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Test your basic knowledge |
Engineering Materials
Start Test
Study First
Subject
:
engineering
Instructions:
Answer 50 questions in 15 minutes.
If you are not ready to take this test, you can
study here
.
Match each statement with the correct term.
Don't refresh. All questions and answers are randomly picked and ordered every time you load a test.
This is a study tool. The 3 wrong answers for each question are randomly chosen from answers to other questions. So, you might find at times the answers obvious, but you will see it re-enforces your understanding as you take the test each time.
1. Allows you to calculate what happened G=F' x cos(lambda) - F=F' x cos(phi)
Refraction
How an LCD works
The Transistor
Force Decomposition
2. Sigma=ln(li/lo)
True Strain
Generation of a Magnetic Field - Vacuum
Stages of Failure: Ductile Fracture
Ductile-to-Brittle Transition
3. 1. Impose a compressive surface stress (to suppress surface cracks from growing) - Method 1: shot peening - Method 2: carburizing 2.Remove stress concentrators.
Film Deposition
To improve fatigue life
Thermal Stresses
Oxidation
4. Typical loading conditions are _____ enough to break all inter-atomic bonds
Transgranular Fracture
Extrinsic Semiconductors
Thermal Conductivity
Not severe
5. Transmitted light distorts electron clouds - The velocity of light in a material is lower than in a vacuum - Adding large ions to glass decreases the speed of light in the glass - Light can be "bent" (or refracted) as it passes through a transparent
Luminescence
Refraction
Thermal expansion
Coefficient of Thermal Expansion
6. Cracks propagate along grain boundaries.
Why fracture surfaces have faceted texture
Intergranular Fracture
Specific Heat
Iron-Silicon Alloy in Transformer Cores
7. Occur when lots of dislocations move.
Oxidation
Transgranular Fracture
Conduction & Electron Transport
Slip Bands
8. Increase temperature - increase in interatomic separation - thermal expansion
Electrical Conduction
Translucent
Thermal Expansion: Asymmetric curve
Luminescence
9. Measures Hardness 1. psia = 500 x HB 2. MPa = 3.45 x HB
Force Decomposition
Meissner Effect
Critical Properties of Superconductive Materials
HB (Brinell Hardness)
10. Second phase particles with n > glass.
Response to a Magnetic Field
Elastic Deformation
Opacifiers
Thermal Stresses
11. 1. Yield = ratio of functional chips to total # of chips - Most yield loss during wafer processing - b/c of complex 2. Reliability - No device has infinite lifetime. Statistical methods to predict expected lifetime - Failure mechanisms: Diffusion reg
Insulators
Ductile-to-Brittle Transition
Yield and Reliability
Critical Properties of Superconductive Materials
12. (sigma)=K(sigma)^n . K = strength coefficient - n = work hardening rate or strain hardening exponent. Large n value increases strength and hardness.
Holloman Equation
What do magnetic moments arise from?
Refraction
Specific Heat
13. Plastic means permanent! When a small load is applied - bonds stretch & planes shear. Then when the load is no longer applied - the planes are still sheared.
M is known as what?
Plastic Deformation (Metals)
The Transistor
Fourier's Law
14. Growing interconnections to connect devices -Low electrical resistance - good adhesion to dielectric insulators.
Why do ceramics have larger bonding energy?
Metallization
Critical Properties of Superconductive Materials
What do magnetic moments arise from?
15. Increase temperature - no increase in interatomic separation - no thermal expansion
Coefficient of Thermal Expansion
Thermal Expansion: Symmetric curve
Thermal Conductivity
Diamagnetic Materials
16. A measure of the ease with which a B field can be induced inside a material.
Relative Permeability
Hard Magnetic Materials
Opacifiers
Thermal expansion
17. Is reflected - absorbed - scattered - and/or transmitted: Io=It+Ia+Ir+Is
Incident Light
Conduction & Electron Transport
Heat Capacity
Why materials fail in service
18. 1. Insulators: Higher energy states NOT ACCESSIBLE due to gap 2. Semiconductors: Higher energy states separated by a smaller gap.
M is known as what?
Energy States: Insulators and Semiconductors
Lithography
Holloman Equation
19. 1. Ability of the material to absorb energy prior to fracture 2. Short term dynamic stressing - Car collisions - Bullets - Athletic equipment 3. This is different than toughness; energy necessary to push a crack (flaw) through a material 4. Useful in
Linewidth
Coherent
Impact - Toughness
Critical Properties of Superconductive Materials
20. They are used to assess properties of ceramics & glasses.
Insulators
Bending tests
Diamagnetic Materials
Brittle Materials
21. Defines the ability of a material to resist fracture even when a flaw exists - Directly depends on size of flaw and material properties - K(ic) is a materials constant
Linewidth
Reflectance of Non-Metals
Meissner Effect
Stress Intensity Factor
22. Heat capacity.....- increases with temperature -for solids it reaches a limiting value of 3R
Ductile Materials
Dependence of Heat Capacity on Temperature
Domains in Ferromagnetic & Ferrimagnetic Materials
Two ways to measure heat capacity
23. - Metals that exhibit high ductility - exhibit high toughness. Ceramics are very strong - but have low ductility and low toughness - Polymers are very ductile but are not generally very strong in shear (compared to metals and ceramics). They have low
Scattering
Griffith Crack Model
How an LCD works
Stress Intensity values
24. The size of the material changes with a change in temperature - polymers have the largest values
Critical Properties of Superconductive Materials
Color
Fourier's Law
Coefficient of Thermal Expansion
25. 1. Fluorescent Lamp - tungstate or silicate coating on inside of tube emits white light due to UV light generated inside the tube. 2. TV screen - emits light as electron beam is scanned back and forth.
