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Test your basic knowledge |
Engineering Materials
Start Test
Study First
Subject
:
engineering
Instructions:
Answer 50 questions in 15 minutes.
If you are not ready to take this test, you can
study here
.
Match each statement with the correct term.
Don't refresh. All questions and answers are randomly picked and ordered every time you load a test.
This is a study tool. The 3 wrong answers for each question are randomly chosen from answers to other questions. So, you might find at times the answers obvious, but you will see it re-enforces your understanding as you take the test each time.
1. 1. Insulators: Higher energy states NOT ACCESSIBLE due to gap 2. Semiconductors: Higher energy states separated by a smaller gap.
Transgranular Fracture
Energy States: Insulators and Semiconductors
Valence band
Film Deposition
2. Is reflected - absorbed - scattered - and/or transmitted: Io=It+Ia+Ir+Is
Incident Light
Where does DBTT occur?
Transparent
Reflectance of Non-Metals
3. Measures impact energy 1. Strike a notched sample with an anvil 2. Measure how far the anvil travels following impact 3. Distance traveled is related to energy required to break the sample 4. Very high rate of loading. Makes materials more "brittle."
Extrinsic Semiconductors
Why do ceramics have larger bonding energy?
Refraction
Charpy or Izod test
4. Undergo extensive plastic deformation prior to failure.
Ductile Materials
4 Types of Magnetism
Scattering
Impact energy
5. Because of ionic & covalent-type bonding.
Why materials fail in service
Why do ceramics have larger bonding energy?
The Transistor
True Stress
6. A measure of the ease with which a B field can be induced inside a material.
Relative Permeability
Force Decomposition
Not severe
Griffith Crack Model
7. - The emission of light from a substance due to the absorption of energy. (Could be radiation - mechanical - or chemical energy. Could also be energetic particles.) - Traps and activator levels are produced by impurity additions to the material - Whe
True Strain
Incoherent
Luminescence
Not severe
8. Measures Hardness 1. psia = 500 x HB 2. MPa = 3.45 x HB
HB (Brinell Hardness)
Magnetic Storage Media Types
IC Devices: P-N Rectifying Junction
Refraction
9. Large coercivities - Used for permanent magnets - Add particles/voids to inhibit domain wall motion - Example: tungsten steel
4 Types of Magnetism
Hard Magnetic Materials
Oxidation
To improve fatigue life
10. Increase temperature - no increase in interatomic separation - no thermal expansion
Thermal Expansion: Symmetric curve
Griffith Crack Model
Electromigration
Critical Properties of Superconductive Materials
11. 1. Tc= critical temperature- if T>Tc not superconducting 2. Jc= critical current density - if J>Jc not superconducting 3. Hc= critical magnetic field - if H > Hc not superconducting
To improve fatigue life
Critical Properties of Superconductive Materials
Impact energy
Engineering Fracture Performance
12. 1. Electron motions 2. The spins on electrons - Net atomic magnetic moment: sum of moments from all electrons.
Stress Intensity values
There is no perfect material?
Work Hardening
What do magnetic moments arise from?
13. These materials are relatively unaffected by magnetic fields.
Oxidation
Luminescence examples
Diamagnetic Materials
Thermal Shock Resistance
14. Wet: isotropic - under cut Dry: ansiotropic - directional
Etching
Color
Elastic Deformation
Conduction & Electron Transport
15. Measures Hardness - No major sample damage - Each scales runs to 130 but only useful in range 20-100 - Minor load is 10 kg - Major load: 60 kg (diamond) - 100 kg (1/16 in. ball) - 150 kg (diamond)
Rockwell
Valence band
Where does DBTT occur?
Incoherent
16. Rho=F/A - tau=G/A . Depending on what angle the force is applied - and what angle the crystal is at - it takes different amounts of force to induce plastic deformation.
Liquid Crystal Displays (LCD's)
Linewidth
Brittle Fracture
Shear and Tensile Stress
17. Sigma=ln(li/lo)
Ductile Fracture
Color
True Strain
Brittle Fracture
18. Stress concentration at a crack tips
Griffith Crack Model
Extrinsic Semiconductors
Bending tests
Not severe
19. To build a device - various thin metal or insulating films are grown on top of each other - Evaporation - MBE - Sputtering - CVD (ALD)
Plastic Deformation (Metals)
Relative Permeability
Thermal expansion
Film Deposition
20. The ability of a material to be rapidly cooled and not fracture
Thermal Conductivity
Intergranular Fracture
Thermal Shock Resistance
Not severe
21. Elastic means reversible! This is not a permanent deformation.
Elastic Deformation
Large Hardness
Hard Magnetic Materials
Reflectance of Non-Metals
22. Ohms Law: voltage drop = current * resistance
Thermal Expansion: Symmetric curve
Iron-Silicon Alloy in Transformer Cores
The Transistor
Electrical Conduction
23. Occur due to: restrained thermal expansion/contraction -temperature gradients that lead to differential dimensional changes sigma = Thermal Stress
Scattering
Incident Light
Where does DBTT occur?
Thermal Stresses
24. - A magnetic field is induced in the material B= Magnetic Induction (tesla) inside the material mu= permeability of a solid
LASER
How an LCD works
What do magnetic moments arise from?
