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Engineering Materials

Subject : engineering
Instructions:
  • Answer 50 questions in 15 minutes.
  • If you are not ready to take this test, you can study here.
  • Match each statement with the correct term.
  • Don't refresh. All questions and answers are randomly picked and ordered every time you load a test.

This is a study tool. The 3 wrong answers for each question are randomly chosen from answers to other questions. So, you might find at times the answers obvious, but you will see it re-enforces your understanding as you take the test each time.
1. A three terminal device that acts like a simple "on-off" switch. (the basis of Integrated Circuits (IC) technology - used in computers - cell phones - automotive control - etc) - If voltage (potential) applied to the "gate" - current flows between th






2. 1. Tensile (opening) 2. Sliding 3. Tearing






3. Emitted light is in phase






4. Process by which geometric patterns are transferred from a mask (reticle) to a surface of a chip to form the device.






5. Cracks propagate along grain boundaries.






6. 1. Impose a compressive surface stress (to suppress surface cracks from growing) - Method 1: shot peening - Method 2: carburizing 2.Remove stress concentrators.






7. For a metal - there is no ______ - only reflection






8. Ability to transmit a clear image - The image is clear.






9. Becomes harder (more strain) to stretch (elongate)






10. 1. Metals: Thermal energy puts many electrons into a higher energy state. 2. Energy States: Nearby energy states are accessible by thermal fluctuations.






11. Superconductors expel magnetic fields - This is why a superconductor will float above a magnet.






12. Because of ionic & covalent-type bonding.






13. There is always some statistical distribution of flaws or defects.






14. Materials change size when temperature is changed






15. Degree of opacity depends on size and number of particles - Opacity of metals is the result of conduction electrons absorbing photons in the visible range.






16. Is reflected - absorbed - scattered - and/or transmitted: Io=It+Ia+Ir+Is






17. Undergo little or no plastic deformation.






18. Allows you to calculate what happened G=F' x cos(lambda) - F=F' x cos(phi)






19. 1. Insulators: Higher energy states NOT ACCESSIBLE due to gap 2. Semiconductors: Higher energy states separated by a smaller gap.






20. Metals are good conductors since their _______is only partially filled.






21. Width of smallest feature obtainable on Si surface






22. Digitalized data in the form of electrical signals are transferred to and recorded digitally on a magnetic medium (tape or disk) - This transference is accomplished by a recording system that consists of a read/write head - "write" or record data by






23. 1. Diamagnetic (Xm ~ 10^-5) - small and negative magnetic susceptibilities 2. Paramagnetic (Xm ~ 10^-4) - small and positive magnetic susceptibilities 3. Ferromagnetic - large magnetic susceptibilities 4. Ferrimagnetic (Xm as large as 10^6) - large m






24. Failure under cyclic stress 1. It can cause part failure - even though (sigma)max < (sigma)c 2. Causes ~90% of mechanical engineering failures.






25. Ohms Law: voltage drop = current * resistance






26. Cracks pass through grains - often along specific crystal planes.






27. 1. Data for Pure Silicon - electrical conductivity increases with T - opposite to metals






28. - The emission of light from a substance due to the absorption of energy. (Could be radiation - mechanical - or chemical energy. Could also be energetic particles.) - Traps and activator levels are produced by impurity additions to the material - Whe






29. These materials are "attracted" to magnetic fields.






30. Diffuse image






31. If a material has ________ - then the field generated by those moments must be added to the induced field.






32. 1. Hard disk drives (granular/perpendicular media) 2. Recording tape (particulate media)






33. Specific heat = energy input/(mass*temperature change)






34. The ability of a material to be rapidly cooled and not fracture






35. - A magnetic field is induced in the material B= Magnetic Induction (tesla) inside the material mu= permeability of a solid






36. Defines the ability of a material to resist fracture even when a flaw exists - Directly depends on size of flaw and material properties - K(ic) is a materials constant






37. A measure of the ease with which a B field can be induced inside a material.






38. 1. Tc= critical temperature- if T>Tc not superconducting 2. Jc= critical current density - if J>Jc not superconducting 3. Hc= critical magnetic field - if H > Hc not superconducting






39. Process by which metal atoms diffuse because of a potential.






40. This strength parameter is similar in magnitude to a tensile strength. Fracture occurs along the outermost sample edge - which is under a tensile load.






41. These are liquid crystal polymers- not your normal "crystal" -Rigid - rod shaped molecules are aligned even in liquid form.

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42. Dimples on fracture surface correspond to microcavities that initiate crack formation.






43. Undergo extensive plastic deformation prior to failure.






44. A high index of refraction (n value) allows for multiple internal reactions.






45. Second phase particles with n > glass.






46. A parallel-plate capacitor involves an insulator - or dielectric - between two metal electrodes. The charge density buildup at the capacitor surface is related to the dielectric constant of the material.






47. To build a device - various thin metal or insulating films are grown on top of each other - Evaporation - MBE - Sputtering - CVD (ALD)






48. Plastic means permanent! When a small load is applied - bonds stretch & planes shear. Then when the load is no longer applied - the planes are still sheared.






49. Increase temperature - increase in interatomic separation - thermal expansion






50. Growing interconnections to connect devices -Low electrical resistance - good adhesion to dielectric insulators.