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Test your basic knowledge |
Engineering Materials
Start Test
Study First
Subject
:
engineering
Instructions:
Answer 50 questions in 15 minutes.
If you are not ready to take this test, you can
study here
.
Match each statement with the correct term.
Don't refresh. All questions and answers are randomly picked and ordered every time you load a test.
This is a study tool. The 3 wrong answers for each question are randomly chosen from answers to other questions. So, you might find at times the answers obvious, but you will see it re-enforces your understanding as you take the test each time.
1. - A magnetic field is induced in the material B= Magnetic Induction (tesla) inside the material mu= permeability of a solid
Impact energy
Generation of a Magnetic Field - Within a Solid Material
Heat Capacity
Shear and Tensile Stress
2. Rho=F/A - tau=G/A . Depending on what angle the force is applied - and what angle the crystal is at - it takes different amounts of force to induce plastic deformation.
Transparent
Engineering Fracture Performance
Stress Intensity values
Shear and Tensile Stress
3. Degree of opacity depends on size and number of particles - Opacity of metals is the result of conduction electrons absorbing photons in the visible range.
Brittle Materials
Valence band
Opacity
Intergranular Fracture
4. Specific heat = energy input/(mass*temperature change)
Refraction
Electromigration
Thermal Stresses
Specific Heat
5. The size of the material changes with a change in temperature - polymers have the largest values
The Transistor
Conduction & Electron Transport
Coefficient of Thermal Expansion
True Strain
6. Allows flow of electrons in one direction only (useful to convert alternating current to direct current) - Result: no net current flow
IC Devices: P-N Rectifying Junction
Rockwell
Specific Heat
Refraction
7. 1. Necking 2. Cavity formation 3. Cavity coalescence to form cracks 4. Crack propagation (growth) 5. Fracture
Magnetic Storage Media Types
Critical Properties of Superconductive Materials
Intergranular Fracture
Stages of Failure: Ductile Fracture
8. A high index of refraction (n value) allows for multiple internal reactions.
Metallization
Superconductivity
Sparkle of Diamonds
Response to a Magnetic Field
9. Dimples on fracture surface correspond to microcavities that initiate crack formation.
Incident Light
Impact energy
Modulus of Rupture (MOR)
Ductile Fracture
10. Diffuse image
To improve fatigue life
Meissner Effect
Translucent
Refraction
11. The Magnetization of the material - and is essentially the dipole moment per unit volume. It is proportional to the applied field. Xm is the magnetic susceptibility.
M is known as what?
Griffith Crack Model
Metals: Resistivity vs. T - Impurities
How an LCD works
12. 1. Ductility- % elongation - % reduction in area - may be of use in metal forming operations (e.g. - stretch forming). This is convenient for mechanical testing - but not very meaningful for most deformation processing. 2. Toughness- Area beneath str
Ductile Fracture
How to gage the extent of plastic deformation
Relative Permeability
Not severe
13. For a metal - there is no ______ - only reflection
Hard Magnetic Materials
Why materials fail in service
Generation of a Magnetic Field - Vacuum
Refraction
14. Is analogous to toughness.
Impact energy
Influence of Temperature on Magnetic Behavior
Diamagnetic Materials
Bending tests
15. 1. Yield = ratio of functional chips to total # of chips - Most yield loss during wafer processing - b/c of complex 2. Reliability - No device has infinite lifetime. Statistical methods to predict expected lifetime - Failure mechanisms: Diffusion reg
Yield and Reliability
Energy States: Insulators and Semiconductors
Impact - Toughness
Film Deposition
16. With Increasing temperature - the saturation magnetization diminishes gradually and then abruptly drops to zero at Curie Temperature - Tc.
Bending tests
Ductile-to-Brittle Transition
M is known as what?
Influence of Temperature on Magnetic Behavior
17. Loss of image transmission - You get no image - There is no light transmission - and therefore reflects - scatters - or absorbs ALL of it. Both mirrors and carbon black are opaque.
Pure Semiconductors: Conductivity vs. T
Metallization
Opaque
Critical Properties of Superconductive Materials
18. 1. General yielding occurs if flaw size a < a(critical) 2. Catastrophic fast fracture occurs if flaw size a > a(critical)
Engineering Fracture Performance
IC Devices: P-N Rectifying Junction
Ductile-to-Brittle Transition
Why materials fail in service
19. Failure under cyclic stress 1. It can cause part failure - even though (sigma)max < (sigma)c 2. Causes ~90% of mechanical engineering failures.
Diamagnetic Materials
Why do ceramics have larger bonding energy?
Electromigration
Fatigue
20. (sigma)=K(sigma)^n . K = strength coefficient - n = work hardening rate or strain hardening exponent. Large n value increases strength and hardness.
Holloman Equation
Griffith Crack Model
Fourier's Law
Plastic Deformation (Metals)
21. Cp: Heat capacity at constant pressure Cv: Heat capacity at constant volume.
HB (Brinell Hardness)
Magnetic Storage Media Types
Two ways to measure heat capacity
What do magnetic moments arise from?
22. # of thermally generated electrons = # of holes (broken bonds)
What do magnetic moments arise from?
Thermal Shock Resistance
Intrinsic Semiconductors
To improve fatigue life
23. High toughness; material resists crack propagation.
Force Decomposition
High impact energy
Stages of Failure: Ductile Fracture
Griffith Crack Model
24. No appreciable plastic deformation. The crack propagates very fast; nearly perpendicular to applied stress. Cracks often propagate along specific crystal planes or boundaries.
Why fracture surfaces have faceted texture
Lithography
Brittle Fracture
Etching
25. If a material has ________ - then the field generated by those moments must be added to the induced field.
Thermal Stresses
Yield and Reliability
Internal magnetic moments
Griffith Crack Model
26. Plastic means permanent! When a small load is applied - bonds stretch & planes shear. Then when the load is no longer applied - the planes are still sheared.
