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Engineering Materials

Subject : engineering
Instructions:
  • Answer 50 questions in 15 minutes.
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  • Match each statement with the correct term.
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This is a study tool. The 3 wrong answers for each question are randomly chosen from answers to other questions. So, you might find at times the answers obvious, but you will see it re-enforces your understanding as you take the test each time.
1. 1. Insulators: Higher energy states NOT ACCESSIBLE due to gap 2. Semiconductors: Higher energy states separated by a smaller gap.






2. Measures Hardness 1. psia = 500 x HB 2. MPa = 3.45 x HB






3. Ohms Law: voltage drop = current * resistance






4. Defines the ability of a material to resist fracture even when a flaw exists - Directly depends on size of flaw and material properties - K(ic) is a materials constant






5. Cp: Heat capacity at constant pressure Cv: Heat capacity at constant volume.






6. Increase temperature - no increase in interatomic separation - no thermal expansion






7. 1. Metals: Thermal energy puts many electrons into a higher energy state. 2. Energy States: Nearby energy states are accessible by thermal fluctuations.






8. 1. Hard disk drives (granular/perpendicular media) 2. Recording tape (particulate media)






9. Is analogous to toughness.






10. Sigma=ln(li/lo)






11. Superconductors expel magnetic fields - This is why a superconductor will float above a magnet.






12. Becomes harder (more strain) to stretch (elongate)






13. 1. Data for Pure Silicon - electrical conductivity increases with T - opposite to metals






14. Different orientation of cleavage planes in grains.






15. With Increasing temperature - the saturation magnetization diminishes gradually and then abruptly drops to zero at Curie Temperature - Tc.






16. 1. Electron motions 2. The spins on electrons - Net atomic magnetic moment: sum of moments from all electrons.






17. Undergo little or no plastic deformation.






18. heat flux = -(thermal conductivity)(temperature gradient) - Defines heat transfer by CONDUCTION

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19. Cracks propagate along grain boundaries.






20. Diffuse image






21. The ability of a material to be rapidly cooled and not fracture






22. Stress concentration at a crack tips






23. Transmitted light distorts electron clouds - The velocity of light in a material is lower than in a vacuum - Adding large ions to glass decreases the speed of light in the glass - Light can be "bent" (or refracted) as it passes through a transparent






24. Wet: isotropic - under cut Dry: ansiotropic - directional






25. Heat capacity.....- increases with temperature -for solids it reaches a limiting value of 3R






26. Light Amplification by Stimulated Emission of Radiation






27. - Metals that exhibit high ductility - exhibit high toughness. Ceramics are very strong - but have low ductility and low toughness - Polymers are very ductile but are not generally very strong in shear (compared to metals and ceramics). They have low






28. Measures impact energy 1. Strike a notched sample with an anvil 2. Measure how far the anvil travels following impact 3. Distance traveled is related to energy required to break the sample 4. Very high rate of loading. Makes materials more "brittle."






29. These materials are relatively unaffected by magnetic fields.






30. 1. Impose a compressive surface stress (to suppress surface cracks from growing) - Method 1: shot peening - Method 2: carburizing 2.Remove stress concentrators.






31. Occurs at a single pore or other solid by refraction n = 1 for pore (air) n > 1 for the solid - n ~ 1.5 for glass - Scattering effect is maximized by pore/particle size within 400-700 nm range - Reason for Opacity in ceramics - glasses and polymers.






32. These materials are "attracted" to magnetic fields.






33. The magnetic hysteresis phenomenon: Stage 1: Initial (unmagnetized state) Stage 2: Apply H - align domains Stage 3: Remove H - alignment remains => Permanent magnet Stage 4: Coercivity - Hc negative H needed to demagnitize Stage 5: Apply -H - align d






34. Specular: light reflecting off a mirror (average) - Diffuse: light reflecting off a white wall (local)






35. Materials change size when temperature is changed






36. No appreciable plastic deformation. The crack propagates very fast; nearly perpendicular to applied stress. Cracks often propagate along specific crystal planes or boundaries.






37. Typical loading conditions are _____ enough to break all inter-atomic bonds






38. Failure under cyclic stress 1. It can cause part failure - even though (sigma)max < (sigma)c 2. Causes ~90% of mechanical engineering failures.






39. To build a device - various thin metal or insulating films are grown on top of each other - Evaporation - MBE - Sputtering - CVD (ALD)






40. A measure of the ease with which a B field can be induced inside a material.






41. Hardness is the resistance of a material to deformation by indentation - Useful in quality control - Hardness can provide a qualitative assessment of strength - Hardness cannot be used to quantitatively infer strength or ductility.






42. Resistance to plastic deformation of cracking in compression - and better wear properties.






43. Degree of opacity depends on size and number of particles - Opacity of metals is the result of conduction electrons absorbing photons in the visible range.






44. (sigma)=K(sigma)^n . K = strength coefficient - n = work hardening rate or strain hardening exponent. Large n value increases strength and hardness.






45. The size of the material changes with a change in temperature - polymers have the largest values






46. Created by current through a coil N= total number of turns L= length of turns (m) I= current (ampere) H= applied magnetic field (ampere-turns/m) Bo= magnetic flux density in a vacuum (tesla)






47. Metals are good conductors since their _______is only partially filled.






48. 1. Ability of the material to absorb energy prior to fracture 2. Short term dynamic stressing - Car collisions - Bullets - Athletic equipment 3. This is different than toughness; energy necessary to push a crack (flaw) through a material 4. Useful in






49. Emitted light is in phase






50. There is always some statistical distribution of flaws or defects.







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