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Test your basic knowledge |
Engineering Materials
Start Test
Study First
Subject
:
engineering
Instructions:
Answer 50 questions in 15 minutes.
If you are not ready to take this test, you can
study here
.
Match each statement with the correct term.
Don't refresh. All questions and answers are randomly picked and ordered every time you load a test.
This is a study tool. The 3 wrong answers for each question are randomly chosen from answers to other questions. So, you might find at times the answers obvious, but you will see it re-enforces your understanding as you take the test each time.
1. Growth of an oxide layer by the reaction of oxygen with the substrate - Provides dopant masking and device isolation - IC technology uses 1. Thermal grown oxidation (dry) 2. Wet Oxidation 3. Selective Oxidation
Oxidation
Transgranular Fracture
Elastic Deformation
Not severe
2. Without passing a current a continually varying magnetic field will cause a current to flow
To improve fatigue life
Hard Magnetic Materials
Response to a Magnetic Field
Elastic Deformation
3. Cracks propagate along grain boundaries.
Film Deposition
Metals: Resistivity vs. T - Impurities
Incident Light
Intergranular Fracture
4. 1. Imperfections increase resistivity - grain boundaries - dislocations - impurity atoms - vacancies 2. Resistivity - increases with temperature - wt% impurity - and %CW
Modulus of Rupture (MOR)
Thermal Conductivity
Metals: Resistivity vs. T - Impurities
Meissner Effect
5. No appreciable plastic deformation. The crack propagates very fast; nearly perpendicular to applied stress. Cracks often propagate along specific crystal planes or boundaries.
Brittle Fracture
Luminescence examples
Bending tests
True Strain
6. ...occurs in bcc metals but not in fcc metals.
True Stress
Opaque
Translucent
Where does DBTT occur?
7. Increase temperature - no increase in interatomic separation - no thermal expansion
Incoherent
Thermal expansion
Thermal Expansion: Symmetric curve
Holloman Equation
8. A three terminal device that acts like a simple "on-off" switch. (the basis of Integrated Circuits (IC) technology - used in computers - cell phones - automotive control - etc) - If voltage (potential) applied to the "gate" - current flows between th
Insulators
LASER
True Strain
The Transistor
9. Becomes harder (more strain) to stretch (elongate)
Work Hardening
Yield and Reliability
Shear and Tensile Stress
Why do ceramics have larger bonding energy?
10. Small Coercivities - Used for electric motors - Example: commercial iron 99.95 Fe
Thermal Expansion: Symmetric curve
Two kinds of Reflection
Soft Magnetic Materials
Opaque
11. Occurs at a single pore or other solid by refraction n = 1 for pore (air) n > 1 for the solid - n ~ 1.5 for glass - Scattering effect is maximized by pore/particle size within 400-700 nm range - Reason for Opacity in ceramics - glasses and polymers.
Thermal Conductivity
Scattering
IC Devices: P-N Rectifying Junction
Fatigue
12. Different orientation of cleavage planes in grains.
Opaque
True Strain
Hardness
Why fracture surfaces have faceted texture
13. Resistance to plastic deformation of cracking in compression - and better wear properties.
Ductile-to-Brittle Transition
Large Hardness
Response to a Magnetic Field
Dependence of Heat Capacity on Temperature
14. 1. Electron motions 2. The spins on electrons - Net atomic magnetic moment: sum of moments from all electrons.
Specific Heat
Etching
What do magnetic moments arise from?
Fourier's Law
15. Materials change size when temperature is changed
Generation of a Magnetic Field - Within a Solid Material
Bending tests
Thermal expansion
Brittle Fracture
16. Measures impact energy 1. Strike a notched sample with an anvil 2. Measure how far the anvil travels following impact 3. Distance traveled is related to energy required to break the sample 4. Very high rate of loading. Makes materials more "brittle."
Charpy or Izod test
How an LCD works
True Strain
Internal magnetic moments
17. Allows flow of electrons in one direction only (useful to convert alternating current to direct current) - Result: no net current flow
IC Devices: P-N Rectifying Junction
Meissner Effect
Transgranular Fracture
Ductile Fracture
18. Not ALL the light is refracted - SOME is reflected. Materials with a high index of refraction also have high reflectance - High R is bad for lens applications - since this leads to undesirable light losses or interference.
Ductile-to-Brittle Transition
Metallization
Reflectance of Non-Metals
LASER
19. This strength parameter is similar in magnitude to a tensile strength. Fracture occurs along the outermost sample edge - which is under a tensile load.
Soft Magnetic Materials
Modulus of Rupture (MOR)
What do magnetic moments arise from?
Incoherent
20. Wet: isotropic - under cut Dry: ansiotropic - directional
Etching
To improve fatigue life
Elastic Deformation
How an LCD works
21. These materials are relatively unaffected by magnetic fields.
Metallization
Two kinds of Reflection
Diamagnetic Materials
Modulus of Rupture (MOR)
22. Specular: light reflecting off a mirror (average) - Diffuse: light reflecting off a white wall (local)
Thermal Expansion: Symmetric curve
Two kinds of Reflection
Impact energy
Stress Intensity values
23. Is analogous to toughness.
Holloman Equation
Impact energy
Relative Permeability
True Strain
24. Heat capacity.....- increases with temperature -for solids it reaches a limiting value of 3R
Elastic Deformation
Bending tests
Hard Magnetic Materials
Dependence of Heat Capacity on Temperature
25. They are used to assess properties of ceramics & glasses.
Bending tests
Heat Capacity
Color
Refraction
26. Cracks pass through grains - often along specific crystal planes.
Scattering
Transgranular Fracture
Incident Light
Where does DBTT occur?
