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Test your basic knowledge |
Engineering Materials
Start Test
Study First
Subject
:
engineering
Instructions:
Answer 50 questions in 15 minutes.
If you are not ready to take this test, you can
study here
.
Match each statement with the correct term.
Don't refresh. All questions and answers are randomly picked and ordered every time you load a test.
This is a study tool. The 3 wrong answers for each question are randomly chosen from answers to other questions. So, you might find at times the answers obvious, but you will see it re-enforces your understanding as you take the test each time.
1. Process by which metal atoms diffuse because of a potential.
Soft Magnetic Materials
Electromigration
Stages of Failure: Ductile Fracture
Ductile Materials
2. Transformer cores require soft magnetic materials - which are easily magnetized and de-magnetized - and have high electrical resistivity - Energy losses in transformers could be minimized if their cores were fabricated such that the easy magnetizatio
Generation of a Magnetic Field - Vacuum
Modulus of Rupture (MOR)
Plastic Deformation (Metals)
Iron-Silicon Alloy in Transformer Cores
3. Specular: light reflecting off a mirror (average) - Diffuse: light reflecting off a white wall (local)
Opaque
There is no perfect material?
Thermal Expansion: Symmetric curve
Two kinds of Reflection
4. Measures Hardness 1. psia = 500 x HB 2. MPa = 3.45 x HB
Brittle Fracture
Why do ceramics have larger bonding energy?
Incoherent
HB (Brinell Hardness)
5. 1. Metals: Thermal energy puts many electrons into a higher energy state. 2. Energy States: Nearby energy states are accessible by thermal fluctuations.
Two ways to measure heat capacity
Transparent
Force Decomposition
Conduction & Electron Transport
6. # of thermally generated electrons = # of holes (broken bonds)
Electrical Conduction
Thermal expansion
Heat Capacity
Intrinsic Semiconductors
7. Stress concentration at a crack tips
Meissner Effect
Work Hardening
Valence band
Griffith Crack Model
8. Specific heat = energy input/(mass*temperature change)
Specific Heat
Not severe
Internal magnetic moments
Griffith Crack Model
9. 1. Stress-strain behavior is not usually determined via tensile tests 2. Material fails before it yields 3. Bend/flexure tests are often used instead.
Ductile Fracture
Brittle Ceramics
Stress Intensity values
Scattering
10. Cracks propagate along grain boundaries.
Two ways to measure heat capacity
Hardness
Intergranular Fracture
Charpy or Izod test
11. Large coercivities - Used for permanent magnets - Add particles/voids to inhibit domain wall motion - Example: tungsten steel
Hard Magnetic Materials
Sparkle of Diamonds
Specific Heat
Thermal expansion
12. For a metal - there is no ______ - only reflection
Refraction
Why materials fail in service
To improve fatigue life
Work Hardening
13. ...occurs in bcc metals but not in fcc metals.
Transparent
Soft Magnetic Materials
Where does DBTT occur?
Thermal Expansion: Asymmetric curve
14. Undergo extensive plastic deformation prior to failure.
Hardness
Extrinsic Semiconductors
Ductile Materials
Opacity
15. 1. Yield = ratio of functional chips to total # of chips - Most yield loss during wafer processing - b/c of complex 2. Reliability - No device has infinite lifetime. Statistical methods to predict expected lifetime - Failure mechanisms: Diffusion reg
Yield and Reliability
Color
Electromigration
There is no perfect material?
16. Metals are good conductors since their _______is only partially filled.
Opacifiers
Valence band
Incident Light
Shear and Tensile Stress
17. 1. Diamagnetic (Xm ~ 10^-5) - small and negative magnetic susceptibilities 2. Paramagnetic (Xm ~ 10^-4) - small and positive magnetic susceptibilities 3. Ferromagnetic - large magnetic susceptibilities 4. Ferrimagnetic (Xm as large as 10^6) - large m
Soft Magnetic Materials
Rockwell
Conduction & Electron Transport
4 Types of Magnetism
18. Second phase particles with n > glass.
Iron-Silicon Alloy in Transformer Cores
Opacifiers
Stages of Failure: Ductile Fracture
Transgranular Fracture
19. High toughness; material resists crack propagation.
Elastic Deformation
Incident Light
High impact energy
Coherent
20. Allows you to calculate what happened G=F' x cos(lambda) - F=F' x cos(phi)
Insulators
Force Decomposition
Why materials fail in service
Luminescence
21. They are used to assess properties of ceramics & glasses.
Energy States: Insulators and Semiconductors
Intergranular Fracture
Scattering
Bending tests
22. Loss of image transmission - You get no image - There is no light transmission - and therefore reflects - scatters - or absorbs ALL of it. Both mirrors and carbon black are opaque.
