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Test your basic knowledge |
Engineering Materials
Start Test
Study First
Subject
:
engineering
Instructions:
Answer 50 questions in 15 minutes.
If you are not ready to take this test, you can
study here
.
Match each statement with the correct term.
Don't refresh. All questions and answers are randomly picked and ordered every time you load a test.
This is a study tool. The 3 wrong answers for each question are randomly chosen from answers to other questions. So, you might find at times the answers obvious, but you will see it re-enforces your understanding as you take the test each time.
1. Undergo extensive plastic deformation prior to failure.
Ductile Materials
Thermal Shock Resistance
Linewidth
Insulators
2. Stress concentration at a crack tips
HB (Brinell Hardness)
Why do ceramics have larger bonding energy?
Brittle Materials
Griffith Crack Model
3. Flaws and Defects - They concentrate stress locally to levels high enough to rupture bonds.
Force Decomposition
Dependence of Heat Capacity on Temperature
Why materials fail in service
Stages of Failure: Ductile Fracture
4. Not ALL the light is refracted - SOME is reflected. Materials with a high index of refraction also have high reflectance - High R is bad for lens applications - since this leads to undesirable light losses or interference.
Not severe
Magnetic Storage
Reflectance of Non-Metals
Refraction
5. 1. Imperfections increase resistivity - grain boundaries - dislocations - impurity atoms - vacancies 2. Resistivity - increases with temperature - wt% impurity - and %CW
Metals: Resistivity vs. T - Impurities
Modulus of Rupture (MOR)
Large Hardness
Thermal expansion
6. Ohms Law: voltage drop = current * resistance
Brittle Ceramics
Soft Magnetic Materials
Lithography
Electrical Conduction
7. Diffuse image
Brittle Ceramics
Soft Magnetic Materials
LASER
Translucent
8. Process by which geometric patterns are transferred from a mask (reticle) to a surface of a chip to form the device.
Hysteresis and Permanent Magnetization
Thermal expansion
Thermal Shock Resistance
Lithography
9. This strength parameter is similar in magnitude to a tensile strength. Fracture occurs along the outermost sample edge - which is under a tensile load.
Work Hardening
Paramagnetic Materials
Heat Capacity from an Atomic Prospective
Modulus of Rupture (MOR)
10. 1. Impose a compressive surface stress (to suppress surface cracks from growing) - Method 1: shot peening - Method 2: carburizing 2.Remove stress concentrators.
Heat Capacity
Specific Heat
Two ways to measure heat capacity
To improve fatigue life
11. Increase temperature - increase in interatomic separation - thermal expansion
Thermal Expansion: Asymmetric curve
Holloman Equation
Generation of a Magnetic Field - Vacuum
HB (Brinell Hardness)
12. Occur when lots of dislocations move.
Slip Bands
Not severe
Large Hardness
Opacity
13. Plastic means permanent! When a small load is applied - bonds stretch & planes shear. Then when the load is no longer applied - the planes are still sheared.
Scattering
Metals: Resistivity vs. T - Impurities
Electrical Conduction
Plastic Deformation (Metals)
14. Ability to transmit a clear image - The image is clear.
How an LCD works
Force Decomposition
Transparent
Scattering
15. Without passing a current a continually varying magnetic field will cause a current to flow
Thermal Conductivity
Charpy or Izod test
Response to a Magnetic Field
True Strain
16. Light Amplification by Stimulated Emission of Radiation
Meissner Effect
Brittle Materials
LASER
The Transistor
17. Reflectiviy is between 0.90 and 0.95 - Metal surfaces appear shiny - Most of absorbed light is reflected at the same wavelength (NO REFRACTION) - Small fraction of light may be absorbed - Color of reflected light depends on wavelength distribution of
Charpy or Izod test
Bending tests
Rockwell
Reflection of Light for Metals
18. Hardness is the resistance of a material to deformation by indentation - Useful in quality control - Hardness can provide a qualitative assessment of strength - Hardness cannot be used to quantitatively infer strength or ductility.
Hardness
Paramagnetic Materials
Dependence of Heat Capacity on Temperature
Energy States: Insulators and Semiconductors
19. Measures Hardness 1. psia = 500 x HB 2. MPa = 3.45 x HB
HB (Brinell Hardness)
Paramagnetic Materials
How an LCD works
Incoherent
20. - Metals that exhibit high ductility - exhibit high toughness. Ceramics are very strong - but have low ductility and low toughness - Polymers are very ductile but are not generally very strong in shear (compared to metals and ceramics). They have low
Yield and Reliability
Stress Intensity Factor
Stress Intensity values
Not severe
21. Cracks propagate along grain boundaries.
True Stress
Why materials fail in service
Intergranular Fracture
Generation of a Magnetic Field - Vacuum
22. Allows you to calculate what happened G=F' x cos(lambda) - F=F' x cos(phi)
Force Decomposition
Pure Semiconductors: Conductivity vs. T
Conduction & Electron Transport
Opaque
23. (sigma)=F/Ai (rho)=(rho)'(1+(epsilon))
Fatigue
True Stress
Extrinsic Semiconductors
Pure Semiconductors: Conductivity vs. T
24. Resistance to plastic deformation of cracking in compression - and better wear properties.
Yield and Reliability
Heat Capacity from an Atomic Prospective
True Strain
Large Hardness
25. Different orientation of cleavage planes in grains.
Force Decomposition
Engineering Fracture Performance
Why fracture surfaces have faceted texture
Stages of Failure: Ductile Fracture
26. High toughness; material resists crack propagation.
High impact energy
Charpy or Izod test
Superconductivity
Stages of Failure: Ductile Fracture
27. -> fluorescent light - electron transitions occur randomly - light waves are out of phase with each other.