Oxidation
Plastic Deformation (Metals)
Specific Heat
Bending tests
27. Allows you to calculate what happened G=F' x cos(lambda) - F=F' x cos(phi)
Heat Capacity
Force Decomposition
Color
Paramagnetic Materials
28. Occurs at a single pore or other solid by refraction n = 1 for pore (air) n > 1 for the solid - n ~ 1.5 for glass - Scattering effect is maximized by pore/particle size within 400-700 nm range - Reason for Opacity in ceramics - glasses and polymers.
Heat Capacity from an Atomic Prospective
Ductile Materials
Scattering
Internal magnetic moments
29. Growing interconnections to connect devices -Low electrical resistance - good adhesion to dielectric insulators.
High impact energy
Metallization
Paramagnetic Materials
Soft Magnetic Materials
30. Occur due to: restrained thermal expansion/contraction -temperature gradients that lead to differential dimensional changes sigma = Thermal Stress
Two ways to measure heat capacity
Thermal Stresses
Refraction
Impact energy
31. Large coercivities - Used for permanent magnets - Add particles/voids to inhibit domain wall motion - Example: tungsten steel
Thermal Stresses
Generation of a Magnetic Field - Within a Solid Material
Fatigue
Hard Magnetic Materials
32. 1. Fluorescent Lamp - tungstate or silicate coating on inside of tube emits white light due to UV light generated inside the tube. 2. TV screen - emits light as electron beam is scanned back and forth.
How an LCD works
Luminescence examples
Incoherent
Conduction & Electron Transport
33. Another optical property - Depends on the wavelength of the visible spectrum.
Color
Elastic Deformation
Linewidth
Incident Light
34. Small Coercivities - Used for electric motors - Example: commercial iron 99.95 Fe
Opacity
Linewidth
Soft Magnetic Materials
Thermal Expansion: Symmetric curve
35. 1. Ability of the material to absorb energy prior to fracture 2. Short term dynamic stressing - Car collisions - Bullets - Athletic equipment 3. This is different than toughness; energy necessary to push a crack (flaw) through a material 4. Useful in
Intrinsic Semiconductors
Thermal expansion
Impact - Toughness
Brittle Fracture
36. Measures Hardness 1. psia = 500 x HB 2. MPa = 3.45 x HB
HB (Brinell Hardness)
Influence of Temperature on Magnetic Behavior
Iron-Silicon Alloy in Transformer Cores
Fourier's Law
37. Defines the ability of a material to resist fracture even when a flaw exists - Directly depends on size of flaw and material properties - K(ic) is a materials constant
Intergranular Fracture
Stress Intensity Factor
Translucent
Transgranular Fracture
38. (sigma)=F/Ai (rho)=(rho)'(1+(epsilon))
Magnetic Storage Media Types
Response to a Magnetic Field
Impact energy
True Stress
39. Occur when lots of dislocations move.
Why materials fail in service
Slip Bands
Pure Semiconductors: Conductivity vs. T
Paramagnetic Materials
40. 1. Hard disk drives (granular/perpendicular media) 2. Recording tape (particulate media)
Thermal Expansion: Symmetric curve
Opacifiers
Magnetic Storage Media Types
Pure Semiconductors: Conductivity vs. T
41. As the applied field (H) increases the magnetic domains change shape and size by movement of domain boundaries.
Metals: Resistivity vs. T - Impurities
Hardness
Incoherent
Domains in Ferromagnetic & Ferrimagnetic Materials
42. Is reflected - absorbed - scattered - and/or transmitted: Io=It+Ia+Ir+Is
Where does DBTT occur?
Oxidation
Incident Light
M is known as what?
43. Measures impact energy 1. Strike a notched sample with an anvil 2. Measure how far the anvil travels following impact 3. Distance traveled is related to energy required to break the sample 4. Very high rate of loading. Makes materials more "brittle."
Etching
Pure Semiconductors: Conductivity vs. T
Metals: Resistivity vs. T - Impurities
Charpy or Izod test
44. Increase temperature - increase in interatomic separation - thermal expansion
Translucent
Thermal Expansion: Asymmetric curve
To improve fatigue life
Force Decomposition
45. - Metals that exhibit high ductility - exhibit high toughness. Ceramics are very strong - but have low ductility and low toughness - Polymers are very ductile but are not generally very strong in shear (compared to metals and ceramics). They have low
Stress Intensity values
Paramagnetic Materials
The three modes of crack surface displacement
Luminescence
46. Sigma=ln(li/lo)
Intrinsic Semiconductors
True Strain
Intergranular Fracture
Magnetic Storage
47. - The emission of light from a substance due to the absorption of energy. (Could be radiation - mechanical - or chemical energy. Could also be energetic particles.) - Traps and activator levels are produced by impurity additions to the material - Whe
Charpy or Izod test
Luminescence
True Stress
Iron-Silicon Alloy in Transformer Cores
48. Becomes harder (more strain) to stretch (elongate)
To improve fatigue life
IC Devices: P-N Rectifying Junction
Impact - Toughness
Work Hardening
49. Transmitted light distorts electron clouds - The velocity of light in a material is lower than in a vacuum - Adding large ions to glass decreases the speed of light in the glass - Light can be "bent" (or refracted) as it passes through a transparent
Diamagnetic Materials
Refraction
Luminescence
Film Deposition
50. The ability of a material to transport heat - Atomic Perspective: Atomic vibrations and free electrons in hotter regions transport energy to cooler regions - Metals have the largest values
Heat Capacity from an Atomic Prospective
Thermal Conductivity
Coefficient of Thermal Expansion
Brittle Materials