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Test your basic knowledge |
Engineering Materials
Start Test
Study First
Subject
:
engineering
Instructions:
Answer 50 questions in 15 minutes.
If you are not ready to take this test, you can
study here
.
Match each statement with the correct term.
Don't refresh. All questions and answers are randomly picked and ordered every time you load a test.
This is a study tool. The 3 wrong answers for each question are randomly chosen from answers to other questions. So, you might find at times the answers obvious, but you will see it re-enforces your understanding as you take the test each time.
1. - The emission of light from a substance due to the absorption of energy. (Could be radiation - mechanical - or chemical energy. Could also be energetic particles.) - Traps and activator levels are produced by impurity additions to the material - Whe
Rockwell
Generation of a Magnetic Field - Vacuum
Luminescence
Translucent
2. These materials are "attracted" to magnetic fields.
Internal magnetic moments
Critical Properties of Superconductive Materials
Paramagnetic Materials
Where does DBTT occur?
3. High toughness; material resists crack propagation.
Modulus of Rupture (MOR)
Magnetic Storage Media Types
Domains in Ferromagnetic & Ferrimagnetic Materials
High impact energy
4. Defines the ability of a material to resist fracture even when a flaw exists - Directly depends on size of flaw and material properties - K(ic) is a materials constant
Stress Intensity Factor
How to gage the extent of plastic deformation
4 Types of Magnetism
Relative Permeability
5. Energy is stored as atomic vibrations - As temperature increases - the average energy of atomic vibrations increases.
HB (Brinell Hardness)
Magnetic Storage
Large Hardness
Heat Capacity from an Atomic Prospective
6. Wet: isotropic - under cut Dry: ansiotropic - directional
Etching
Hysteresis and Permanent Magnetization
Heat Capacity from an Atomic Prospective
What do magnetic moments arise from?
7. Measures Hardness 1. psia = 500 x HB 2. MPa = 3.45 x HB
Meissner Effect
HB (Brinell Hardness)
Linewidth
Soft Magnetic Materials
8. The ability of a material to be rapidly cooled and not fracture
Thermal Shock Resistance
How to gage the extent of plastic deformation
Impact energy
To improve fatigue life
9. Process by which geometric patterns are transferred from a mask (reticle) to a surface of a chip to form the device.
Rockwell
Lithography
Elastic Deformation
Incident Light
10. (sigma)=F/Ai (rho)=(rho)'(1+(epsilon))
True Stress
Liquid Crystal Displays (LCD's)
Holloman Equation
Generation of a Magnetic Field - Vacuum
11. Allows flow of electrons in one direction only (useful to convert alternating current to direct current) - Result: no net current flow
IC Devices: P-N Rectifying Junction
Griffith Crack Model
Why fracture surfaces have faceted texture
Liquid Crystal Displays (LCD's)
12. Measures Hardness - No major sample damage - Each scales runs to 130 but only useful in range 20-100 - Minor load is 10 kg - Major load: 60 kg (diamond) - 100 kg (1/16 in. ball) - 150 kg (diamond)
Rockwell
Relative Permeability
Internal magnetic moments
Incoherent
13. heat flux = -(thermal conductivity)(temperature gradient) - Defines heat transfer by CONDUCTION
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14. 1. Metals: Thermal energy puts many electrons into a higher energy state. 2. Energy States: Nearby energy states are accessible by thermal fluctuations.
IC Devices: P-N Rectifying Junction
Conduction & Electron Transport
Pure Semiconductors: Conductivity vs. T
Electrical Conduction
15. Flaws and Defects - They concentrate stress locally to levels high enough to rupture bonds.
Why materials fail in service
Soft Magnetic Materials
Generation of a Magnetic Field - Within a Solid Material
Rockwell
16. Is reflected - absorbed - scattered - and/or transmitted: Io=It+Ia+Ir+Is
Incident Light
IC Devices: P-N Rectifying Junction
Lithography
M is known as what?
17. Allows you to calculate what happened G=F' x cos(lambda) - F=F' x cos(phi)
Liquid Crystal Displays (LCD's)
HB (Brinell Hardness)
Force Decomposition
The three modes of crack surface displacement
18. # of thermally generated electrons = # of holes (broken bonds)
Ductile Fracture
Intrinsic Semiconductors
Force Decomposition
Liquid Crystal Displays (LCD's)
19. Growth of an oxide layer by the reaction of oxygen with the substrate - Provides dopant masking and device isolation - IC technology uses 1. Thermal grown oxidation (dry) 2. Wet Oxidation 3. Selective Oxidation
Luminescence
Domains in Ferromagnetic & Ferrimagnetic Materials
Oxidation
To improve fatigue life
20. Process by which metal atoms diffuse because of a potential.
Electromigration
How an LCD works
Electrical Conduction
True Strain
21. Elastic means reversible! This is not a permanent deformation.
Elastic Deformation
Coefficient of Thermal Expansion
Thermal Stresses
Intergranular Fracture
22. The ability of a material to transport heat - Atomic Perspective: Atomic vibrations and free electrons in hotter regions transport energy to cooler regions - Metals have the largest values
Thermal Conductivity
Ductile-to-Brittle Transition
Insulators
LASER
23. These materials are relatively unaffected by magnetic fields.
Internal magnetic moments
Diamagnetic Materials
Thermal expansion
Modulus of Rupture (MOR)
24. 1. Stress-strain behavior is not usually determined via tensile tests 2. Material fails before it yields 3. Bend/flexure tests are often used instead.
