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Engineering Materials

Subject : engineering
Instructions:
  • Answer 50 questions in 15 minutes.
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  • Match each statement with the correct term.
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This is a study tool. The 3 wrong answers for each question are randomly chosen from answers to other questions. So, you might find at times the answers obvious, but you will see it re-enforces your understanding as you take the test each time.
1. -> fluorescent light - electron transitions occur randomly - light waves are out of phase with each other.






2. Materials change size when temperature is changed






3. Hardness is the resistance of a material to deformation by indentation - Useful in quality control - Hardness can provide a qualitative assessment of strength - Hardness cannot be used to quantitatively infer strength or ductility.






4. 1. Necking 2. Cavity formation 3. Cavity coalescence to form cracks 4. Crack propagation (growth) 5. Fracture






5. Another optical property - Depends on the wavelength of the visible spectrum.






6. (sigma)=F/Ai (rho)=(rho)'(1+(epsilon))






7. Dimples on fracture surface correspond to microcavities that initiate crack formation.






8. Occurs at a single pore or other solid by refraction n = 1 for pore (air) n > 1 for the solid - n ~ 1.5 for glass - Scattering effect is maximized by pore/particle size within 400-700 nm range - Reason for Opacity in ceramics - glasses and polymers.






9. Growing interconnections to connect devices -Low electrical resistance - good adhesion to dielectric insulators.






10. Measures Hardness - No major sample damage - Each scales runs to 130 but only useful in range 20-100 - Minor load is 10 kg - Major load: 60 kg (diamond) - 100 kg (1/16 in. ball) - 150 kg (diamond)






11. Loss of image transmission - You get no image - There is no light transmission - and therefore reflects - scatters - or absorbs ALL of it. Both mirrors and carbon black are opaque.






12. Specular: light reflecting off a mirror (average) - Diffuse: light reflecting off a white wall (local)






13. 1. Insulators: Higher energy states NOT ACCESSIBLE due to gap 2. Semiconductors: Higher energy states separated by a smaller gap.






14. Not ALL the light is refracted - SOME is reflected. Materials with a high index of refraction also have high reflectance - High R is bad for lens applications - since this leads to undesirable light losses or interference.






15. Different orientation of cleavage planes in grains.






16. Specific heat = energy input/(mass*temperature change)






17. Second phase particles with n > glass.






18. Allows you to calculate what happened G=F' x cos(lambda) - F=F' x cos(phi)






19. Diffuse image






20. 1. Data for Pure Silicon - electrical conductivity increases with T - opposite to metals






21. Small Coercivities - Used for electric motors - Example: commercial iron 99.95 Fe






22. They are used to assess properties of ceramics & glasses.






23. Typical loading conditions are _____ enough to break all inter-atomic bonds






24. Undergo little or no plastic deformation.






25. The ability of a material to transport heat - Atomic Perspective: Atomic vibrations and free electrons in hotter regions transport energy to cooler regions - Metals have the largest values






26. Because of ionic & covalent-type bonding.






27. 1. Metals: Thermal energy puts many electrons into a higher energy state. 2. Energy States: Nearby energy states are accessible by thermal fluctuations.






28. The ability of a material to absorb heat - Quantitatively: The energy required to produce a unit rise in temperature for one mole of a material.






29. A three terminal device that acts like a simple "on-off" switch. (the basis of Integrated Circuits (IC) technology - used in computers - cell phones - automotive control - etc) - If voltage (potential) applied to the "gate" - current flows between th






30. 1. Diamagnetic (Xm ~ 10^-5) - small and negative magnetic susceptibilities 2. Paramagnetic (Xm ~ 10^-4) - small and positive magnetic susceptibilities 3. Ferromagnetic - large magnetic susceptibilities 4. Ferrimagnetic (Xm as large as 10^6) - large m






31. A measure of the ease with which a B field can be induced inside a material.






32. 1. Yield = ratio of functional chips to total # of chips - Most yield loss during wafer processing - b/c of complex 2. Reliability - No device has infinite lifetime. Statistical methods to predict expected lifetime - Failure mechanisms: Diffusion reg






33. Is analogous to toughness.






34. No appreciable plastic deformation. The crack propagates very fast; nearly perpendicular to applied stress. Cracks often propagate along specific crystal planes or boundaries.






35. Emitted light is in phase






36. Becomes harder (more strain) to stretch (elongate)






37. Process by which geometric patterns are transferred from a mask (reticle) to a surface of a chip to form the device.






38. 1. Ductility- % elongation - % reduction in area - may be of use in metal forming operations (e.g. - stretch forming). This is convenient for mechanical testing - but not very meaningful for most deformation processing. 2. Toughness- Area beneath str






39. - A magnetic field is induced in the material B= Magnetic Induction (tesla) inside the material mu= permeability of a solid






40. Heat capacity.....- increases with temperature -for solids it reaches a limiting value of 3R






41. Dramatic change in impact energy is associated with a change in fracture mode from brittle to ductile.






42. Is reflected - absorbed - scattered - and/or transmitted: Io=It+Ia+Ir+Is






43. 1. Hard disk drives (granular/perpendicular media) 2. Recording tape (particulate media)






44. Metals are good conductors since their _______is only partially filled.






45. There is always some statistical distribution of flaws or defects.






46. Energy is stored as atomic vibrations - As temperature increases - the average energy of atomic vibrations increases.






47. Elastic means reversible! This is not a permanent deformation.






48. Cracks pass through grains - often along specific crystal planes.






49. The Magnetization of the material - and is essentially the dipole moment per unit volume. It is proportional to the applied field. Xm is the magnetic susceptibility.






50. These materials are "attracted" to magnetic fields.







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