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Test your basic knowledge |
Engineering Materials
Start Test
Study First
Subject
:
engineering
Instructions:
Answer 50 questions in 15 minutes.
If you are not ready to take this test, you can
study here
.
Match each statement with the correct term.
Don't refresh. All questions and answers are randomly picked and ordered every time you load a test.
This is a study tool. The 3 wrong answers for each question are randomly chosen from answers to other questions. So, you might find at times the answers obvious, but you will see it re-enforces your understanding as you take the test each time.
1. Ability to transmit a clear image - The image is clear.
Thermal Shock Resistance
Transparent
Incoherent
Two ways to measure heat capacity
2. There is always some statistical distribution of flaws or defects.
Color
There is no perfect material?
Generation of a Magnetic Field - Within a Solid Material
Coherent
3. Liquid polymer at room T - sandwiched between two sheets of glass - coated with transparent - electrically conductive film. - Character forming letters/ numbers etched on the face - Voltage applied disrupts the orientation of the rod- shaped molecule
Modulus of Rupture (MOR)
Influence of Temperature on Magnetic Behavior
Meissner Effect
How an LCD works
4. Elastic means reversible! This is not a permanent deformation.
Critical Properties of Superconductive Materials
Pure Semiconductors: Conductivity vs. T
Elastic Deformation
Paramagnetic Materials
5. 1. Metals: Thermal energy puts many electrons into a higher energy state. 2. Energy States: Nearby energy states are accessible by thermal fluctuations.
Conduction & Electron Transport
Translucent
Opacifiers
Film Deposition
6. Cracks pass through grains - often along specific crystal planes.
Metallization
Transgranular Fracture
Not severe
Relative Permeability
7. Reflectiviy is between 0.90 and 0.95 - Metal surfaces appear shiny - Most of absorbed light is reflected at the same wavelength (NO REFRACTION) - Small fraction of light may be absorbed - Color of reflected light depends on wavelength distribution of
Transparent
Opacifiers
Reflection of Light for Metals
How to gage the extent of plastic deformation
8. Impurities added to the semiconductor that contribute to excess electrons or holes. Doping = intentional impurities.
Linewidth
Internal magnetic moments
Transgranular Fracture
Extrinsic Semiconductors
9. As the applied field (H) increases the magnetic domains change shape and size by movement of domain boundaries.
Domains in Ferromagnetic & Ferrimagnetic Materials
Why fracture surfaces have faceted texture
Opaque
Elastic Deformation
10. To build a device - various thin metal or insulating films are grown on top of each other - Evaporation - MBE - Sputtering - CVD (ALD)
The three modes of crack surface displacement
Ductile Materials
Film Deposition
Intrinsic Semiconductors
11. Dramatic change in impact energy is associated with a change in fracture mode from brittle to ductile.
Elastic Deformation
Ductile-to-Brittle Transition
Slip Bands
Thermal Expansion: Asymmetric curve
12. The magnetic hysteresis phenomenon: Stage 1: Initial (unmagnetized state) Stage 2: Apply H - align domains Stage 3: Remove H - alignment remains => Permanent magnet Stage 4: Coercivity - Hc negative H needed to demagnitize Stage 5: Apply -H - align d
Hysteresis and Permanent Magnetization
Thermal Conductivity
Energy States: Insulators and Semiconductors
Generation of a Magnetic Field - Vacuum
13. 1. Data for Pure Silicon - electrical conductivity increases with T - opposite to metals
Slip Bands
Thermal Shock Resistance
Luminescence
Pure Semiconductors: Conductivity vs. T
14. High toughness; material resists crack propagation.
Opaque
Luminescence
High impact energy
Impact energy
15. Occur when lots of dislocations move.
Relative Permeability
Oxidation
Large Hardness
Slip Bands
16. ...occurs in bcc metals but not in fcc metals.
Where does DBTT occur?
Pure Semiconductors: Conductivity vs. T
Coherent
Thermal Expansion: Symmetric curve
17. Undergo little or no plastic deformation.
Response to a Magnetic Field
Brittle Materials
Dependence of Heat Capacity on Temperature
Holloman Equation
18. Process by which geometric patterns are transferred from a mask (reticle) to a surface of a chip to form the device.
Electromigration
True Strain
Force Decomposition
Lithography
19. The Magnetization of the material - and is essentially the dipole moment per unit volume. It is proportional to the applied field. Xm is the magnetic susceptibility.
M is known as what?
Fourier's Law
Meissner Effect
Impact energy
20. Wet: isotropic - under cut Dry: ansiotropic - directional
Fourier's Law
Etching
Lithography
Fatigue
21. Is analogous to toughness.
Impact energy
Scattering
Refraction
Brittle Fracture
22. Cracks propagate along grain boundaries.
Intergranular Fracture
Luminescence examples
Extrinsic Semiconductors
The Transistor
23. 1. Fluorescent Lamp - tungstate or silicate coating on inside of tube emits white light due to UV light generated inside the tube. 2. TV screen - emits light as electron beam is scanned back and forth.
Thermal Stresses
Generation of a Magnetic Field - Within a Solid Material
Thermal expansion
Luminescence examples
24. Small Coercivities - Used for electric motors - Example: commercial iron 99.95 Fe
Soft Magnetic Materials
Specific Heat
Transgranular Fracture
Stages of Failure: Ductile Fracture
25. This strength parameter is similar in magnitude to a tensile strength. Fracture occurs along the outermost sample edge - which is under a tensile load.
