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Test your basic knowledge |
Engineering Materials
Start Test
Study First
Subject
:
engineering
Instructions:
Answer 50 questions in 15 minutes.
If you are not ready to take this test, you can
study here
.
Match each statement with the correct term.
Don't refresh. All questions and answers are randomly picked and ordered every time you load a test.
This is a study tool. The 3 wrong answers for each question are randomly chosen from answers to other questions. So, you might find at times the answers obvious, but you will see it re-enforces your understanding as you take the test each time.
1. Process by which geometric patterns are transferred from a mask (reticle) to a surface of a chip to form the device.
Why materials fail in service
Conduction & Electron Transport
Where does DBTT occur?
Lithography
2. Growing interconnections to connect devices -Low electrical resistance - good adhesion to dielectric insulators.
Not severe
Extrinsic Semiconductors
LASER
Metallization
3. Because of ionic & covalent-type bonding.
How to gage the extent of plastic deformation
Why do ceramics have larger bonding energy?
Opacifiers
Liquid Crystal Displays (LCD's)
4. Digitalized data in the form of electrical signals are transferred to and recorded digitally on a magnetic medium (tape or disk) - This transference is accomplished by a recording system that consists of a read/write head - "write" or record data by
Hardness
Reflection of Light for Metals
Magnetic Storage
Internal magnetic moments
5. Ohms Law: voltage drop = current * resistance
Electrical Conduction
Superconductivity
Yield and Reliability
Generation of a Magnetic Field - Vacuum
6. Undergo extensive plastic deformation prior to failure.
Luminescence
Ductile Materials
Paramagnetic Materials
Dependence of Heat Capacity on Temperature
7. Transmitted light distorts electron clouds - The velocity of light in a material is lower than in a vacuum - Adding large ions to glass decreases the speed of light in the glass - Light can be "bent" (or refracted) as it passes through a transparent
Refraction
Film Deposition
Hard Magnetic Materials
Heat Capacity
8. This strength parameter is similar in magnitude to a tensile strength. Fracture occurs along the outermost sample edge - which is under a tensile load.
Opacity
Thermal Conductivity
Refraction
Modulus of Rupture (MOR)
9. 1. Data for Pure Silicon - electrical conductivity increases with T - opposite to metals
Hysteresis and Permanent Magnetization
Generation of a Magnetic Field - Within a Solid Material
Pure Semiconductors: Conductivity vs. T
Where does DBTT occur?
10. To build a device - various thin metal or insulating films are grown on top of each other - Evaporation - MBE - Sputtering - CVD (ALD)
Film Deposition
Hardness
Thermal Stresses
Reflectance of Non-Metals
11. 1. General yielding occurs if flaw size a < a(critical) 2. Catastrophic fast fracture occurs if flaw size a > a(critical)
Engineering Fracture Performance
Etching
Extrinsic Semiconductors
Heat Capacity from an Atomic Prospective
12. Specular: light reflecting off a mirror (average) - Diffuse: light reflecting off a white wall (local)
Two kinds of Reflection
Ductile Fracture
Paramagnetic Materials
Impact - Toughness
13. As the applied field (H) increases the magnetic domains change shape and size by movement of domain boundaries.
Ductile Fracture
Response to a Magnetic Field
Diamagnetic Materials
Domains in Ferromagnetic & Ferrimagnetic Materials
14. Created by current through a coil N= total number of turns L= length of turns (m) I= current (ampere) H= applied magnetic field (ampere-turns/m) Bo= magnetic flux density in a vacuum (tesla)
Incoherent
Generation of a Magnetic Field - Vacuum
Energy States: Insulators and Semiconductors
Metallization
15. Resistance to plastic deformation of cracking in compression - and better wear properties.
Luminescence examples
Large Hardness
Hardness
Hysteresis and Permanent Magnetization
16. Measures Hardness 1. psia = 500 x HB 2. MPa = 3.45 x HB
True Stress
Scattering
HB (Brinell Hardness)
Electrical Conduction
17. Growth of an oxide layer by the reaction of oxygen with the substrate - Provides dopant masking and device isolation - IC technology uses 1. Thermal grown oxidation (dry) 2. Wet Oxidation 3. Selective Oxidation
Ductile Fracture
Luminescence
IC Devices: P-N Rectifying Junction
Oxidation
18. Transformer cores require soft magnetic materials - which are easily magnetized and de-magnetized - and have high electrical resistivity - Energy losses in transformers could be minimized if their cores were fabricated such that the easy magnetizatio
Iron-Silicon Alloy in Transformer Cores
The Transistor
True Stress
Reflectance of Non-Metals
19. A measure of the ease with which a B field can be induced inside a material.
Coherent
Relative Permeability
The three modes of crack surface displacement
Elastic Deformation
20. Not ALL the light is refracted - SOME is reflected. Materials with a high index of refraction also have high reflectance - High R is bad for lens applications - since this leads to undesirable light losses or interference.
Film Deposition
Reflectance of Non-Metals
Why fracture surfaces have faceted texture
Coefficient of Thermal Expansion
21. heat flux = -(thermal conductivity)(temperature gradient) - Defines heat transfer by CONDUCTION
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22. These materials are relatively unaffected by magnetic fields.
To improve fatigue life
Color
Opacifiers
Diamagnetic Materials
23. Without passing a current a continually varying magnetic field will cause a current to flow
Not severe
Response to a Magnetic Field
Brittle Materials
Heat Capacity
24. A parallel-plate capacitor involves an insulator - or dielectric - between two metal electrodes. The charge density buildup at the capacitor surface is related to the dielectric constant of the material.