Generation of a Magnetic Field - Within a Solid Material
25. (sigma)=F/Ai (rho)=(rho)'(1+(epsilon))
Modulus of Rupture (MOR)
Transgranular Fracture
True Stress
Reflectance of Non-Metals
26. Another optical property - Depends on the wavelength of the visible spectrum.
Brittle Ceramics
Color
Lithography
Generation of a Magnetic Field - Vacuum
27. For a metal - there is no ______ - only reflection
True Stress
Ductile-to-Brittle Transition
Refraction
Ductile Fracture
28. Metals are good conductors since their _______is only partially filled.
Stress Intensity Factor
High impact energy
Valence band
Lithography
29. Second phase particles with n > glass.
Modulus of Rupture (MOR)
Stress Intensity values
Opacifiers
Stress Intensity Factor
30. The ability of a material to absorb heat - Quantitatively: The energy required to produce a unit rise in temperature for one mole of a material.
High impact energy
Hardness
Heat Capacity
Rockwell
31. Created by current through a coil N= total number of turns L= length of turns (m) I= current (ampere) H= applied magnetic field (ampere-turns/m) Bo= magnetic flux density in a vacuum (tesla)
True Stress
Generation of a Magnetic Field - Vacuum
Insulators
Thermal Shock Resistance
32. Is analogous to toughness.
The Transistor
Soft Magnetic Materials
Impact energy
Bending tests
33. ...occurs in bcc metals but not in fcc metals.
Reflection of Light for Metals
Ductile-to-Brittle Transition
Where does DBTT occur?
Extrinsic Semiconductors
34. Loss of image transmission - You get no image - There is no light transmission - and therefore reflects - scatters - or absorbs ALL of it. Both mirrors and carbon black are opaque.
What do magnetic moments arise from?
Paramagnetic Materials
Opaque
Transgranular Fracture
35. Reflectiviy is between 0.90 and 0.95 - Metal surfaces appear shiny - Most of absorbed light is reflected at the same wavelength (NO REFRACTION) - Small fraction of light may be absorbed - Color of reflected light depends on wavelength distribution of
Engineering Fracture Performance
Reflection of Light for Metals
Two kinds of Reflection
High impact energy
36. Without passing a current a continually varying magnetic field will cause a current to flow
Generation of a Magnetic Field - Within a Solid Material
Response to a Magnetic Field
True Strain
Valence band
37. Diffuse image
Brittle Ceramics
High impact energy
Brittle Materials
Translucent
38. heat flux = -(thermal conductivity)(temperature gradient) - Defines heat transfer by CONDUCTION
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39. Growing interconnections to connect devices -Low electrical resistance - good adhesion to dielectric insulators.
Where does DBTT occur?
Specific Heat
Luminescence examples
Metallization
40. Materials change size when temperature is changed
Modulus of Rupture (MOR)
Thermal expansion
Extrinsic Semiconductors
High impact energy
41. These materials are "attracted" to magnetic fields.
Luminescence
Brittle Fracture
Dependence of Heat Capacity on Temperature
Paramagnetic Materials
42. 1. Diamagnetic (Xm ~ 10^-5) - small and negative magnetic susceptibilities 2. Paramagnetic (Xm ~ 10^-4) - small and positive magnetic susceptibilities 3. Ferromagnetic - large magnetic susceptibilities 4. Ferrimagnetic (Xm as large as 10^6) - large m
Impact energy
4 Types of Magnetism
Stress Intensity values
Not severe
43. Degree of opacity depends on size and number of particles - Opacity of metals is the result of conduction electrons absorbing photons in the visible range.
Opacity
Fatigue
Intergranular Fracture
Why materials fail in service
44. This strength parameter is similar in magnitude to a tensile strength. Fracture occurs along the outermost sample edge - which is under a tensile load.
Ductile Fracture
Rockwell
Modulus of Rupture (MOR)
Paramagnetic Materials
45. Becomes harder (more strain) to stretch (elongate)
Work Hardening
Bending tests
IC Devices: P-N Rectifying Junction
Coherent
46. Specific heat = energy input/(mass*temperature change)
Thermal Stresses
Specific Heat
Soft Magnetic Materials
Why do ceramics have larger bonding energy?
47. A high index of refraction (n value) allows for multiple internal reactions.
Sparkle of Diamonds
Electrical Conduction
Pure Semiconductors: Conductivity vs. T
High impact energy
48. Dimples on fracture surface correspond to microcavities that initiate crack formation.
Fatigue
Refraction
Brittle Materials
Ductile Fracture
49. Failure under cyclic stress 1. It can cause part failure - even though (sigma)max < (sigma)c 2. Causes ~90% of mechanical engineering failures.
Brittle Materials
Fatigue
Why fracture surfaces have faceted texture
Domains in Ferromagnetic & Ferrimagnetic Materials
50. - Metals that exhibit high ductility - exhibit high toughness. Ceramics are very strong - but have low ductility and low toughness - Polymers are very ductile but are not generally very strong in shear (compared to metals and ceramics). They have low
Griffith Crack Model
Stress Intensity values
Film Deposition
Modulus of Rupture (MOR)