4 Types of Magnetism
Brittle Materials
Liquid Crystal Displays (LCD's)
Brittle Ceramics
25. Materials change size when temperature is changed
Luminescence examples
Translucent
Thermal expansion
Intergranular Fracture
26. - A magnetic field is induced in the material B= Magnetic Induction (tesla) inside the material mu= permeability of a solid
Opacifiers
Luminescence
Generation of a Magnetic Field - Within a Solid Material
Film Deposition
27. Reflectiviy is between 0.90 and 0.95 - Metal surfaces appear shiny - Most of absorbed light is reflected at the same wavelength (NO REFRACTION) - Small fraction of light may be absorbed - Color of reflected light depends on wavelength distribution of
Force Decomposition
Reflection of Light for Metals
Conduction & Electron Transport
Hard Magnetic Materials
28. Created by current through a coil N= total number of turns L= length of turns (m) I= current (ampere) H= applied magnetic field (ampere-turns/m) Bo= magnetic flux density in a vacuum (tesla)
Generation of a Magnetic Field - Vacuum
Luminescence
Thermal Expansion: Symmetric curve
Stages of Failure: Ductile Fracture
29. Because of ionic & covalent-type bonding.
LASER
Film Deposition
Why do ceramics have larger bonding energy?
Heat Capacity from an Atomic Prospective
30. Is analogous to toughness.
Generation of a Magnetic Field - Vacuum
Conduction & Electron Transport
Impact energy
Thermal Shock Resistance
31. 1. Tensile (opening) 2. Sliding 3. Tearing
Why do ceramics have larger bonding energy?
Refraction
The three modes of crack surface displacement
Impact - Toughness
32. A measure of the ease with which a B field can be induced inside a material.
Relative Permeability
Luminescence examples
Magnetic Storage Media Types
Brittle Fracture
33. Another optical property - Depends on the wavelength of the visible spectrum.
Color
Shear and Tensile Stress
Impact - Toughness
IC Devices: P-N Rectifying Junction
34. Not ALL the light is refracted - SOME is reflected. Materials with a high index of refraction also have high reflectance - High R is bad for lens applications - since this leads to undesirable light losses or interference.
There is no perfect material?
Refraction
Reflectance of Non-Metals
Transparent
35. 1. Fluorescent Lamp - tungstate or silicate coating on inside of tube emits white light due to UV light generated inside the tube. 2. TV screen - emits light as electron beam is scanned back and forth.
Luminescence examples
LASER
Fourier's Law
High impact energy
36. Specular: light reflecting off a mirror (average) - Diffuse: light reflecting off a white wall (local)
Two kinds of Reflection
Thermal Expansion: Asymmetric curve
Holloman Equation
Impact energy
37. 1. Yield = ratio of functional chips to total # of chips - Most yield loss during wafer processing - b/c of complex 2. Reliability - No device has infinite lifetime. Statistical methods to predict expected lifetime - Failure mechanisms: Diffusion reg
Ductile Fracture
Etching
Yield and Reliability
Refraction
38. Heat capacity.....- increases with temperature -for solids it reaches a limiting value of 3R
Dependence of Heat Capacity on Temperature
Rockwell
Where does DBTT occur?
Electromigration
39. Different orientation of cleavage planes in grains.
Transgranular Fracture
Why fracture surfaces have faceted texture
Hard Magnetic Materials
Fourier's Law
40. For a metal - there is no ______ - only reflection
Superconductivity
High impact energy
Refraction
Paramagnetic Materials
41. With Increasing temperature - the saturation magnetization diminishes gradually and then abruptly drops to zero at Curie Temperature - Tc.
What do magnetic moments arise from?
Reflection of Light for Metals
Impact - Toughness
Influence of Temperature on Magnetic Behavior
42. Typical loading conditions are _____ enough to break all inter-atomic bonds
Slip Bands
Why materials fail in service
Influence of Temperature on Magnetic Behavior
Not severe
43. Dramatic change in impact energy is associated with a change in fracture mode from brittle to ductile.
Electrical Conduction
Large Hardness
Why materials fail in service
Ductile-to-Brittle Transition
44. Small Coercivities - Used for electric motors - Example: commercial iron 99.95 Fe
Bending tests
Paramagnetic Materials
Soft Magnetic Materials
Sparkle of Diamonds
45. This strength parameter is similar in magnitude to a tensile strength. Fracture occurs along the outermost sample edge - which is under a tensile load.
Modulus of Rupture (MOR)
Sparkle of Diamonds
Coherent
Thermal Expansion: Asymmetric curve
46. The size of the material changes with a change in temperature - polymers have the largest values
Transparent
Not severe
Coefficient of Thermal Expansion
True Stress
47. Failure under cyclic stress 1. It can cause part failure - even though (sigma)max < (sigma)c 2. Causes ~90% of mechanical engineering failures.
Valence band
Critical Properties of Superconductive Materials
Fatigue
Influence of Temperature on Magnetic Behavior
48. Without passing a current a continually varying magnetic field will cause a current to flow
Intergranular Fracture
Response to a Magnetic Field
4 Types of Magnetism
Reflection of Light for Metals
49. The magnetic hysteresis phenomenon: Stage 1: Initial (unmagnetized state) Stage 2: Apply H - align domains Stage 3: Remove H - alignment remains => Permanent magnet Stage 4: Coercivity - Hc negative H needed to demagnitize Stage 5: Apply -H - align d
Extrinsic Semiconductors
Hysteresis and Permanent Magnetization
Intrinsic Semiconductors
Brittle Fracture
50. Cp: Heat capacity at constant pressure Cv: Heat capacity at constant volume.
Intergranular Fracture
Two ways to measure heat capacity
Response to a Magnetic Field
Opacity