27. Ohms Law: voltage drop = current * resistance
Linewidth
The three modes of crack surface displacement
Ductile Fracture
Electrical Conduction
28. A parallel-plate capacitor involves an insulator - or dielectric - between two metal electrodes. The charge density buildup at the capacitor surface is related to the dielectric constant of the material.
Why materials fail in service
Ductile-to-Brittle Transition
Ductile Materials
Insulators
29. heat flux = -(thermal conductivity)(temperature gradient) - Defines heat transfer by CONDUCTION
30. The ability of a material to transport heat - Atomic Perspective: Atomic vibrations and free electrons in hotter regions transport energy to cooler regions - Metals have the largest values
Luminescence
Luminescence examples
Hardness
Thermal Conductivity
31. Failure under cyclic stress 1. It can cause part failure - even though (sigma)max < (sigma)c 2. Causes ~90% of mechanical engineering failures.
Oxidation
Fatigue
What do magnetic moments arise from?
Where does DBTT occur?
32. 1. Diamagnetic (Xm ~ 10^-5) - small and negative magnetic susceptibilities 2. Paramagnetic (Xm ~ 10^-4) - small and positive magnetic susceptibilities 3. Ferromagnetic - large magnetic susceptibilities 4. Ferrimagnetic (Xm as large as 10^6) - large m
4 Types of Magnetism
Thermal Expansion: Asymmetric curve
Shear and Tensile Stress
Sparkle of Diamonds
33. 1. Tc= critical temperature- if T>Tc not superconducting 2. Jc= critical current density - if J>Jc not superconducting 3. Hc= critical magnetic field - if H > Hc not superconducting
Critical Properties of Superconductive Materials
True Stress
Why materials fail in service
Fourier's Law
34. Plastic means permanent! When a small load is applied - bonds stretch & planes shear. Then when the load is no longer applied - the planes are still sheared.
Not severe
LASER
Incident Light
Plastic Deformation (Metals)
35. Dimples on fracture surface correspond to microcavities that initiate crack formation.
Stress Intensity Factor
Response to a Magnetic Field
Internal magnetic moments
Ductile Fracture
36. Digitalized data in the form of electrical signals are transferred to and recorded digitally on a magnetic medium (tape or disk) - This transference is accomplished by a recording system that consists of a read/write head - "write" or record data by
Sparkle of Diamonds
The Transistor
Magnetic Storage
Brittle Fracture
37. For a metal - there is no ______ - only reflection
Specific Heat
Intrinsic Semiconductors
Internal magnetic moments
Refraction
38. Undergo little or no plastic deformation.
Brittle Materials
Critical Properties of Superconductive Materials
Yield and Reliability
Large Hardness
39. - Metals that exhibit high ductility - exhibit high toughness. Ceramics are very strong - but have low ductility and low toughness - Polymers are very ductile but are not generally very strong in shear (compared to metals and ceramics). They have low
Thermal Expansion: Symmetric curve
Thermal Expansion: Asymmetric curve
Fatigue
Stress Intensity values
40. Transformer cores require soft magnetic materials - which are easily magnetized and de-magnetized - and have high electrical resistivity - Energy losses in transformers could be minimized if their cores were fabricated such that the easy magnetizatio
Iron-Silicon Alloy in Transformer Cores
True Stress
Ductile Materials
Electrical Conduction
41. Loss of image transmission - You get no image - There is no light transmission - and therefore reflects - scatters - or absorbs ALL of it. Both mirrors and carbon black are opaque.
Response to a Magnetic Field
Opaque
Why materials fail in service
Opacity
42. - The emission of light from a substance due to the absorption of energy. (Could be radiation - mechanical - or chemical energy. Could also be energetic particles.) - Traps and activator levels are produced by impurity additions to the material - Whe
Luminescence
Paramagnetic Materials
Coefficient of Thermal Expansion
Thermal expansion
43. The ability of a material to absorb heat - Quantitatively: The energy required to produce a unit rise in temperature for one mole of a material.
Meissner Effect
Heat Capacity
Thermal Expansion: Asymmetric curve
Holloman Equation
44. Defines the ability of a material to resist fracture even when a flaw exists - Directly depends on size of flaw and material properties - K(ic) is a materials constant
Metallization
Sparkle of Diamonds
Heat Capacity from an Atomic Prospective
Stress Intensity Factor
45. 1. Data for Pure Silicon - electrical conductivity increases with T - opposite to metals
Large Hardness
Pure Semiconductors: Conductivity vs. T
Extrinsic Semiconductors
Liquid Crystal Displays (LCD's)
46. Rho=F/A - tau=G/A . Depending on what angle the force is applied - and what angle the crystal is at - it takes different amounts of force to induce plastic deformation.
Iron-Silicon Alloy in Transformer Cores
Domains in Ferromagnetic & Ferrimagnetic Materials
Shear and Tensile Stress
IC Devices: P-N Rectifying Junction
47. The ability of a material to be rapidly cooled and not fracture
Ductile Fracture
Iron-Silicon Alloy in Transformer Cores
Thermal Shock Resistance
Holloman Equation
48. (sigma)=K(sigma)^n . K = strength coefficient - n = work hardening rate or strain hardening exponent. Large n value increases strength and hardness.
The three modes of crack surface displacement
Lithography
Holloman Equation
Hard Magnetic Materials
49. 1. Insulators: Higher energy states NOT ACCESSIBLE due to gap 2. Semiconductors: Higher energy states separated by a smaller gap.
Hard Magnetic Materials
Paramagnetic Materials
Holloman Equation
Energy States: Insulators and Semiconductors
50. - A magnetic field is induced in the material B= Magnetic Induction (tesla) inside the material mu= permeability of a solid
4 Types of Magnetism
Refraction
Generation of a Magnetic Field - Within a Solid Material
Liquid Crystal Displays (LCD's)