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Test your basic knowledge |
Engineering Materials
Start Test
Study First
Subject
:
engineering
Instructions:
Answer 50 questions in 15 minutes.
If you are not ready to take this test, you can
study here
.
Match each statement with the correct term.
Don't refresh. All questions and answers are randomly picked and ordered every time you load a test.
This is a study tool. The 3 wrong answers for each question are randomly chosen from answers to other questions. So, you might find at times the answers obvious, but you will see it re-enforces your understanding as you take the test each time.
1. (sigma)=F/Ai (rho)=(rho)'(1+(epsilon))
True Stress
True Strain
Energy States: Insulators and Semiconductors
Translucent
2. Rho=F/A - tau=G/A . Depending on what angle the force is applied - and what angle the crystal is at - it takes different amounts of force to induce plastic deformation.
Electromigration
Valence band
Thermal Stresses
Shear and Tensile Stress
3. Diffuse image
Thermal Expansion: Symmetric curve
Translucent
Refraction
Yield and Reliability
4. A parallel-plate capacitor involves an insulator - or dielectric - between two metal electrodes. The charge density buildup at the capacitor surface is related to the dielectric constant of the material.
Large Hardness
Insulators
Extrinsic Semiconductors
Opaque
5. 1. Tensile (opening) 2. Sliding 3. Tearing
Fatigue
Intergranular Fracture
The three modes of crack surface displacement
Elastic Deformation
6. Measures Hardness - No major sample damage - Each scales runs to 130 but only useful in range 20-100 - Minor load is 10 kg - Major load: 60 kg (diamond) - 100 kg (1/16 in. ball) - 150 kg (diamond)
Rockwell
Heat Capacity
Energy States: Insulators and Semiconductors
Large Hardness
7. 1. Ability of the material to absorb energy prior to fracture 2. Short term dynamic stressing - Car collisions - Bullets - Athletic equipment 3. This is different than toughness; energy necessary to push a crack (flaw) through a material 4. Useful in
Brittle Fracture
Heat Capacity from an Atomic Prospective
Impact - Toughness
Elastic Deformation
8. Is analogous to toughness.
Why fracture surfaces have faceted texture
Ductile-to-Brittle Transition
Thermal Expansion: Symmetric curve
Impact energy
9. To build a device - various thin metal or insulating films are grown on top of each other - Evaporation - MBE - Sputtering - CVD (ALD)
Film Deposition
Refraction
Transgranular Fracture
Impact energy
10. 1. Insulators: Higher energy states NOT ACCESSIBLE due to gap 2. Semiconductors: Higher energy states separated by a smaller gap.
Energy States: Insulators and Semiconductors
Stress Intensity Factor
Ductile Fracture
Dependence of Heat Capacity on Temperature
11. Width of smallest feature obtainable on Si surface
Why materials fail in service
Linewidth
Opacifiers
Brittle Fracture
12. ...occurs in bcc metals but not in fcc metals.
Ductile Materials
Where does DBTT occur?
Large Hardness
Transparent
13. 1. Fluorescent Lamp - tungstate or silicate coating on inside of tube emits white light due to UV light generated inside the tube. 2. TV screen - emits light as electron beam is scanned back and forth.
True Stress
Large Hardness
Luminescence examples
Bending tests
14. Cracks pass through grains - often along specific crystal planes.
Transgranular Fracture
What do magnetic moments arise from?
Thermal Expansion: Symmetric curve
To improve fatigue life
15. 1. Tc= critical temperature- if T>Tc not superconducting 2. Jc= critical current density - if J>Jc not superconducting 3. Hc= critical magnetic field - if H > Hc not superconducting
Intrinsic Semiconductors
Critical Properties of Superconductive Materials
Meissner Effect
Translucent
16. Light Amplification by Stimulated Emission of Radiation
IC Devices: P-N Rectifying Junction
Force Decomposition
Thermal Expansion: Asymmetric curve
LASER
17. Process by which geometric patterns are transferred from a mask (reticle) to a surface of a chip to form the device.
Extrinsic Semiconductors
Color
Charpy or Izod test
Lithography
18. Ability to transmit a clear image - The image is clear.
Thermal expansion
Two ways to measure heat capacity
Generation of a Magnetic Field - Within a Solid Material
Transparent
19. These materials are "attracted" to magnetic fields.
Stages of Failure: Ductile Fracture
Paramagnetic Materials
Electromigration
How an LCD works
20. Resistance to plastic deformation of cracking in compression - and better wear properties.
Large Hardness
Magnetic Storage
Metallization
Metals: Resistivity vs. T - Impurities
21. Large coercivities - Used for permanent magnets - Add particles/voids to inhibit domain wall motion - Example: tungsten steel
