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Test your basic knowledge |
Engineering Materials
Start Test
Study First
Subject
:
engineering
Instructions:
Answer 50 questions in 15 minutes.
If you are not ready to take this test, you can
study here
.
Match each statement with the correct term.
Don't refresh. All questions and answers are randomly picked and ordered every time you load a test.
This is a study tool. The 3 wrong answers for each question are randomly chosen from answers to other questions. So, you might find at times the answers obvious, but you will see it re-enforces your understanding as you take the test each time.
1. Large coercivities - Used for permanent magnets - Add particles/voids to inhibit domain wall motion - Example: tungsten steel
Heat Capacity from an Atomic Prospective
Generation of a Magnetic Field - Vacuum
Ductile Materials
Hard Magnetic Materials
2. # of thermally generated electrons = # of holes (broken bonds)
Intergranular Fracture
There is no perfect material?
Opaque
Intrinsic Semiconductors
3. Second phase particles with n > glass.
Intrinsic Semiconductors
Opacifiers
Stress Intensity values
Valence band
4. Transmitted light distorts electron clouds - The velocity of light in a material is lower than in a vacuum - Adding large ions to glass decreases the speed of light in the glass - Light can be "bent" (or refracted) as it passes through a transparent
Brittle Ceramics
Paramagnetic Materials
How an LCD works
Refraction
5. Is analogous to toughness.
Linewidth
Impact energy
Slip Bands
The three modes of crack surface displacement
6. Dimples on fracture surface correspond to microcavities that initiate crack formation.
Ductile Fracture
Coefficient of Thermal Expansion
Iron-Silicon Alloy in Transformer Cores
Elastic Deformation
7. Superconductors expel magnetic fields - This is why a superconductor will float above a magnet.
Superconductivity
Meissner Effect
Bending tests
How to gage the extent of plastic deformation
8. The ability of a material to transport heat - Atomic Perspective: Atomic vibrations and free electrons in hotter regions transport energy to cooler regions - Metals have the largest values
Magnetic Storage
Thermal Conductivity
Shear and Tensile Stress
High impact energy
9. A measure of the ease with which a B field can be induced inside a material.
Energy States: Insulators and Semiconductors
LASER
Relative Permeability
Extrinsic Semiconductors
10. No appreciable plastic deformation. The crack propagates very fast; nearly perpendicular to applied stress. Cracks often propagate along specific crystal planes or boundaries.
Opacity
IC Devices: P-N Rectifying Junction
Charpy or Izod test
Brittle Fracture
11. Heat capacity.....- increases with temperature -for solids it reaches a limiting value of 3R
Dependence of Heat Capacity on Temperature
Thermal Conductivity
Relative Permeability
Liquid Crystal Displays (LCD's)
12. If a material has ________ - then the field generated by those moments must be added to the induced field.
IC Devices: P-N Rectifying Junction
Fatigue
Internal magnetic moments
Magnetic Storage
13. The magnetic hysteresis phenomenon: Stage 1: Initial (unmagnetized state) Stage 2: Apply H - align domains Stage 3: Remove H - alignment remains => Permanent magnet Stage 4: Coercivity - Hc negative H needed to demagnitize Stage 5: Apply -H - align d
Hysteresis and Permanent Magnetization
Metallization
Brittle Materials
IC Devices: P-N Rectifying Junction
14. 1. Tc= critical temperature- if T>Tc not superconducting 2. Jc= critical current density - if J>Jc not superconducting 3. Hc= critical magnetic field - if H > Hc not superconducting
High impact energy
Critical Properties of Superconductive Materials
Diamagnetic Materials
IC Devices: P-N Rectifying Junction
15. Becomes harder (more strain) to stretch (elongate)
Work Hardening
How an LCD works
Elastic Deformation
Charpy or Izod test
16. Increase temperature - increase in interatomic separation - thermal expansion
Intergranular Fracture
Thermal Expansion: Asymmetric curve
Hysteresis and Permanent Magnetization
Two kinds of Reflection
17. A parallel-plate capacitor involves an insulator - or dielectric - between two metal electrodes. The charge density buildup at the capacitor surface is related to the dielectric constant of the material.
Insulators
Holloman Equation
The three modes of crack surface displacement
Transparent
18. Not ALL the light is refracted - SOME is reflected. Materials with a high index of refraction also have high reflectance - High R is bad for lens applications - since this leads to undesirable light losses or interference.
The three modes of crack surface displacement
Reflectance of Non-Metals
Stress Intensity Factor
Why do ceramics have larger bonding energy?
19. - The emission of light from a substance due to the absorption of energy. (Could be radiation - mechanical - or chemical energy. Could also be energetic particles.) - Traps and activator levels are produced by impurity additions to the material - Whe
Coefficient of Thermal Expansion
Impact - Toughness
Conduction & Electron Transport
Luminescence
20. This strength parameter is similar in magnitude to a tensile strength. Fracture occurs along the outermost sample edge - which is under a tensile load.
Refraction
High impact energy
Modulus of Rupture (MOR)
Extrinsic Semiconductors
21. For a metal - there is no ______ - only reflection
Why do ceramics have larger bonding energy?
The Transistor
Intrinsic Semiconductors
Refraction
22. Process by which geometric patterns are transferred from a mask (reticle) to a surface of a chip to form the device.
Iron-Silicon Alloy in Transformer Cores
Extrinsic Semiconductors
Transparent
Lithography
23. Process by which metal atoms diffuse because of a potential.
Plastic Deformation (Metals)
Superconductivity
Electromigration
Magnetic Storage
24. The ability of a material to absorb heat - Quantitatively: The energy required to produce a unit rise in temperature for one mole of a material.
