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Engineering Materials

Subject : engineering
Instructions:
  • Answer 50 questions in 15 minutes.
  • If you are not ready to take this test, you can study here.
  • Match each statement with the correct term.
  • Don't refresh. All questions and answers are randomly picked and ordered every time you load a test.

This is a study tool. The 3 wrong answers for each question are randomly chosen from answers to other questions. So, you might find at times the answers obvious, but you will see it re-enforces your understanding as you take the test each time.
1. There is always some statistical distribution of flaws or defects.






2. If a material has ________ - then the field generated by those moments must be added to the induced field.






3. For a metal - there is no ______ - only reflection






4. Is analogous to toughness.






5. # of thermally generated electrons = # of holes (broken bonds)






6. Light Amplification by Stimulated Emission of Radiation






7. Created by current through a coil N= total number of turns L= length of turns (m) I= current (ampere) H= applied magnetic field (ampere-turns/m) Bo= magnetic flux density in a vacuum (tesla)






8. Digitalized data in the form of electrical signals are transferred to and recorded digitally on a magnetic medium (tape or disk) - This transference is accomplished by a recording system that consists of a read/write head - "write" or record data by






9. Occur when lots of dislocations move.






10. - Metals that exhibit high ductility - exhibit high toughness. Ceramics are very strong - but have low ductility and low toughness - Polymers are very ductile but are not generally very strong in shear (compared to metals and ceramics). They have low






11. Is reflected - absorbed - scattered - and/or transmitted: Io=It+Ia+Ir+Is






12. Process by which metal atoms diffuse because of a potential.






13. Diffuse image






14. Because of ionic & covalent-type bonding.






15. Ability to transmit a clear image - The image is clear.






16. Reflectiviy is between 0.90 and 0.95 - Metal surfaces appear shiny - Most of absorbed light is reflected at the same wavelength (NO REFRACTION) - Small fraction of light may be absorbed - Color of reflected light depends on wavelength distribution of






17. Impurities added to the semiconductor that contribute to excess electrons or holes. Doping = intentional impurities.






18. Flaws and Defects - They concentrate stress locally to levels high enough to rupture bonds.






19. - A magnetic field is induced in the material B= Magnetic Induction (tesla) inside the material mu= permeability of a solid






20. Failure under cyclic stress 1. It can cause part failure - even though (sigma)max < (sigma)c 2. Causes ~90% of mechanical engineering failures.






21. -> fluorescent light - electron transitions occur randomly - light waves are out of phase with each other.






22. These are liquid crystal polymers- not your normal "crystal" -Rigid - rod shaped molecules are aligned even in liquid form.

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23. Loss of image transmission - You get no image - There is no light transmission - and therefore reflects - scatters - or absorbs ALL of it. Both mirrors and carbon black are opaque.






24. Growing interconnections to connect devices -Low electrical resistance - good adhesion to dielectric insulators.






25. Cp: Heat capacity at constant pressure Cv: Heat capacity at constant volume.






26. 1. Insulators: Higher energy states NOT ACCESSIBLE due to gap 2. Semiconductors: Higher energy states separated by a smaller gap.






27. Measures Hardness - No major sample damage - Each scales runs to 130 but only useful in range 20-100 - Minor load is 10 kg - Major load: 60 kg (diamond) - 100 kg (1/16 in. ball) - 150 kg (diamond)






28. Degree of opacity depends on size and number of particles - Opacity of metals is the result of conduction electrons absorbing photons in the visible range.






29. Another optical property - Depends on the wavelength of the visible spectrum.






30. Transformer cores require soft magnetic materials - which are easily magnetized and de-magnetized - and have high electrical resistivity - Energy losses in transformers could be minimized if their cores were fabricated such that the easy magnetizatio






31. Measures Hardness 1. psia = 500 x HB 2. MPa = 3.45 x HB






32. 1. Electron motions 2. The spins on electrons - Net atomic magnetic moment: sum of moments from all electrons.






33. A three terminal device that acts like a simple "on-off" switch. (the basis of Integrated Circuits (IC) technology - used in computers - cell phones - automotive control - etc) - If voltage (potential) applied to the "gate" - current flows between th






34. Specific heat = energy input/(mass*temperature change)






35. Increase temperature - no increase in interatomic separation - no thermal expansion






36. Materials change size when temperature is changed






37. heat flux = -(thermal conductivity)(temperature gradient) - Defines heat transfer by CONDUCTION

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38. (sigma)=F/Ai (rho)=(rho)'(1+(epsilon))






39. Allows you to calculate what happened G=F' x cos(lambda) - F=F' x cos(phi)






40. Occur due to: restrained thermal expansion/contraction -temperature gradients that lead to differential dimensional changes sigma = Thermal Stress






41. 1. Data for Pure Silicon - electrical conductivity increases with T - opposite to metals






42. Plastic means permanent! When a small load is applied - bonds stretch & planes shear. Then when the load is no longer applied - the planes are still sheared.






43. Undergo little or no plastic deformation.






44. Small Coercivities - Used for electric motors - Example: commercial iron 99.95 Fe






45. Sigma=ln(li/lo)






46. 1. Yield = ratio of functional chips to total # of chips - Most yield loss during wafer processing - b/c of complex 2. Reliability - No device has infinite lifetime. Statistical methods to predict expected lifetime - Failure mechanisms: Diffusion reg






47. Rho=F/A - tau=G/A . Depending on what angle the force is applied - and what angle the crystal is at - it takes different amounts of force to induce plastic deformation.






48. Dimples on fracture surface correspond to microcavities that initiate crack formation.






49. Superconductors expel magnetic fields - This is why a superconductor will float above a magnet.






50. (sigma)=K(sigma)^n . K = strength coefficient - n = work hardening rate or strain hardening exponent. Large n value increases strength and hardness.







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