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Test your basic knowledge |
Engineering Materials
Start Test
Study First
Subject
:
engineering
Instructions:
Answer 50 questions in 15 minutes.
If you are not ready to take this test, you can
study here
.
Match each statement with the correct term.
Don't refresh. All questions and answers are randomly picked and ordered every time you load a test.
This is a study tool. The 3 wrong answers for each question are randomly chosen from answers to other questions. So, you might find at times the answers obvious, but you will see it re-enforces your understanding as you take the test each time.
1. Failure under cyclic stress 1. It can cause part failure - even though (sigma)max < (sigma)c 2. Causes ~90% of mechanical engineering failures.
Charpy or Izod test
Metals: Resistivity vs. T - Impurities
Stress Intensity values
Fatigue
2. Second phase particles with n > glass.
Etching
Two kinds of Reflection
Opacifiers
Stress Intensity values
3. Sigma=ln(li/lo)
Refraction
Luminescence
Opaque
True Strain
4. -> fluorescent light - electron transitions occur randomly - light waves are out of phase with each other.
Hard Magnetic Materials
Incoherent
Diamagnetic Materials
Reflectance of Non-Metals
5. The Magnetization of the material - and is essentially the dipole moment per unit volume. It is proportional to the applied field. Xm is the magnetic susceptibility.
Metals: Resistivity vs. T - Impurities
M is known as what?
Brittle Ceramics
Scattering
6. Increase temperature - increase in interatomic separation - thermal expansion
Ductile Fracture
Thermal Expansion: Asymmetric curve
Energy States: Insulators and Semiconductors
Linewidth
7. Growth of an oxide layer by the reaction of oxygen with the substrate - Provides dopant masking and device isolation - IC technology uses 1. Thermal grown oxidation (dry) 2. Wet Oxidation 3. Selective Oxidation
Oxidation
Metallization
Domains in Ferromagnetic & Ferrimagnetic Materials
Griffith Crack Model
8. Measures impact energy 1. Strike a notched sample with an anvil 2. Measure how far the anvil travels following impact 3. Distance traveled is related to energy required to break the sample 4. Very high rate of loading. Makes materials more "brittle."
Why materials fail in service
Charpy or Izod test
What do magnetic moments arise from?
Brittle Materials
9. As the applied field (H) increases the magnetic domains change shape and size by movement of domain boundaries.
Large Hardness
Magnetic Storage
Domains in Ferromagnetic & Ferrimagnetic Materials
Force Decomposition
10. - Metals that exhibit high ductility - exhibit high toughness. Ceramics are very strong - but have low ductility and low toughness - Polymers are very ductile but are not generally very strong in shear (compared to metals and ceramics). They have low
Stress Intensity values
True Strain
Reflection of Light for Metals
Transparent
11. Materials change size when temperature is changed
Brittle Fracture
Why do ceramics have larger bonding energy?
Opacifiers
Thermal expansion
12. - A magnetic field is induced in the material B= Magnetic Induction (tesla) inside the material mu= permeability of a solid
Fourier's Law
Translucent
Generation of a Magnetic Field - Within a Solid Material
How an LCD works
13. Found in 26 metals and hundreds of alloys & compounds - Tc= critical temperature = termperature below which material is superconductive.
Ductile-to-Brittle Transition
Superconductivity
The three modes of crack surface displacement
Conduction & Electron Transport
14. Transformer cores require soft magnetic materials - which are easily magnetized and de-magnetized - and have high electrical resistivity - Energy losses in transformers could be minimized if their cores were fabricated such that the easy magnetizatio
Iron-Silicon Alloy in Transformer Cores
Bending tests
Reflectance of Non-Metals
Pure Semiconductors: Conductivity vs. T
15. Becomes harder (more strain) to stretch (elongate)
Refraction
Stress Intensity values
Insulators
Work Hardening
16. Rho=F/A - tau=G/A . Depending on what angle the force is applied - and what angle the crystal is at - it takes different amounts of force to induce plastic deformation.
Opacity
To improve fatigue life
Brittle Ceramics
Shear and Tensile Stress
17. Typical loading conditions are _____ enough to break all inter-atomic bonds
Thermal expansion
Elastic Deformation
Opacity
Not severe
18. Energy is stored as atomic vibrations - As temperature increases - the average energy of atomic vibrations increases.
Heat Capacity from an Atomic Prospective
There is no perfect material?
Hard Magnetic Materials
Energy States: Insulators and Semiconductors
19. 1. Diamagnetic (Xm ~ 10^-5) - small and negative magnetic susceptibilities 2. Paramagnetic (Xm ~ 10^-4) - small and positive magnetic susceptibilities 3. Ferromagnetic - large magnetic susceptibilities 4. Ferrimagnetic (Xm as large as 10^6) - large m
Extrinsic Semiconductors
4 Types of Magnetism
Metals: Resistivity vs. T - Impurities
Impact - Toughness
20. To build a device - various thin metal or insulating films are grown on top of each other - Evaporation - MBE - Sputtering - CVD (ALD)
Response to a Magnetic Field
Critical Properties of Superconductive Materials
Film Deposition
Lithography
21. Transmitted light distorts electron clouds - The velocity of light in a material is lower than in a vacuum - Adding large ions to glass decreases the speed of light in the glass - Light can be "bent" (or refracted) as it passes through a transparent
Thermal Stresses
Thermal Shock Resistance
Ductile Fracture
Refraction
22. Allows you to calculate what happened G=F' x cos(lambda) - F=F' x cos(phi)
Yield and Reliability
Brittle Ceramics
Force Decomposition
Hard Magnetic Materials
23. ...occurs in bcc metals but not in fcc metals.