Opaque
Opacifiers
Paramagnetic Materials
4 Types of Magnetism
23. Flaws and Defects - They concentrate stress locally to levels high enough to rupture bonds.
Bending tests
Relative Permeability
Plastic Deformation (Metals)
Why materials fail in service
24. 1. Hard disk drives (granular/perpendicular media) 2. Recording tape (particulate media)
Color
Magnetic Storage Media Types
True Stress
Opaque
25. 1. General yielding occurs if flaw size a < a(critical) 2. Catastrophic fast fracture occurs if flaw size a > a(critical)
Two kinds of Reflection
Force Decomposition
Engineering Fracture Performance
Lithography
26. Digitalized data in the form of electrical signals are transferred to and recorded digitally on a magnetic medium (tape or disk) - This transference is accomplished by a recording system that consists of a read/write head - "write" or record data by
Reflection of Light for Metals
Brittle Materials
Magnetic Storage
Thermal Shock Resistance
27. Dimples on fracture surface correspond to microcavities that initiate crack formation.
Ductile Fracture
Etching
Translucent
Magnetic Storage
28. Small Coercivities - Used for electric motors - Example: commercial iron 99.95 Fe
Electromigration
Soft Magnetic Materials
True Strain
What do magnetic moments arise from?
29. Growth of an oxide layer by the reaction of oxygen with the substrate - Provides dopant masking and device isolation - IC technology uses 1. Thermal grown oxidation (dry) 2. Wet Oxidation 3. Selective Oxidation
Oxidation
Meissner Effect
Magnetic Storage
Film Deposition
30. This strength parameter is similar in magnitude to a tensile strength. Fracture occurs along the outermost sample edge - which is under a tensile load.
Hard Magnetic Materials
Transparent
Modulus of Rupture (MOR)
Refraction
31. - The emission of light from a substance due to the absorption of energy. (Could be radiation - mechanical - or chemical energy. Could also be energetic particles.) - Traps and activator levels are produced by impurity additions to the material - Whe
Luminescence
M is known as what?
Oxidation
Insulators
32. These are liquid crystal polymers- not your normal "crystal" -Rigid - rod shaped molecules are aligned even in liquid form.
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33. Increase temperature - no increase in interatomic separation - no thermal expansion
Opacity
M is known as what?
Insulators
Thermal Expansion: Symmetric curve
34. Different orientation of cleavage planes in grains.
Why fracture surfaces have faceted texture
Diamagnetic Materials
Magnetic Storage Media Types
Intrinsic Semiconductors
35. Ohms Law: voltage drop = current * resistance
Heat Capacity
Metallization
Magnetic Storage Media Types
Electrical Conduction
36. Energy is stored as atomic vibrations - As temperature increases - the average energy of atomic vibrations increases.
Relative Permeability
Heat Capacity from an Atomic Prospective
Influence of Temperature on Magnetic Behavior
Electrical Conduction
37. A measure of the ease with which a B field can be induced inside a material.
Work Hardening
Relative Permeability
How an LCD works
Ductile Fracture
38. 1. Data for Pure Silicon - electrical conductivity increases with T - opposite to metals
Pure Semiconductors: Conductivity vs. T
To improve fatigue life
Intrinsic Semiconductors
Incident Light
39. Typical loading conditions are _____ enough to break all inter-atomic bonds
Holloman Equation
Thermal Shock Resistance
Specific Heat
Not severe
40. Measures Hardness - No major sample damage - Each scales runs to 130 but only useful in range 20-100 - Minor load is 10 kg - Major load: 60 kg (diamond) - 100 kg (1/16 in. ball) - 150 kg (diamond)
Rockwell
Transgranular Fracture
Linewidth
Hardness
41. There is always some statistical distribution of flaws or defects.
There is no perfect material?
Metallization
Fourier's Law
Refraction
42. Occur due to: restrained thermal expansion/contraction -temperature gradients that lead to differential dimensional changes sigma = Thermal Stress
Metallization
The three modes of crack surface displacement
Valence band
Thermal Stresses
43. - A magnetic field is induced in the material B= Magnetic Induction (tesla) inside the material mu= permeability of a solid
Generation of a Magnetic Field - Within a Solid Material
Magnetic Storage Media Types
HB (Brinell Hardness)
Stages of Failure: Ductile Fracture
44. A high index of refraction (n value) allows for multiple internal reactions.
Electrical Conduction
Sparkle of Diamonds
Thermal Shock Resistance
There is no perfect material?
45. Impurities added to the semiconductor that contribute to excess electrons or holes. Doping = intentional impurities.
To improve fatigue life
Reflection of Light for Metals
Extrinsic Semiconductors
HB (Brinell Hardness)
46. Materials change size when temperature is changed
Ductile-to-Brittle Transition
Magnetic Storage Media Types
Thermal expansion
Etching
47. Transmitted light distorts electron clouds - The velocity of light in a material is lower than in a vacuum - Adding large ions to glass decreases the speed of light in the glass - Light can be "bent" (or refracted) as it passes through a transparent
Refraction
Thermal Expansion: Symmetric curve
Internal magnetic moments
Coefficient of Thermal Expansion
48. Superconductors expel magnetic fields - This is why a superconductor will float above a magnet.
Opacity
The three modes of crack surface displacement
Heat Capacity from an Atomic Prospective
Meissner Effect
49. Diffuse image
Diamagnetic Materials
Transgranular Fracture
Luminescence
Translucent
50. Width of smallest feature obtainable on Si surface
The three modes of crack surface displacement
Linewidth
Yield and Reliability
Thermal expansion