Incoherent
4 Types of Magnetism
Influence of Temperature on Magnetic Behavior
Thermal Conductivity
28. 1. Yield = ratio of functional chips to total # of chips - Most yield loss during wafer processing - b/c of complex 2. Reliability - No device has infinite lifetime. Statistical methods to predict expected lifetime - Failure mechanisms: Diffusion reg
Thermal Conductivity
Large Hardness
Yield and Reliability
Opaque
29. As the applied field (H) increases the magnetic domains change shape and size by movement of domain boundaries.
Fatigue
Intergranular Fracture
Domains in Ferromagnetic & Ferrimagnetic Materials
Luminescence examples
30. Materials change size when temperature is changed
Thermal expansion
Metallization
Transgranular Fracture
Ductile Fracture
31. 1. Stress-strain behavior is not usually determined via tensile tests 2. Material fails before it yields 3. Bend/flexure tests are often used instead.
Brittle Ceramics
LASER
Not severe
Fatigue
32. These materials are "attracted" to magnetic fields.
Thermal Expansion: Symmetric curve
Metallization
Why materials fail in service
Paramagnetic Materials
33. Occurs at a single pore or other solid by refraction n = 1 for pore (air) n > 1 for the solid - n ~ 1.5 for glass - Scattering effect is maximized by pore/particle size within 400-700 nm range - Reason for Opacity in ceramics - glasses and polymers.
Thermal Expansion: Symmetric curve
Specific Heat
True Strain
Scattering
34. Metals are good conductors since their _______is only partially filled.
Opaque
Internal magnetic moments
Valence band
HB (Brinell Hardness)
35. 1. Metals: Thermal energy puts many electrons into a higher energy state. 2. Energy States: Nearby energy states are accessible by thermal fluctuations.
IC Devices: P-N Rectifying Junction
The three modes of crack surface displacement
Conduction & Electron Transport
Luminescence
36. No appreciable plastic deformation. The crack propagates very fast; nearly perpendicular to applied stress. Cracks often propagate along specific crystal planes or boundaries.
Brittle Fracture
Iron-Silicon Alloy in Transformer Cores
Opacity
Film Deposition
37. They are used to assess properties of ceramics & glasses.
Generation of a Magnetic Field - Vacuum
Impact energy
Bending tests
Valence band
38. Liquid polymer at room T - sandwiched between two sheets of glass - coated with transparent - electrically conductive film. - Character forming letters/ numbers etched on the face - Voltage applied disrupts the orientation of the rod- shaped molecule
High impact energy
Internal magnetic moments
Coefficient of Thermal Expansion
How an LCD works
39. Wet: isotropic - under cut Dry: ansiotropic - directional
Lithography
Etching
Fatigue
Luminescence
40. - A magnetic field is induced in the material B= Magnetic Induction (tesla) inside the material mu= permeability of a solid
Stress Intensity values
Incident Light
Generation of a Magnetic Field - Within a Solid Material
Film Deposition
41. heat flux = -(thermal conductivity)(temperature gradient) - Defines heat transfer by CONDUCTION
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42. 1. Data for Pure Silicon - electrical conductivity increases with T - opposite to metals
True Strain
Pure Semiconductors: Conductivity vs. T
Brittle Materials
Hardness
43. A high index of refraction (n value) allows for multiple internal reactions.
How to gage the extent of plastic deformation
Work Hardening
Sparkle of Diamonds
Electrical Conduction
44. Typical loading conditions are _____ enough to break all inter-atomic bonds
Not severe
Color
Paramagnetic Materials
What do magnetic moments arise from?
45. Process by which metal atoms diffuse because of a potential.
Electrical Conduction
Electromigration
Griffith Crack Model
Heat Capacity from an Atomic Prospective
46. Energy is stored as atomic vibrations - As temperature increases - the average energy of atomic vibrations increases.
Ductile Fracture
Refraction
Heat Capacity from an Atomic Prospective
Heat Capacity
47. Found in 26 metals and hundreds of alloys & compounds - Tc= critical temperature = termperature below which material is superconductive.
Meissner Effect
Hysteresis and Permanent Magnetization
Superconductivity
Two kinds of Reflection
48. ...occurs in bcc metals but not in fcc metals.
Diamagnetic Materials
Where does DBTT occur?
Stress Intensity Factor
IC Devices: P-N Rectifying Junction
49. 1. Ductility- % elongation - % reduction in area - may be of use in metal forming operations (e.g. - stretch forming). This is convenient for mechanical testing - but not very meaningful for most deformation processing. 2. Toughness- Area beneath str
Relative Permeability
Where does DBTT occur?
How to gage the extent of plastic deformation
Large Hardness
50. 1. General yielding occurs if flaw size a < a(critical) 2. Catastrophic fast fracture occurs if flaw size a > a(critical)
Thermal expansion
Fourier's Law
High impact energy
Engineering Fracture Performance