Griffith Crack Model
Opaque
Hard Magnetic Materials
Stages of Failure: Ductile Fracture
22. Second phase particles with n > glass.
Oxidation
Domains in Ferromagnetic & Ferrimagnetic Materials
Opacifiers
Two ways to measure heat capacity
23. Superconductors expel magnetic fields - This is why a superconductor will float above a magnet.
Transparent
Opacity
Magnetic Storage
Meissner Effect
24. Emitted light is in phase
Response to a Magnetic Field
Impact - Toughness
Thermal Expansion: Asymmetric curve
Coherent
25. Typical loading conditions are _____ enough to break all inter-atomic bonds
Not severe
Thermal Expansion: Symmetric curve
Refraction
Relative Permeability
26. Specular: light reflecting off a mirror (average) - Diffuse: light reflecting off a white wall (local)
Thermal Shock Resistance
Sparkle of Diamonds
Two kinds of Reflection
Intergranular Fracture
27. Allows you to calculate what happened G=F' x cos(lambda) - F=F' x cos(phi)
Valence band
Force Decomposition
LASER
Coefficient of Thermal Expansion
28. Is reflected - absorbed - scattered - and/or transmitted: Io=It+Ia+Ir+Is
Reflection of Light for Metals
Metals: Resistivity vs. T - Impurities
Incident Light
Opacity
29. Sigma=ln(li/lo)
Liquid Crystal Displays (LCD's)
Fourier's Law
True Strain
Scattering
30. # of thermally generated electrons = # of holes (broken bonds)
Stress Intensity Factor
Reflectance of Non-Metals
Intrinsic Semiconductors
Ductile-to-Brittle Transition
31. A high index of refraction (n value) allows for multiple internal reactions.
Sparkle of Diamonds
Paramagnetic Materials
Linewidth
The three modes of crack surface displacement
32. Not ALL the light is refracted - SOME is reflected. Materials with a high index of refraction also have high reflectance - High R is bad for lens applications - since this leads to undesirable light losses or interference.
Elastic Deformation
Hard Magnetic Materials
Reflectance of Non-Metals
Opaque
33. A measure of the ease with which a B field can be induced inside a material.
Incident Light
Thermal Conductivity
Relative Permeability
Insulators
34. Plastic means permanent! When a small load is applied - bonds stretch & planes shear. Then when the load is no longer applied - the planes are still sheared.
Holloman Equation
Magnetic Storage Media Types
Linewidth
Plastic Deformation (Metals)
35. Liquid polymer at room T - sandwiched between two sheets of glass - coated with transparent - electrically conductive film. - Character forming letters/ numbers etched on the face - Voltage applied disrupts the orientation of the rod- shaped molecule
Linewidth
Brittle Ceramics
How an LCD works
Meissner Effect
36. Digitalized data in the form of electrical signals are transferred to and recorded digitally on a magnetic medium (tape or disk) - This transference is accomplished by a recording system that consists of a read/write head - "write" or record data by
Pure Semiconductors: Conductivity vs. T
Magnetic Storage
Stress Intensity values
Ductile-to-Brittle Transition
37. 1. Diamagnetic (Xm ~ 10^-5) - small and negative magnetic susceptibilities 2. Paramagnetic (Xm ~ 10^-4) - small and positive magnetic susceptibilities 3. Ferromagnetic - large magnetic susceptibilities 4. Ferrimagnetic (Xm as large as 10^6) - large m
Not severe
4 Types of Magnetism
Hard Magnetic Materials
Refraction
38. (sigma)=K(sigma)^n . K = strength coefficient - n = work hardening rate or strain hardening exponent. Large n value increases strength and hardness.
Electrical Conduction
Translucent
Thermal expansion
Holloman Equation
39. Ohms Law: voltage drop = current * resistance
Impact - Toughness
Insulators
Electrical Conduction
Why do ceramics have larger bonding energy?
40. Defines the ability of a material to resist fracture even when a flaw exists - Directly depends on size of flaw and material properties - K(ic) is a materials constant
Fourier's Law
LASER
Where does DBTT occur?
Stress Intensity Factor
41. They are used to assess properties of ceramics & glasses.
Etching
Impact - Toughness
Bending tests
Yield and Reliability
42. Materials change size when temperature is changed
Charpy or Izod test
Generation of a Magnetic Field - Within a Solid Material
Meissner Effect
Thermal expansion
43. Occur due to: restrained thermal expansion/contraction -temperature gradients that lead to differential dimensional changes sigma = Thermal Stress
Thermal Stresses
Magnetic Storage Media Types
Stress Intensity Factor
Thermal Conductivity
44. These are liquid crystal polymers- not your normal "crystal" -Rigid - rod shaped molecules are aligned even in liquid form.
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45. 1. Necking 2. Cavity formation 3. Cavity coalescence to form cracks 4. Crack propagation (growth) 5. Fracture
Thermal Expansion: Symmetric curve
Reflection of Light for Metals
Rockwell
Stages of Failure: Ductile Fracture
46. 1. Stress-strain behavior is not usually determined via tensile tests 2. Material fails before it yields 3. Bend/flexure tests are often used instead.
Stress Intensity Factor
Brittle Ceramics
Internal magnetic moments
Conduction & Electron Transport
47. Small Coercivities - Used for electric motors - Example: commercial iron 99.95 Fe
Generation of a Magnetic Field - Vacuum
HB (Brinell Hardness)
Soft Magnetic Materials
LASER
48. 1. Metals: Thermal energy puts many electrons into a higher energy state. 2. Energy States: Nearby energy states are accessible by thermal fluctuations.
Metallization
Conduction & Electron Transport
Energy States: Insulators and Semiconductors
IC Devices: P-N Rectifying Junction
49. Failure under cyclic stress 1. It can cause part failure - even though (sigma)max < (sigma)c 2. Causes ~90% of mechanical engineering failures.
Heat Capacity from an Atomic Prospective
Fatigue
Specific Heat
Refraction
50. Cracks propagate along grain boundaries.
Intergranular Fracture
Color
Brittle Fracture
Rockwell