Luminescence examples
True Strain
4 Types of Magnetism
Hard Magnetic Materials
26. Reflectiviy is between 0.90 and 0.95 - Metal surfaces appear shiny - Most of absorbed light is reflected at the same wavelength (NO REFRACTION) - Small fraction of light may be absorbed - Color of reflected light depends on wavelength distribution of
Reflection of Light for Metals
Intergranular Fracture
Linewidth
Paramagnetic Materials
27. Liquid polymer at room T - sandwiched between two sheets of glass - coated with transparent - electrically conductive film. - Character forming letters/ numbers etched on the face - Voltage applied disrupts the orientation of the rod- shaped molecule
Specific Heat
Transgranular Fracture
LASER
How an LCD works
28. These materials are relatively unaffected by magnetic fields.
Liquid Crystal Displays (LCD's)
Diamagnetic Materials
HB (Brinell Hardness)
Ductile Materials
29. Cp: Heat capacity at constant pressure Cv: Heat capacity at constant volume.
Brittle Ceramics
Two ways to measure heat capacity
How to gage the extent of plastic deformation
Meissner Effect
30. # of thermally generated electrons = # of holes (broken bonds)
Influence of Temperature on Magnetic Behavior
Fatigue
Refraction
Intrinsic Semiconductors
31. 1. Tc= critical temperature- if T>Tc not superconducting 2. Jc= critical current density - if J>Jc not superconducting 3. Hc= critical magnetic field - if H > Hc not superconducting
Critical Properties of Superconductive Materials
Slip Bands
Impact energy
Soft Magnetic Materials
32. Growth of an oxide layer by the reaction of oxygen with the substrate - Provides dopant masking and device isolation - IC technology uses 1. Thermal grown oxidation (dry) 2. Wet Oxidation 3. Selective Oxidation
Translucent
Oxidation
Why materials fail in service
Specific Heat
33. This strength parameter is similar in magnitude to a tensile strength. Fracture occurs along the outermost sample edge - which is under a tensile load.
Why materials fail in service
Modulus of Rupture (MOR)
There is no perfect material?
M is known as what?
34. The ability of a material to absorb heat - Quantitatively: The energy required to produce a unit rise in temperature for one mole of a material.
Relative Permeability
Heat Capacity
Intrinsic Semiconductors
Color
35. The magnetic hysteresis phenomenon: Stage 1: Initial (unmagnetized state) Stage 2: Apply H - align domains Stage 3: Remove H - alignment remains => Permanent magnet Stage 4: Coercivity - Hc negative H needed to demagnitize Stage 5: Apply -H - align d
Hysteresis and Permanent Magnetization
Transgranular Fracture
LASER
Incident Light
36. Undergo extensive plastic deformation prior to failure.
Modulus of Rupture (MOR)
Generation of a Magnetic Field - Within a Solid Material
Ductile Materials
Stages of Failure: Ductile Fracture
37. Becomes harder (more strain) to stretch (elongate)
High impact energy
Work Hardening
Two ways to measure heat capacity
Luminescence examples
38. Emitted light is in phase
Coherent
Brittle Fracture
Why do ceramics have larger bonding energy?
Incident Light
39. 1. Electron motions 2. The spins on electrons - Net atomic magnetic moment: sum of moments from all electrons.
To improve fatigue life
Why materials fail in service
Ductile Materials
What do magnetic moments arise from?
40. Cracks pass through grains - often along specific crystal planes.
Fourier's Law
Paramagnetic Materials
Shear and Tensile Stress
Transgranular Fracture
41. There is always some statistical distribution of flaws or defects.
Griffith Crack Model
There is no perfect material?
Engineering Fracture Performance
The Transistor
42. Hardness is the resistance of a material to deformation by indentation - Useful in quality control - Hardness can provide a qualitative assessment of strength - Hardness cannot be used to quantitatively infer strength or ductility.
The Transistor
Hardness
Opacity
Modulus of Rupture (MOR)
43. As the applied field (H) increases the magnetic domains change shape and size by movement of domain boundaries.
Refraction
Domains in Ferromagnetic & Ferrimagnetic Materials
Incoherent
Valence band
44. No appreciable plastic deformation. The crack propagates very fast; nearly perpendicular to applied stress. Cracks often propagate along specific crystal planes or boundaries.
Stress Intensity values
Dependence of Heat Capacity on Temperature
Brittle Fracture
Hysteresis and Permanent Magnetization
45. Specific heat = energy input/(mass*temperature change)
Paramagnetic Materials
Relative Permeability
Specific Heat
Heat Capacity
46. A parallel-plate capacitor involves an insulator - or dielectric - between two metal electrodes. The charge density buildup at the capacitor surface is related to the dielectric constant of the material.
Where does DBTT occur?
Insulators
Thermal Expansion: Symmetric curve
Relative Permeability
47. Ability to transmit a clear image - The image is clear.
What do magnetic moments arise from?
Thermal Conductivity
Transparent
Impact - Toughness
48. Specular: light reflecting off a mirror (average) - Diffuse: light reflecting off a white wall (local)
Magnetic Storage Media Types
To improve fatigue life
What do magnetic moments arise from?
Two kinds of Reflection
49. ...occurs in bcc metals but not in fcc metals.
Electromigration
Linewidth
Where does DBTT occur?
Engineering Fracture Performance
50. Because of ionic & covalent-type bonding.
Why do ceramics have larger bonding energy?
Response to a Magnetic Field
Transgranular Fracture
M is known as what?
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