Holloman Equation
M is known as what?
Modulus of Rupture (MOR)
Thermal expansion
26. The ability of a material to be rapidly cooled and not fracture
Response to a Magnetic Field
Impact - Toughness
Thermal Shock Resistance
Where does DBTT occur?
27. Allows you to calculate what happened G=F' x cos(lambda) - F=F' x cos(phi)
Force Decomposition
Dependence of Heat Capacity on Temperature
Plastic Deformation (Metals)
Fourier's Law
28. Measures impact energy 1. Strike a notched sample with an anvil 2. Measure how far the anvil travels following impact 3. Distance traveled is related to energy required to break the sample 4. Very high rate of loading. Makes materials more "brittle."
Engineering Fracture Performance
Incoherent
LASER
Charpy or Izod test
29. Failure under cyclic stress 1. It can cause part failure - even though (sigma)max < (sigma)c 2. Causes ~90% of mechanical engineering failures.
Two kinds of Reflection
How an LCD works
Large Hardness
Fatigue
30. They are used to assess properties of ceramics & glasses.
Fourier's Law
Iron-Silicon Alloy in Transformer Cores
Bending tests
Liquid Crystal Displays (LCD's)
31. Because of ionic & covalent-type bonding.
Stages of Failure: Ductile Fracture
To improve fatigue life
Why do ceramics have larger bonding energy?
Iron-Silicon Alloy in Transformer Cores
32. Specular: light reflecting off a mirror (average) - Diffuse: light reflecting off a white wall (local)
Specific Heat
Thermal Stresses
Internal magnetic moments
Two kinds of Reflection
33. A three terminal device that acts like a simple "on-off" switch. (the basis of Integrated Circuits (IC) technology - used in computers - cell phones - automotive control - etc) - If voltage (potential) applied to the "gate" - current flows between th
Heat Capacity from an Atomic Prospective
Where does DBTT occur?
Bending tests
The Transistor
34. # of thermally generated electrons = # of holes (broken bonds)
Modulus of Rupture (MOR)
Reflection of Light for Metals
Bending tests
Intrinsic Semiconductors
35. Is reflected - absorbed - scattered - and/or transmitted: Io=It+Ia+Ir+Is
Film Deposition
Opaque
Thermal expansion
Incident Light
36. Large coercivities - Used for permanent magnets - Add particles/voids to inhibit domain wall motion - Example: tungsten steel
Fourier's Law
Two kinds of Reflection
Not severe
Hard Magnetic Materials
37. A measure of the ease with which a B field can be induced inside a material.
True Stress
Fourier's Law
Hysteresis and Permanent Magnetization
Relative Permeability
38. (sigma)=F/Ai (rho)=(rho)'(1+(epsilon))
Soft Magnetic Materials
Transparent
True Stress
Sparkle of Diamonds
39. Width of smallest feature obtainable on Si surface
High impact energy
Elastic Deformation
Linewidth
Thermal Expansion: Symmetric curve
40. Cp: Heat capacity at constant pressure Cv: Heat capacity at constant volume.
Opaque
Specific Heat
Two ways to measure heat capacity
Large Hardness
41. (sigma)=K(sigma)^n . K = strength coefficient - n = work hardening rate or strain hardening exponent. Large n value increases strength and hardness.
Holloman Equation
Soft Magnetic Materials
Dependence of Heat Capacity on Temperature
Stress Intensity Factor
42. Undergo extensive plastic deformation prior to failure.
Large Hardness
Scattering
Ductile Materials
Engineering Fracture Performance
43. The ability of a material to absorb heat - Quantitatively: The energy required to produce a unit rise in temperature for one mole of a material.
Heat Capacity from an Atomic Prospective
Two ways to measure heat capacity
Liquid Crystal Displays (LCD's)
Heat Capacity
44. Digitalized data in the form of electrical signals are transferred to and recorded digitally on a magnetic medium (tape or disk) - This transference is accomplished by a recording system that consists of a read/write head - "write" or record data by
Reflectance of Non-Metals
Why do ceramics have larger bonding energy?
Magnetic Storage
Internal magnetic moments
45. These materials are relatively unaffected by magnetic fields.
Diamagnetic Materials
Specific Heat
Etching
Generation of a Magnetic Field - Vacuum
46. If a material has ________ - then the field generated by those moments must be added to the induced field.
Internal magnetic moments
Impact energy
Stages of Failure: Ductile Fracture
Iron-Silicon Alloy in Transformer Cores
47. Diffuse image
Heat Capacity from an Atomic Prospective
Transgranular Fracture
Translucent
Magnetic Storage
48. Resistance to plastic deformation of cracking in compression - and better wear properties.
Oxidation
Large Hardness
Griffith Crack Model
Refraction
49. 1. Necking 2. Cavity formation 3. Cavity coalescence to form cracks 4. Crack propagation (growth) 5. Fracture
Bending tests
Stages of Failure: Ductile Fracture
Thermal Shock Resistance
Where does DBTT occur?
50. With Increasing temperature - the saturation magnetization diminishes gradually and then abruptly drops to zero at Curie Temperature - Tc.
Generation of a Magnetic Field - Vacuum
Influence of Temperature on Magnetic Behavior
Energy States: Insulators and Semiconductors
Rockwell