Electromigration
Luminescence
Superconductivity
Where does DBTT occur?
24. Loss of image transmission - You get no image - There is no light transmission - and therefore reflects - scatters - or absorbs ALL of it. Both mirrors and carbon black are opaque.
Extrinsic Semiconductors
Opaque
Film Deposition
Magnetic Storage
25. A parallel-plate capacitor involves an insulator - or dielectric - between two metal electrodes. The charge density buildup at the capacitor surface is related to the dielectric constant of the material.
Rockwell
Insulators
Plastic Deformation (Metals)
Opacifiers
26. Heat capacity.....- increases with temperature -for solids it reaches a limiting value of 3R
Film Deposition
Dependence of Heat Capacity on Temperature
Coherent
True Strain
27. Reflectiviy is between 0.90 and 0.95 - Metal surfaces appear shiny - Most of absorbed light is reflected at the same wavelength (NO REFRACTION) - Small fraction of light may be absorbed - Color of reflected light depends on wavelength distribution of
Where does DBTT occur?
How an LCD works
Reflection of Light for Metals
Thermal expansion
28. A high index of refraction (n value) allows for multiple internal reactions.
Stages of Failure: Ductile Fracture
Response to a Magnetic Field
Sparkle of Diamonds
Heat Capacity
29. Undergo little or no plastic deformation.
Force Decomposition
Elastic Deformation
Transgranular Fracture
Brittle Materials
30. Small Coercivities - Used for electric motors - Example: commercial iron 99.95 Fe
Incident Light
Soft Magnetic Materials
Reflection of Light for Metals
Domains in Ferromagnetic & Ferrimagnetic Materials
31. If a material has ________ - then the field generated by those moments must be added to the induced field.
Work Hardening
IC Devices: P-N Rectifying Junction
Internal magnetic moments
Diamagnetic Materials
32. Elastic means reversible! This is not a permanent deformation.
Elastic Deformation
What do magnetic moments arise from?
Ductile-to-Brittle Transition
Engineering Fracture Performance
33. (sigma)=K(sigma)^n . K = strength coefficient - n = work hardening rate or strain hardening exponent. Large n value increases strength and hardness.
HB (Brinell Hardness)
Thermal expansion
Relative Permeability
Holloman Equation
34. Measures Hardness 1. psia = 500 x HB 2. MPa = 3.45 x HB
HB (Brinell Hardness)
Meissner Effect
Thermal Stresses
Extrinsic Semiconductors
35. 1. Ductility- % elongation - % reduction in area - may be of use in metal forming operations (e.g. - stretch forming). This is convenient for mechanical testing - but not very meaningful for most deformation processing. 2. Toughness- Area beneath str
Thermal Shock Resistance
How to gage the extent of plastic deformation
There is no perfect material?
Diamagnetic Materials
36. Occur when lots of dislocations move.
Refraction
How an LCD works
Slip Bands
High impact energy
37. Metals are good conductors since their _______is only partially filled.
Valence band
Domains in Ferromagnetic & Ferrimagnetic Materials
Internal magnetic moments
Iron-Silicon Alloy in Transformer Cores
38. 1. Necking 2. Cavity formation 3. Cavity coalescence to form cracks 4. Crack propagation (growth) 5. Fracture
Stages of Failure: Ductile Fracture
Incoherent
Rockwell
Where does DBTT occur?
39. Ability to transmit a clear image - The image is clear.
Transparent
Shear and Tensile Stress
Metallization
Insulators
40. They are used to assess properties of ceramics & glasses.
Bending tests
Reflection of Light for Metals
Coherent
Hard Magnetic Materials
41. The size of the material changes with a change in temperature - polymers have the largest values
Domains in Ferromagnetic & Ferrimagnetic Materials
Stress Intensity values
Coefficient of Thermal Expansion
Etching
42. 1. Tensile (opening) 2. Sliding 3. Tearing
Thermal Expansion: Symmetric curve
Paramagnetic Materials
Bending tests
The three modes of crack surface displacement
43. Ohms Law: voltage drop = current * resistance
Extrinsic Semiconductors
Transgranular Fracture
What do magnetic moments arise from?
Electrical Conduction
44. 1. Fluorescent Lamp - tungstate or silicate coating on inside of tube emits white light due to UV light generated inside the tube. 2. TV screen - emits light as electron beam is scanned back and forth.
Stress Intensity values
Luminescence examples
Fourier's Law
LASER
45. 1. General yielding occurs if flaw size a < a(critical) 2. Catastrophic fast fracture occurs if flaw size a > a(critical)
M is known as what?
Engineering Fracture Performance
Scattering
Griffith Crack Model
46. Wet: isotropic - under cut Dry: ansiotropic - directional
Intrinsic Semiconductors
Modulus of Rupture (MOR)
Force Decomposition
Etching
47. Process by which geometric patterns are transferred from a mask (reticle) to a surface of a chip to form the device.
Lithography
Modulus of Rupture (MOR)
Slip Bands
Heat Capacity from an Atomic Prospective
48. This strength parameter is similar in magnitude to a tensile strength. Fracture occurs along the outermost sample edge - which is under a tensile load.
Modulus of Rupture (MOR)
Liquid Crystal Displays (LCD's)
Fourier's Law
Domains in Ferromagnetic & Ferrimagnetic Materials
49. Specular: light reflecting off a mirror (average) - Diffuse: light reflecting off a white wall (local)
Impact energy
Two kinds of Reflection
Hardness
Modulus of Rupture (MOR)
50. Plastic means permanent! When a small load is applied - bonds stretch & planes shear. Then when the load is no longer applied - the planes are still sheared.
Plastic Deformation (Metals)
Rockwell
Soft Magnetic Materials
Specific Heat