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Engineering Materials

Subject : engineering
Instructions:
  • Answer 50 questions in 15 minutes.
  • If you are not ready to take this test, you can study here.
  • Match each statement with the correct term.
  • Don't refresh. All questions and answers are randomly picked and ordered every time you load a test.

This is a study tool. The 3 wrong answers for each question are randomly chosen from answers to other questions. So, you might find at times the answers obvious, but you will see it re-enforces your understanding as you take the test each time.
1. -> fluorescent light - electron transitions occur randomly - light waves are out of phase with each other.






2. Loss of image transmission - You get no image - There is no light transmission - and therefore reflects - scatters - or absorbs ALL of it. Both mirrors and carbon black are opaque.






3. - Metals that exhibit high ductility - exhibit high toughness. Ceramics are very strong - but have low ductility and low toughness - Polymers are very ductile but are not generally very strong in shear (compared to metals and ceramics). They have low






4. Small Coercivities - Used for electric motors - Example: commercial iron 99.95 Fe






5. Cp: Heat capacity at constant pressure Cv: Heat capacity at constant volume.






6. Materials change size when temperature is changed






7. The ability of a material to transport heat - Atomic Perspective: Atomic vibrations and free electrons in hotter regions transport energy to cooler regions - Metals have the largest values






8. Defines the ability of a material to resist fracture even when a flaw exists - Directly depends on size of flaw and material properties - K(ic) is a materials constant






9. 1. Electron motions 2. The spins on electrons - Net atomic magnetic moment: sum of moments from all electrons.






10. Superconductors expel magnetic fields - This is why a superconductor will float above a magnet.






11. Without passing a current a continually varying magnetic field will cause a current to flow






12. Flaws and Defects - They concentrate stress locally to levels high enough to rupture bonds.






13. Second phase particles with n > glass.






14. Impurities added to the semiconductor that contribute to excess electrons or holes. Doping = intentional impurities.






15. Is analogous to toughness.






16. Process by which geometric patterns are transferred from a mask (reticle) to a surface of a chip to form the device.






17. Occur when lots of dislocations move.






18. These materials are relatively unaffected by magnetic fields.






19. A high index of refraction (n value) allows for multiple internal reactions.






20. No appreciable plastic deformation. The crack propagates very fast; nearly perpendicular to applied stress. Cracks often propagate along specific crystal planes or boundaries.






21. 1. Insulators: Higher energy states NOT ACCESSIBLE due to gap 2. Semiconductors: Higher energy states separated by a smaller gap.






22. Undergo extensive plastic deformation prior to failure.






23. There is always some statistical distribution of flaws or defects.






24. Digitalized data in the form of electrical signals are transferred to and recorded digitally on a magnetic medium (tape or disk) - This transference is accomplished by a recording system that consists of a read/write head - "write" or record data by






25. The Magnetization of the material - and is essentially the dipole moment per unit volume. It is proportional to the applied field. Xm is the magnetic susceptibility.






26. 1. Ability of the material to absorb energy prior to fracture 2. Short term dynamic stressing - Car collisions - Bullets - Athletic equipment 3. This is different than toughness; energy necessary to push a crack (flaw) through a material 4. Useful in






27. ...occurs in bcc metals but not in fcc metals.






28. 1. Hard disk drives (granular/perpendicular media) 2. Recording tape (particulate media)






29. 1. Ductility- % elongation - % reduction in area - may be of use in metal forming operations (e.g. - stretch forming). This is convenient for mechanical testing - but not very meaningful for most deformation processing. 2. Toughness- Area beneath str






30. Transmitted light distorts electron clouds - The velocity of light in a material is lower than in a vacuum - Adding large ions to glass decreases the speed of light in the glass - Light can be "bent" (or refracted) as it passes through a transparent






31. Light Amplification by Stimulated Emission of Radiation






32. 1. Impose a compressive surface stress (to suppress surface cracks from growing) - Method 1: shot peening - Method 2: carburizing 2.Remove stress concentrators.






33. Allows you to calculate what happened G=F' x cos(lambda) - F=F' x cos(phi)






34. Width of smallest feature obtainable on Si surface






35. Transformer cores require soft magnetic materials - which are easily magnetized and de-magnetized - and have high electrical resistivity - Energy losses in transformers could be minimized if their cores were fabricated such that the easy magnetizatio






36. A three terminal device that acts like a simple "on-off" switch. (the basis of Integrated Circuits (IC) technology - used in computers - cell phones - automotive control - etc) - If voltage (potential) applied to the "gate" - current flows between th






37. Becomes harder (more strain) to stretch (elongate)






38. Specific heat = energy input/(mass*temperature change)






39. 1. Imperfections increase resistivity - grain boundaries - dislocations - impurity atoms - vacancies 2. Resistivity - increases with temperature - wt% impurity - and %CW






40. Measures impact energy 1. Strike a notched sample with an anvil 2. Measure how far the anvil travels following impact 3. Distance traveled is related to energy required to break the sample 4. Very high rate of loading. Makes materials more "brittle."






41. - The emission of light from a substance due to the absorption of energy. (Could be radiation - mechanical - or chemical energy. Could also be energetic particles.) - Traps and activator levels are produced by impurity additions to the material - Whe






42. Emitted light is in phase






43. Dramatic change in impact energy is associated with a change in fracture mode from brittle to ductile.






44. Elastic means reversible! This is not a permanent deformation.






45. Because of ionic & covalent-type bonding.






46. Diffuse image






47. With Increasing temperature - the saturation magnetization diminishes gradually and then abruptly drops to zero at Curie Temperature - Tc.






48. Plastic means permanent! When a small load is applied - bonds stretch & planes shear. Then when the load is no longer applied - the planes are still sheared.






49. Found in 26 metals and hundreds of alloys & compounds - Tc= critical temperature = termperature below which material is superconductive.






50. Growing interconnections to connect devices -Low electrical resistance - good adhesion to dielectric insulators.







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