentration at a crack tips






17. Specific heat = energy input/(mass*temperature change)






18. As the applied field (H) increases the magnetic domains change shape and size by movement of domain boundaries.






19. These materials are relatively unaffected by magnetic fields.






20. These materials are "attracted" to magnetic fields.






21. heat flux = -(thermal conductivity)(temperature gradient) - Defines heat transfer by CONDUCTION

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22. Second phase particles with n > glass.






23. Energy is stored as atomic vibrations - As temperature increases - the average energy of atomic vibrations increases.






24. Hardness is the resistance of a material to deformation by indentation - Useful in quality control - Hardness can provide a qualitative assessment of strength - Hardness cannot be used to quantitatively infer strength or ductility.






25. Transmitted light distorts electron clouds - The velocity of light in a material is lower than in a vacuum - Adding large ions to glass decreases the speed of light in the glass - Light can be "bent" (or refracted) as it passes through a transparent






26. 1. Hard disk drives (granular/perpendicular media) 2. Recording tape (particulate media)






27. A measure of the ease with which a B field can be induced inside a material.






28. Flaws and Defects - They concentrate stress locally to levels high enough to rupture bonds.






29. Materials change size when temperature is changed






30. Becomes harder (more strain) to stretch (elongate)






31. This strength parameter is similar in magnitude to a tensile strength. Fracture occurs along the outermost sample edge - which is under a tensile load.






32. A three terminal device that acts like a simple "on-off" switch. (the basis of Integrated Circuits (IC) technology - used in computers - cell phones - automotive control - etc) - If voltage (potential) applied to the "gate" - current flows between th






33. Allows flow of electrons in one direction only (useful to convert alternating current to direct current) - Result: no net current flow






34. A parallel-plate capacitor involves an insulator - or dielectric - between two metal electrodes. The charge density buildup at the capacitor surface is related to the dielectric constant of the material.






35. Is analogous to toughness.






36. The ability of a material to be rapidly cooled and not fracture






37. The ability of a material to absorb heat - Quantitatively: The energy required to produce a unit rise in temperature for one mole of a material.






38. The ability of a material to transport heat - Atomic Perspective: Atomic vibrations and free electrons in hotter regions transport energy to cooler regions - Metals have the largest values






39. Loss of image transmission - You get no image - There is no light transmission - and therefore reflects - scatters - or absorbs ALL of it. Both mirrors and carbon black are opaque.






40. ...occurs in bcc metals but not in fcc metals.






41. Found in 26 metals and hundreds of alloys & compounds - Tc= critical temperature = termperature below which material is superconductive.






42. These are liquid crystal polymers- not your normal "crystal" -Rigid - rod shaped molecules are aligned even in liquid form.

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43. Occur when lots of dislocations move.






44. Sigma=ln(li/lo)






45. Measures impact energy 1. Strike a notched sample with an anvil 2. Measure how far the anvil travels following impact 3. Distance traveled is related to energy required to break the sample 4. Very high rate of loading. Makes materials more "brittle."






46. No appreciable plastic deformation. The crack propagates very fast; nearly perpendicular to applied stress. Cracks often propagate along specific crystal planes or boundaries.






47. The Magnetization of the material - and is essentially the dipole moment per unit volume. It is proportional to the applied field. Xm is the magnetic susceptibility.






48. To build a device - various thin metal or insulating films are grown on top of each other - Evaporation - MBE - Sputtering - CVD (ALD)






49. If a material has ________ - then the field generated by those moments must be added to the induced field.






50. Allows you to calculate what happened G=F' x cos(lambda) - F=F' x cos(phi)







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