SUBJECTS
|
BROWSE
|
CAREER CENTER
|
POPULAR
|
JOIN
|
LOGIN
Business Skills
|
Soft Skills
|
Basic Literacy
|
Certifications
About
|
Help
|
Privacy
|
Terms
|
Email
Search
Test your basic knowledge |
Engineering Materials
Start Test
Study First
Subject
:
engineering
Instructions:
Answer 50 questions in 15 minutes.
If you are not ready to take this test, you can
study here
.
Match each statement with the correct term.
Don't refresh. All questions and answers are randomly picked and ordered every time you load a test.
This is a study tool. The 3 wrong answers for each question are randomly chosen from answers to other questions. So, you might find at times the answers obvious, but you will see it re-enforces your understanding as you take the test each time.
1. Dimples on fracture surface correspond to microcavities that initiate crack formation.
Ductile Fracture
Thermal Expansion: Symmetric curve
Reflectance of Non-Metals
Reflection of Light for Metals
2. 1. Ductility- % elongation - % reduction in area - may be of use in metal forming operations (e.g. - stretch forming). This is convenient for mechanical testing - but not very meaningful for most deformation processing. 2. Toughness- Area beneath str
How an LCD works
Fourier's Law
Bending tests
How to gage the extent of plastic deformation
3. Undergo little or no plastic deformation.
Brittle Materials
The three modes of crack surface displacement
Impact energy
Metallization
4. Emitted light is in phase
Coherent
Metals: Resistivity vs. T - Impurities
Hysteresis and Permanent Magnetization
Large Hardness
5. Without passing a current a continually varying magnetic field will cause a current to flow
Response to a Magnetic Field
M is known as what?
Hard Magnetic Materials
4 Types of Magnetism
6. 1. Hard disk drives (granular/perpendicular media) 2. Recording tape (particulate media)
Magnetic Storage Media Types
Impact - Toughness
Yield and Reliability
Bending tests
7. With Increasing temperature - the saturation magnetization diminishes gradually and then abruptly drops to zero at Curie Temperature - Tc.
What do magnetic moments arise from?
Thermal Conductivity
Electrical Conduction
Influence of Temperature on Magnetic Behavior
8. Another optical property - Depends on the wavelength of the visible spectrum.
Brittle Fracture
Where does DBTT occur?
Color
4 Types of Magnetism
9. Transformer cores require soft magnetic materials - which are easily magnetized and de-magnetized - and have high electrical resistivity - Energy losses in transformers could be minimized if their cores were fabricated such that the easy magnetizatio
There is no perfect material?
Domains in Ferromagnetic & Ferrimagnetic Materials
Brittle Materials
Iron-Silicon Alloy in Transformer Cores
10. Metals are good conductors since their _______is only partially filled.
Valence band
Sparkle of Diamonds
How an LCD works
Energy States: Insulators and Semiconductors
11. Rho=F/A - tau=G/A . Depending on what angle the force is applied - and what angle the crystal is at - it takes different amounts of force to induce plastic deformation.
Shear and Tensile Stress
Transparent
Response to a Magnetic Field
Stages of Failure: Ductile Fracture
12. Second phase particles with n > glass.
Intrinsic Semiconductors
Opacifiers
Thermal expansion
Two kinds of Reflection
13. Is reflected - absorbed - scattered - and/or transmitted: Io=It+Ia+Ir+Is
Reflection of Light for Metals
Valence band
Magnetic Storage Media Types
Incident Light
14. Measures impact energy 1. Strike a notched sample with an anvil 2. Measure how far the anvil travels following impact 3. Distance traveled is related to energy required to break the sample 4. Very high rate of loading. Makes materials more "brittle."
Insulators
Ductile-to-Brittle Transition
What do magnetic moments arise from?
Charpy or Izod test
15. 1. Tensile (opening) 2. Sliding 3. Tearing
Energy States: Insulators and Semiconductors
The three modes of crack surface displacement
Impact - Toughness
Magnetic Storage Media Types
16. Measures Hardness 1. psia = 500 x HB 2. MPa = 3.45 x HB
HB (Brinell Hardness)
Hard Magnetic Materials
Modulus of Rupture (MOR)
Refraction
17. Flaws and Defects - They concentrate stress locally to levels high enough to rupture bonds.
Hard Magnetic Materials
Where does DBTT occur?
LASER
Why materials fail in service
18. Cp: Heat capacity at constant pressure Cv: Heat capacity at constant volume.
Luminescence examples
Force Decomposition
Paramagnetic Materials
Two ways to measure heat capacity
19. Transmitted light distorts electron clouds - The velocity of light in a material is lower than in a vacuum - Adding large ions to glass decreases the speed of light in the glass - Light can be "bent" (or refracted) as it passes through a transparent
What do magnetic moments arise from?
Incoherent
Thermal Expansion: Symmetric curve
Refraction
20. 1. Tc= critical temperature- if T>Tc not superconducting 2. Jc= critical current density - if J>Jc not superconducting 3. Hc= critical magnetic field - if H > Hc not superconducting
Linewidth
Transgranular Fracture
Critical Properties of Superconductive Materials
Transparent
21. Process by which geometric patterns are transferred from a mask (reticle) to a surface of a chip to form the device.
Rockwell
Lithography
Magnetic Storage Media Types
Thermal Expansion: Asymmetric curve
22. Allows flow of electrons in one direction only (useful to convert alternating current to direct current) - Result: no net current flow
Griffith Crack Model
Opaque
IC Devices: P-N Rectifying Junction
Meissner Effect
23. Defines the ability of a material to resist fracture even when a flaw exists - Directly depends on size of flaw and material properties - K(ic) is a materials constant
Opacifiers
Thermal expansion
Stress Intensity Factor
Heat Capacity
24. The ability of a material to absorb heat - Quantitatively: The energy required to produce a unit rise in temperature for one mole of a material.