Insulators
Engineering Fracture Performance
Meissner Effect
Holloman Equation
25. A three terminal device that acts like a simple "on-off" switch. (the basis of Integrated Circuits (IC) technology - used in computers - cell phones - automotive control - etc) - If voltage (potential) applied to the "gate" - current flows between th
The Transistor
HB (Brinell Hardness)
Thermal Conductivity
Force Decomposition
26. (sigma)=K(sigma)^n . K = strength coefficient - n = work hardening rate or strain hardening exponent. Large n value increases strength and hardness.
Influence of Temperature on Magnetic Behavior
Energy States: Insulators and Semiconductors
Specific Heat
Holloman Equation
27. Found in 26 metals and hundreds of alloys & compounds - Tc= critical temperature = termperature below which material is superconductive.
Superconductivity
Stress Intensity values
Etching
Engineering Fracture Performance
28. Dimples on fracture surface correspond to microcavities that initiate crack formation.
Etching
Ductile Fracture
Transparent
Ductile Materials
29. (sigma)=F/Ai (rho)=(rho)'(1+(epsilon))
Reflection of Light for Metals
Metallization
Elastic Deformation
True Stress
30. No appreciable plastic deformation. The crack propagates very fast; nearly perpendicular to applied stress. Cracks often propagate along specific crystal planes or boundaries.
Charpy or Izod test
Brittle Fracture
Incident Light
Magnetic Storage
31. Specific heat = energy input/(mass*temperature change)
True Strain
Metallization
Not severe
Specific Heat
32. 1. Electron motions 2. The spins on electrons - Net atomic magnetic moment: sum of moments from all electrons.
What do magnetic moments arise from?
High impact energy
Metals: Resistivity vs. T - Impurities
Refraction
33. Occurs at a single pore or other solid by refraction n = 1 for pore (air) n > 1 for the solid - n ~ 1.5 for glass - Scattering effect is maximized by pore/particle size within 400-700 nm range - Reason for Opacity in ceramics - glasses and polymers.
Yield and Reliability
Work Hardening
Scattering
IC Devices: P-N Rectifying Junction
34. Is analogous to toughness.
Coefficient of Thermal Expansion
Paramagnetic Materials
Impact energy
Magnetic Storage Media Types
35. - The emission of light from a substance due to the absorption of energy. (Could be radiation - mechanical - or chemical energy. Could also be energetic particles.) - Traps and activator levels are produced by impurity additions to the material - Whe
Hardness
Insulators
Brittle Materials
Luminescence
36. A high index of refraction (n value) allows for multiple internal reactions.
Dependence of Heat Capacity on Temperature
Soft Magnetic Materials
Hard Magnetic Materials
Sparkle of Diamonds
37. Allows flow of electrons in one direction only (useful to convert alternating current to direct current) - Result: no net current flow
HB (Brinell Hardness)
Domains in Ferromagnetic & Ferrimagnetic Materials
M is known as what?
IC Devices: P-N Rectifying Junction
38. Superconductors expel magnetic fields - This is why a superconductor will float above a magnet.
Fourier's Law
LASER
Opaque
Meissner Effect
39. Diffuse image
Refraction
Scattering
Influence of Temperature on Magnetic Behavior
Translucent
40. The magnetic hysteresis phenomenon: Stage 1: Initial (unmagnetized state) Stage 2: Apply H - align domains Stage 3: Remove H - alignment remains => Permanent magnet Stage 4: Coercivity - Hc negative H needed to demagnitize Stage 5: Apply -H - align d
Dependence of Heat Capacity on Temperature
IC Devices: P-N Rectifying Junction
HB (Brinell Hardness)
Hysteresis and Permanent Magnetization
41. Hardness is the resistance of a material to deformation by indentation - Useful in quality control - Hardness can provide a qualitative assessment of strength - Hardness cannot be used to quantitatively infer strength or ductility.
Why fracture surfaces have faceted texture
Electromigration
Film Deposition
Hardness
42. -> fluorescent light - electron transitions occur randomly - light waves are out of phase with each other.
Scattering
Diamagnetic Materials
Incoherent
Film Deposition
43. Occur due to: restrained thermal expansion/contraction -temperature gradients that lead to differential dimensional changes sigma = Thermal Stress
Thermal Stresses
Opaque
Electrical Conduction
Pure Semiconductors: Conductivity vs. T
44. Large coercivities - Used for permanent magnets - Add particles/voids to inhibit domain wall motion - Example: tungsten steel
Hard Magnetic Materials
4 Types of Magnetism
Magnetic Storage Media Types
Coherent
45. The size of the material changes with a change in temperature - polymers have the largest values
Opacifiers
Coefficient of Thermal Expansion
Fatigue
Magnetic Storage
46. Dramatic change in impact energy is associated with a change in fracture mode from brittle to ductile.
Ductile-to-Brittle Transition
Hard Magnetic Materials
Valence band
Transgranular Fracture
47. These materials are "attracted" to magnetic fields.
LASER
Transgranular Fracture
Paramagnetic Materials
Yield and Reliability
48. 1. Tc= critical temperature- if T>Tc not superconducting 2. Jc= critical current density - if J>Jc not superconducting 3. Hc= critical magnetic field - if H > Hc not superconducting
Slip Bands
Conduction & Electron Transport
Critical Properties of Superconductive Materials
Intergranular Fracture
49. If a material has ________ - then the field generated by those moments must be added to the induced field.
Why do ceramics have larger bonding energy?
Internal magnetic moments
Electrical Conduction
Impact - Toughness
50. Elastic means reversible! This is not a permanent deformation.
Elastic Deformation
Why fracture surfaces have faceted texture
Electromigration
Soft Magnetic Materials