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Engineering Materials

Subject : engineering
Instructions:
  • Answer 50 questions in 15 minutes.
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  • Match each statement with the correct term.
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This is a study tool. The 3 wrong answers for each question are randomly chosen from answers to other questions. So, you might find at times the answers obvious, but you will see it re-enforces your understanding as you take the test each time.
1. Occur when lots of dislocations move.






2. Growing interconnections to connect devices -Low electrical resistance - good adhesion to dielectric insulators.






3. Measures Hardness 1. psia = 500 x HB 2. MPa = 3.45 x HB






4. Second phase particles with n > glass.






5. They are used to assess properties of ceramics & glasses.






6. Increase temperature - no increase in interatomic separation - no thermal expansion






7. Occurs at a single pore or other solid by refraction n = 1 for pore (air) n > 1 for the solid - n ~ 1.5 for glass - Scattering effect is maximized by pore/particle size within 400-700 nm range - Reason for Opacity in ceramics - glasses and polymers.






8. Found in 26 metals and hundreds of alloys & compounds - Tc= critical temperature = termperature below which material is superconductive.






9. Plastic means permanent! When a small load is applied - bonds stretch & planes shear. Then when the load is no longer applied - the planes are still sheared.






10. Loss of image transmission - You get no image - There is no light transmission - and therefore reflects - scatters - or absorbs ALL of it. Both mirrors and carbon black are opaque.






11. 1. Tensile (opening) 2. Sliding 3. Tearing






12. Cp: Heat capacity at constant pressure Cv: Heat capacity at constant volume.






13. A three terminal device that acts like a simple "on-off" switch. (the basis of Integrated Circuits (IC) technology - used in computers - cell phones - automotive control - etc) - If voltage (potential) applied to the "gate" - current flows between th






14. Without passing a current a continually varying magnetic field will cause a current to flow






15. Elastic means reversible! This is not a permanent deformation.






16. 1. Ductility- % elongation - % reduction in area - may be of use in metal forming operations (e.g. - stretch forming). This is convenient for mechanical testing - but not very meaningful for most deformation processing. 2. Toughness- Area beneath str






17. Failure under cyclic stress 1. It can cause part failure - even though (sigma)max < (sigma)c 2. Causes ~90% of mechanical engineering failures.






18. Resistance to plastic deformation of cracking in compression - and better wear properties.






19. heat flux = -(thermal conductivity)(temperature gradient) - Defines heat transfer by CONDUCTION

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20. There is always some statistical distribution of flaws or defects.






21. 1. General yielding occurs if flaw size a < a(critical) 2. Catastrophic fast fracture occurs if flaw size a > a(critical)






22. Defines the ability of a material to resist fracture even when a flaw exists - Directly depends on size of flaw and material properties - K(ic) is a materials constant






23. (sigma)=K(sigma)^n . K = strength coefficient - n = work hardening rate or strain hardening exponent. Large n value increases strength and hardness.






24. Rho=F/A - tau=G/A . Depending on what angle the force is applied - and what angle the crystal is at - it takes different amounts of force to induce plastic deformation.






25. Growth of an oxide layer by the reaction of oxygen with the substrate - Provides dopant masking and device isolation - IC technology uses 1. Thermal grown oxidation (dry) 2. Wet Oxidation 3. Selective Oxidation






26. 1. Data for Pure Silicon - electrical conductivity increases with T - opposite to metals






27. The Magnetization of the material - and is essentially the dipole moment per unit volume. It is proportional to the applied field. Xm is the magnetic susceptibility.






28. Different orientation of cleavage planes in grains.






29. This strength parameter is similar in magnitude to a tensile strength. Fracture occurs along the outermost sample edge - which is under a tensile load.






30. Hardness is the resistance of a material to deformation by indentation - Useful in quality control - Hardness can provide a qualitative assessment of strength - Hardness cannot be used to quantitatively infer strength or ductility.






31. Metals are good conductors since their _______is only partially filled.






32. Transmitted light distorts electron clouds - The velocity of light in a material is lower than in a vacuum - Adding large ions to glass decreases the speed of light in the glass - Light can be "bent" (or refracted) as it passes through a transparent






33. Not ALL the light is refracted - SOME is reflected. Materials with a high index of refraction also have high reflectance - High R is bad for lens applications - since this leads to undesirable light losses or interference.






34. Undergo little or no plastic deformation.






35. Reflectiviy is between 0.90 and 0.95 - Metal surfaces appear shiny - Most of absorbed light is reflected at the same wavelength (NO REFRACTION) - Small fraction of light may be absorbed - Color of reflected light depends on wavelength distribution of






36. - Metals that exhibit high ductility - exhibit high toughness. Ceramics are very strong - but have low ductility and low toughness - Polymers are very ductile but are not generally very strong in shear (compared to metals and ceramics). They have low






37. Digitalized data in the form of electrical signals are transferred to and recorded digitally on a magnetic medium (tape or disk) - This transference is accomplished by a recording system that consists of a read/write head - "write" or record data by






38. To build a device - various thin metal or insulating films are grown on top of each other - Evaporation - MBE - Sputtering - CVD (ALD)






39. The ability of a material to absorb heat - Quantitatively: The energy required to produce a unit rise in temperature for one mole of a material.






40. Becomes harder (more strain) to stretch (elongate)






41. Specific heat = energy input/(mass*temperature change)






42. Cracks propagate along grain boundaries.






43. High toughness; material resists crack propagation.






44. No appreciable plastic deformation. The crack propagates very fast; nearly perpendicular to applied stress. Cracks often propagate along specific crystal planes or boundaries.






45. Wet: isotropic - under cut Dry: ansiotropic - directional






46. Allows flow of electrons in one direction only (useful to convert alternating current to direct current) - Result: no net current flow






47. 1. Insulators: Higher energy states NOT ACCESSIBLE due to gap 2. Semiconductors: Higher energy states separated by a smaller gap.






48. These materials are "attracted" to magnetic fields.






49. With Increasing temperature - the saturation magnetization diminishes gradually and then abruptly drops to zero at Curie Temperature - Tc.






50. Energy is stored as atomic vibrations - As temperature increases - the average energy of atomic vibrations increases.







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