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Engineering Materials

Subject : engineering
Instructions:
  • Answer 50 questions in 15 minutes.
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  • Match each statement with the correct term.
  • Don't refresh. All questions and answers are randomly picked and ordered every time you load a test.

This is a study tool. The 3 wrong answers for each question are randomly chosen from answers to other questions. So, you might find at times the answers obvious, but you will see it re-enforces your understanding as you take the test each time.
1. 1. Stress-strain behavior is not usually determined via tensile tests 2. Material fails before it yields 3. Bend/flexure tests are often used instead.






2. Transmitted light distorts electron clouds - The velocity of light in a material is lower than in a vacuum - Adding large ions to glass decreases the speed of light in the glass - Light can be "bent" (or refracted) as it passes through a transparent






3. Digitalized data in the form of electrical signals are transferred to and recorded digitally on a magnetic medium (tape or disk) - This transference is accomplished by a recording system that consists of a read/write head - "write" or record data by






4. Typical loading conditions are _____ enough to break all inter-atomic bonds






5. Cracks propagate along grain boundaries.






6. With Increasing temperature - the saturation magnetization diminishes gradually and then abruptly drops to zero at Curie Temperature - Tc.






7. Metals are good conductors since their _______is only partially filled.






8. Occur when lots of dislocations move.






9. heat flux = -(thermal conductivity)(temperature gradient) - Defines heat transfer by CONDUCTION

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10. Light Amplification by Stimulated Emission of Radiation






11. 1. Tensile (opening) 2. Sliding 3. Tearing






12. 1. Electron motions 2. The spins on electrons - Net atomic magnetic moment: sum of moments from all electrons.






13. Cracks pass through grains - often along specific crystal planes.






14. Is reflected - absorbed - scattered - and/or transmitted: Io=It+Ia+Ir+Is






15. Liquid polymer at room T - sandwiched between two sheets of glass - coated with transparent - electrically conductive film. - Character forming letters/ numbers etched on the face - Voltage applied disrupts the orientation of the rod- shaped molecule






16. This strength parameter is similar in magnitude to a tensile strength. Fracture occurs along the outermost sample edge - which is under a tensile load.






17. # of thermally generated electrons = # of holes (broken bonds)






18. The size of the material changes with a change in temperature - polymers have the largest values






19. 1. Data for Pure Silicon - electrical conductivity increases with T - opposite to metals






20. - A magnetic field is induced in the material B= Magnetic Induction (tesla) inside the material mu= permeability of a solid






21. Not ALL the light is refracted - SOME is reflected. Materials with a high index of refraction also have high reflectance - High R is bad for lens applications - since this leads to undesirable light losses or interference.






22. 1. Necking 2. Cavity formation 3. Cavity coalescence to form cracks 4. Crack propagation (growth) 5. Fracture






23. Measures Hardness 1. psia = 500 x HB 2. MPa = 3.45 x HB






24. Transformer cores require soft magnetic materials - which are easily magnetized and de-magnetized - and have high electrical resistivity - Energy losses in transformers could be minimized if their cores were fabricated such that the easy magnetizatio






25. Superconductors expel magnetic fields - This is why a superconductor will float above a magnet.






26. Allows flow of electrons in one direction only (useful to convert alternating current to direct current) - Result: no net current flow






27. 1. Yield = ratio of functional chips to total # of chips - Most yield loss during wafer processing - b/c of complex 2. Reliability - No device has infinite lifetime. Statistical methods to predict expected lifetime - Failure mechanisms: Diffusion reg






28. If a material has ________ - then the field generated by those moments must be added to the induced field.






29. Width of smallest feature obtainable on Si surface






30. Elastic means reversible! This is not a permanent deformation.






31. Wet: isotropic - under cut Dry: ansiotropic - directional






32. Flaws and Defects - They concentrate stress locally to levels high enough to rupture bonds.






33. Without passing a current a continually varying magnetic field will cause a current to flow






34. Specular: light reflecting off a mirror (average) - Diffuse: light reflecting off a white wall (local)






35. 1. Imperfections increase resistivity - grain boundaries - dislocations - impurity atoms - vacancies 2. Resistivity - increases with temperature - wt% impurity - and %CW






36. Another optical property - Depends on the wavelength of the visible spectrum.






37. - The emission of light from a substance due to the absorption of energy. (Could be radiation - mechanical - or chemical energy. Could also be energetic particles.) - Traps and activator levels are produced by impurity additions to the material - Whe






38. Different orientation of cleavage planes in grains.






39. 1. Ability of the material to absorb energy prior to fracture 2. Short term dynamic stressing - Car collisions - Bullets - Athletic equipment 3. This is different than toughness; energy necessary to push a crack (flaw) through a material 4. Useful in






40. Growth of an oxide layer by the reaction of oxygen with the substrate - Provides dopant masking and device isolation - IC technology uses 1. Thermal grown oxidation (dry) 2. Wet Oxidation 3. Selective Oxidation






41. Occur due to: restrained thermal expansion/contraction -temperature gradients that lead to differential dimensional changes sigma = Thermal Stress






42. Is analogous to toughness.






43. Ability to transmit a clear image - The image is clear.






44. Degree of opacity depends on size and number of particles - Opacity of metals is the result of conduction electrons absorbing photons in the visible range.






45. Dramatic change in impact energy is associated with a change in fracture mode from brittle to ductile.






46. Impurities added to the semiconductor that contribute to excess electrons or holes. Doping = intentional impurities.






47. A parallel-plate capacitor involves an insulator - or dielectric - between two metal electrodes. The charge density buildup at the capacitor surface is related to the dielectric constant of the material.






48. Undergo little or no plastic deformation.






49. Hardness is the resistance of a material to deformation by indentation - Useful in quality control - Hardness can provide a qualitative assessment of strength - Hardness cannot be used to quantitatively infer strength or ductility.






50. They are used to assess properties of ceramics & glasses.







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