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Engineering Materials

Subject : engineering
Instructions:
  • Answer 50 questions in 15 minutes.
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  • Match each statement with the correct term.
  • Don't refresh. All questions and answers are randomly picked and ordered every time you load a test.

This is a study tool. The 3 wrong answers for each question are randomly chosen from answers to other questions. So, you might find at times the answers obvious, but you will see it re-enforces your understanding as you take the test each time.
1. The size of the material changes with a change in temperature - polymers have the largest values






2. # of thermally generated electrons = # of holes (broken bonds)






3. Growth of an oxide layer by the reaction of oxygen with the substrate - Provides dopant masking and device isolation - IC technology uses 1. Thermal grown oxidation (dry) 2. Wet Oxidation 3. Selective Oxidation






4. The ability of a material to absorb heat - Quantitatively: The energy required to produce a unit rise in temperature for one mole of a material.






5. Ohms Law: voltage drop = current * resistance






6. 1. Stress-strain behavior is not usually determined via tensile tests 2. Material fails before it yields 3. Bend/flexure tests are often used instead.






7. To build a device - various thin metal or insulating films are grown on top of each other - Evaporation - MBE - Sputtering - CVD (ALD)






8. Transmitted light distorts electron clouds - The velocity of light in a material is lower than in a vacuum - Adding large ions to glass decreases the speed of light in the glass - Light can be "bent" (or refracted) as it passes through a transparent






9. Heat capacity.....- increases with temperature -for solids it reaches a limiting value of 3R






10. Resistance to plastic deformation of cracking in compression - and better wear properties.






11. Measures Hardness - No major sample damage - Each scales runs to 130 but only useful in range 20-100 - Minor load is 10 kg - Major load: 60 kg (diamond) - 100 kg (1/16 in. ball) - 150 kg (diamond)






12. (sigma)=K(sigma)^n . K = strength coefficient - n = work hardening rate or strain hardening exponent. Large n value increases strength and hardness.






13. The ability of a material to transport heat - Atomic Perspective: Atomic vibrations and free electrons in hotter regions transport energy to cooler regions - Metals have the largest values






14. Degree of opacity depends on size and number of particles - Opacity of metals is the result of conduction electrons absorbing photons in the visible range.






15. heat flux = -(thermal conductivity)(temperature gradient) - Defines heat transfer by CONDUCTION

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16. Specific heat = energy input/(mass*temperature change)






17. They are used to assess properties of ceramics & glasses.






18. Transformer cores require soft magnetic materials - which are easily magnetized and de-magnetized - and have high electrical resistivity - Energy losses in transformers could be minimized if their cores were fabricated such that the easy magnetizatio






19. Diffuse image






20. These materials are relatively unaffected by magnetic fields.






21. Measures Hardness 1. psia = 500 x HB 2. MPa = 3.45 x HB






22. Second phase particles with n > glass.






23. Another optical property - Depends on the wavelength of the visible spectrum.






24. -> fluorescent light - electron transitions occur randomly - light waves are out of phase with each other.






25. The Magnetization of the material - and is essentially the dipole moment per unit volume. It is proportional to the applied field. Xm is the magnetic susceptibility.






26. 1. Metals: Thermal energy puts many electrons into a higher energy state. 2. Energy States: Nearby energy states are accessible by thermal fluctuations.






27. Width of smallest feature obtainable on Si surface






28. Process by which geometric patterns are transferred from a mask (reticle) to a surface of a chip to form the device.






29. Metals are good conductors since their _______is only partially filled.






30. 1. Electron motions 2. The spins on electrons - Net atomic magnetic moment: sum of moments from all electrons.






31. Digitalized data in the form of electrical signals are transferred to and recorded digitally on a magnetic medium (tape or disk) - This transference is accomplished by a recording system that consists of a read/write head - "write" or record data by






32. A three terminal device that acts like a simple "on-off" switch. (the basis of Integrated Circuits (IC) technology - used in computers - cell phones - automotive control - etc) - If voltage (potential) applied to the "gate" - current flows between th






33. Small Coercivities - Used for electric motors - Example: commercial iron 99.95 Fe






34. Is analogous to toughness.






35. Flaws and Defects - They concentrate stress locally to levels high enough to rupture bonds.






36. Measures impact energy 1. Strike a notched sample with an anvil 2. Measure how far the anvil travels following impact 3. Distance traveled is related to energy required to break the sample 4. Very high rate of loading. Makes materials more "brittle."






37. With Increasing temperature - the saturation magnetization diminishes gradually and then abruptly drops to zero at Curie Temperature - Tc.






38. Occurs at a single pore or other solid by refraction n = 1 for pore (air) n > 1 for the solid - n ~ 1.5 for glass - Scattering effect is maximized by pore/particle size within 400-700 nm range - Reason for Opacity in ceramics - glasses and polymers.






39. A parallel-plate capacitor involves an insulator - or dielectric - between two metal electrodes. The charge density buildup at the capacitor surface is related to the dielectric constant of the material.






40. Different orientation of cleavage planes in grains.






41. Becomes harder (more strain) to stretch (elongate)






42. 1. Ductility- % elongation - % reduction in area - may be of use in metal forming operations (e.g. - stretch forming). This is convenient for mechanical testing - but not very meaningful for most deformation processing. 2. Toughness- Area beneath str






43. These are liquid crystal polymers- not your normal "crystal" -Rigid - rod shaped molecules are aligned even in liquid form.

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44. Defines the ability of a material to resist fracture even when a flaw exists - Directly depends on size of flaw and material properties - K(ic) is a materials constant






45. Sigma=ln(li/lo)






46. 1. Insulators: Higher energy states NOT ACCESSIBLE due to gap 2. Semiconductors: Higher energy states separated by a smaller gap.






47. Emitted light is in phase






48. 1. Tensile (opening) 2. Sliding 3. Tearing






49. There is always some statistical distribution of flaws or defects.






50. For a metal - there is no ______ - only reflection







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