Lithography
Why materials fail in service
Heat Capacity
Metallization
25. These materials are "attracted" to magnetic fields.
Thermal expansion
Metals: Resistivity vs. T - Impurities
Paramagnetic Materials
Intergranular Fracture
26. These materials are relatively unaffected by magnetic fields.
Diamagnetic Materials
Hard Magnetic Materials
Electromigration
Brittle Fracture
27. Cracks pass through grains - often along specific crystal planes.
Insulators
Transgranular Fracture
Metallization
4 Types of Magnetism
28. Digitalized data in the form of electrical signals are transferred to and recorded digitally on a magnetic medium (tape or disk) - This transference is accomplished by a recording system that consists of a read/write head - "write" or record data by
Heat Capacity
Magnetic Storage
Refraction
Transparent
29. Impurities added to the semiconductor that contribute to excess electrons or holes. Doping = intentional impurities.
Stress Intensity Factor
Extrinsic Semiconductors
Rockwell
How to gage the extent of plastic deformation
30. They are used to assess properties of ceramics & glasses.
Meissner Effect
Bending tests
Slip Bands
IC Devices: P-N Rectifying Junction
31. Degree of opacity depends on size and number of particles - Opacity of metals is the result of conduction electrons absorbing photons in the visible range.
Thermal Expansion: Symmetric curve
Generation of a Magnetic Field - Vacuum
Modulus of Rupture (MOR)
Opacity
32. - Metals that exhibit high ductility - exhibit high toughness. Ceramics are very strong - but have low ductility and low toughness - Polymers are very ductile but are not generally very strong in shear (compared to metals and ceramics). They have low
Coefficient of Thermal Expansion
Ductile-to-Brittle Transition
Stress Intensity values
Incoherent
33. A three terminal device that acts like a simple "on-off" switch. (the basis of Integrated Circuits (IC) technology - used in computers - cell phones - automotive control - etc) - If voltage (potential) applied to the "gate" - current flows between th
Soft Magnetic Materials
Refraction
Intrinsic Semiconductors
The Transistor
34. 1. Ability of the material to absorb energy prior to fracture 2. Short term dynamic stressing - Car collisions - Bullets - Athletic equipment 3. This is different than toughness; energy necessary to push a crack (flaw) through a material 4. Useful in
Stress Intensity values
Opaque
Holloman Equation
Impact - Toughness
35. Different orientation of cleavage planes in grains.
Why fracture surfaces have faceted texture
Two kinds of Reflection
Critical Properties of Superconductive Materials
Griffith Crack Model
36. The size of the material changes with a change in temperature - polymers have the largest values
4 Types of Magnetism
Coefficient of Thermal Expansion
Metallization
Thermal Expansion: Asymmetric curve
37. Specific heat = energy input/(mass*temperature change)
Specific Heat
Relative Permeability
There is no perfect material?
Why materials fail in service
38. Typical loading conditions are _____ enough to break all inter-atomic bonds
Translucent
Not severe
Opaque
True Stress
39. A parallel-plate capacitor involves an insulator - or dielectric - between two metal electrodes. The charge density buildup at the capacitor surface is related to the dielectric constant of the material.
IC Devices: P-N Rectifying Junction
Elastic Deformation
Insulators
Etching
40. To build a device - various thin metal or insulating films are grown on top of each other - Evaporation - MBE - Sputtering - CVD (ALD)
Reflectance of Non-Metals
Lithography
Film Deposition
Electromigration
41. Ability to transmit a clear image - The image is clear.
Heat Capacity
Electrical Conduction
Ductile Fracture
Transparent
42. 1. Imperfections increase resistivity - grain boundaries - dislocations - impurity atoms - vacancies 2. Resistivity - increases with temperature - wt% impurity - and %CW
Shear and Tensile Stress
Opaque
Metals: Resistivity vs. T - Impurities
Oxidation
43. Liquid polymer at room T - sandwiched between two sheets of glass - coated with transparent - electrically conductive film. - Character forming letters/ numbers etched on the face - Voltage applied disrupts the orientation of the rod- shaped molecule
Scattering
Fourier's Law
How an LCD works
Film Deposition
44. # of thermally generated electrons = # of holes (broken bonds)
Stress Intensity values
Why materials fail in service
Force Decomposition
Intrinsic Semiconductors
45. 1. General yielding occurs if flaw size a < a(critical) 2. Catastrophic fast fracture occurs if flaw size a > a(critical)
HB (Brinell Hardness)
Thermal Shock Resistance
Engineering Fracture Performance
Reflectance of Non-Metals
46. The ability of a material to transport heat - Atomic Perspective: Atomic vibrations and free electrons in hotter regions transport energy to cooler regions - Metals have the largest values
Thermal Expansion: Symmetric curve
Thermal Conductivity
Stress Intensity values
Where does DBTT occur?
47. heat flux = -(thermal conductivity)(temperature gradient) - Defines heat transfer by CONDUCTION
Warning
: Invalid argument supplied for foreach() in
/var/www/html/basicversity.com/show_quiz.php
on line
183
48. 1. Insulators: Higher energy states NOT ACCESSIBLE due to gap 2. Semiconductors: Higher energy states separated by a smaller gap.
Energy States: Insulators and Semiconductors
Generation of a Magnetic Field - Within a Solid Material
True Strain
Incident Light
49. Wet: isotropic - under cut Dry: ansiotropic - directional
Not severe
LASER
Coherent
Etching
50. Growing interconnections to connect devices -Low electrical resistance - good adhesion to dielectric insulators.
Coherent
Brittle Fracture
Metallization
Hard Magnetic Materials