Etching
Heat Capacity
Soft Magnetic Materials
LASER
25. There is always some statistical distribution of flaws or defects.
Thermal Expansion: Symmetric curve
There is no perfect material?
4 Types of Magnetism
To improve fatigue life
26. Failure under cyclic stress 1. It can cause part failure - even though (sigma)max < (sigma)c 2. Causes ~90% of mechanical engineering failures.
Relative Permeability
Hysteresis and Permanent Magnetization
To improve fatigue life
Fatigue
27. As the applied field (H) increases the magnetic domains change shape and size by movement of domain boundaries.
Domains in Ferromagnetic & Ferrimagnetic Materials
Translucent
The three modes of crack surface displacement
Heat Capacity from an Atomic Prospective
28. Hardness is the resistance of a material to deformation by indentation - Useful in quality control - Hardness can provide a qualitative assessment of strength - Hardness cannot be used to quantitatively infer strength or ductility.
Hardness
Opaque
Stages of Failure: Ductile Fracture
Modulus of Rupture (MOR)
29. Elastic means reversible! This is not a permanent deformation.
There is no perfect material?
Elastic Deformation
Metallization
Thermal Stresses
30. (sigma)=F/Ai (rho)=(rho)'(1+(epsilon))
How an LCD works
Griffith Crack Model
True Stress
Critical Properties of Superconductive Materials
31. To build a device - various thin metal or insulating films are grown on top of each other - Evaporation - MBE - Sputtering - CVD (ALD)
Film Deposition
Generation of a Magnetic Field - Within a Solid Material
Ductile Materials
Internal magnetic moments
32. Ohms Law: voltage drop = current * resistance
Electrical Conduction
LASER
Coherent
Rockwell
33. The ability of a material to be rapidly cooled and not fracture
True Stress
Soft Magnetic Materials
Thermal Expansion: Asymmetric curve
Thermal Shock Resistance
34. Degree of opacity depends on size and number of particles - Opacity of metals is the result of conduction electrons absorbing photons in the visible range.
Opacity
True Strain
Yield and Reliability
Holloman Equation
35. 1. General yielding occurs if flaw size a < a(critical) 2. Catastrophic fast fracture occurs if flaw size a > a(critical)
Charpy or Izod test
Engineering Fracture Performance
Fourier's Law
There is no perfect material?
36. Metals are good conductors since their _______is only partially filled.
Refraction
Valence band
Metals: Resistivity vs. T - Impurities
Work Hardening
37. - Metals that exhibit high ductility - exhibit high toughness. Ceramics are very strong - but have low ductility and low toughness - Polymers are very ductile but are not generally very strong in shear (compared to metals and ceramics). They have low
Conduction & Electron Transport
Liquid Crystal Displays (LCD's)
Stress Intensity values
Engineering Fracture Performance
38. The size of the material changes with a change in temperature - polymers have the largest values
Coefficient of Thermal Expansion
Energy States: Insulators and Semiconductors
Extrinsic Semiconductors
Hysteresis and Permanent Magnetization
39. Allows you to calculate what happened G=F' x cos(lambda) - F=F' x cos(phi)
Force Decomposition
Luminescence
Coherent
True Strain
40. Occur when lots of dislocations move.
Superconductivity
M is known as what?
Thermal Expansion: Asymmetric curve
Slip Bands
41. Different orientation of cleavage planes in grains.
Why fracture surfaces have faceted texture
Opacifiers
Insulators
The three modes of crack surface displacement
42. Cracks pass through grains - often along specific crystal planes.
Generation of a Magnetic Field - Vacuum
Stress Intensity values
Brittle Materials
Transgranular Fracture
43. Resistance to plastic deformation of cracking in compression - and better wear properties.
Thermal Shock Resistance
Engineering Fracture Performance
Large Hardness
Holloman Equation
44. These materials are relatively unaffected by magnetic fields.
Diamagnetic Materials
True Strain
Ductile Materials
Thermal Shock Resistance
45. With Increasing temperature - the saturation magnetization diminishes gradually and then abruptly drops to zero at Curie Temperature - Tc.
LASER
Influence of Temperature on Magnetic Behavior
Iron-Silicon Alloy in Transformer Cores
Extrinsic Semiconductors
46. Impurities added to the semiconductor that contribute to excess electrons or holes. Doping = intentional impurities.
Plastic Deformation (Metals)
Meissner Effect
Extrinsic Semiconductors
M is known as what?
47. Liquid polymer at room T - sandwiched between two sheets of glass - coated with transparent - electrically conductive film. - Character forming letters/ numbers etched on the face - Voltage applied disrupts the orientation of the rod- shaped molecule
HB (Brinell Hardness)
Bending tests
How an LCD works
Incoherent
48. Typical loading conditions are _____ enough to break all inter-atomic bonds
What do magnetic moments arise from?
Internal magnetic moments
Not severe
Influence of Temperature on Magnetic Behavior
49. Materials change size when temperature is changed
Refraction
Thermal expansion
Work Hardening
High impact energy
50. The Magnetization of the material - and is essentially the dipole moment per unit volume. It is proportional to the applied field. Xm is the magnetic susceptibility.
Iron-Silicon Alloy in Transformer Cores
Incident Light
Fourier's Law
M is known as what?