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Engineering Materials

Subject : engineering
Instructions:
  • Answer 50 questions in 15 minutes.
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  • Match each statement with the correct term.
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This is a study tool. The 3 wrong answers for each question are randomly chosen from answers to other questions. So, you might find at times the answers obvious, but you will see it re-enforces your understanding as you take the test each time.
1. (sigma)=F/Ai (rho)=(rho)'(1+(epsilon))






2. Impurities added to the semiconductor that contribute to excess electrons or holes. Doping = intentional impurities.






3. (sigma)=K(sigma)^n . K = strength coefficient - n = work hardening rate or strain hardening exponent. Large n value increases strength and hardness.






4. Process by which metal atoms diffuse because of a potential.






5. A high index of refraction (n value) allows for multiple internal reactions.






6. Degree of opacity depends on size and number of particles - Opacity of metals is the result of conduction electrons absorbing photons in the visible range.






7. 1. Impose a compressive surface stress (to suppress surface cracks from growing) - Method 1: shot peening - Method 2: carburizing 2.Remove stress concentrators.






8. Second phase particles with n > glass.






9. Process by which geometric patterns are transferred from a mask (reticle) to a surface of a chip to form the device.






10. Undergo extensive plastic deformation prior to failure.






11. The Magnetization of the material - and is essentially the dipole moment per unit volume. It is proportional to the applied field. Xm is the magnetic susceptibility.






12. A parallel-plate capacitor involves an insulator - or dielectric - between two metal electrodes. The charge density buildup at the capacitor surface is related to the dielectric constant of the material.






13. Liquid polymer at room T - sandwiched between two sheets of glass - coated with transparent - electrically conductive film. - Character forming letters/ numbers etched on the face - Voltage applied disrupts the orientation of the rod- shaped molecule






14. Another optical property - Depends on the wavelength of the visible spectrum.






15. Created by current through a coil N= total number of turns L= length of turns (m) I= current (ampere) H= applied magnetic field (ampere-turns/m) Bo= magnetic flux density in a vacuum (tesla)






16. Plastic means permanent! When a small load is applied - bonds stretch & planes shear. Then when the load is no longer applied - the planes are still sheared.






17. heat flux = -(thermal conductivity)(temperature gradient) - Defines heat transfer by CONDUCTION

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18. Wet: isotropic - under cut Dry: ansiotropic - directional






19. Cracks pass through grains - often along specific crystal planes.






20. Dimples on fracture surface correspond to microcavities that initiate crack formation.






21. Failure under cyclic stress 1. It can cause part failure - even though (sigma)max < (sigma)c 2. Causes ~90% of mechanical engineering failures.






22. 1. Data for Pure Silicon - electrical conductivity increases with T - opposite to metals






23. Hardness is the resistance of a material to deformation by indentation - Useful in quality control - Hardness can provide a qualitative assessment of strength - Hardness cannot be used to quantitatively infer strength or ductility.






24. Resistance to plastic deformation of cracking in compression - and better wear properties.






25. 1. Tc= critical temperature- if T>Tc not superconducting 2. Jc= critical current density - if J>Jc not superconducting 3. Hc= critical magnetic field - if H > Hc not superconducting






26. Different orientation of cleavage planes in grains.






27. Measures Hardness 1. psia = 500 x HB 2. MPa = 3.45 x HB






28. Increase temperature - increase in interatomic separation - thermal expansion






29. 1. Insulators: Higher energy states NOT ACCESSIBLE due to gap 2. Semiconductors: Higher energy states separated by a smaller gap.






30. Growing interconnections to connect devices -Low electrical resistance - good adhesion to dielectric insulators.






31. - Metals that exhibit high ductility - exhibit high toughness. Ceramics are very strong - but have low ductility and low toughness - Polymers are very ductile but are not generally very strong in shear (compared to metals and ceramics). They have low






32. To build a device - various thin metal or insulating films are grown on top of each other - Evaporation - MBE - Sputtering - CVD (ALD)






33. Flaws and Defects - They concentrate stress locally to levels high enough to rupture bonds.






34. Allows you to calculate what happened G=F' x cos(lambda) - F=F' x cos(phi)






35. Growth of an oxide layer by the reaction of oxygen with the substrate - Provides dopant masking and device isolation - IC technology uses 1. Thermal grown oxidation (dry) 2. Wet Oxidation 3. Selective Oxidation






36. These are liquid crystal polymers- not your normal "crystal" -Rigid - rod shaped molecules are aligned even in liquid form.

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37. Measures Hardness - No major sample damage - Each scales runs to 130 but only useful in range 20-100 - Minor load is 10 kg - Major load: 60 kg (diamond) - 100 kg (1/16 in. ball) - 150 kg (diamond)






38. Occur when lots of dislocations move.






39. Specific heat = energy input/(mass*temperature change)






40. The size of the material changes with a change in temperature - polymers have the largest values






41. Is reflected - absorbed - scattered - and/or transmitted: Io=It+Ia+Ir+Is






42. - The emission of light from a substance due to the absorption of energy. (Could be radiation - mechanical - or chemical energy. Could also be energetic particles.) - Traps and activator levels are produced by impurity additions to the material - Whe






43. 1. Yield = ratio of functional chips to total # of chips - Most yield loss during wafer processing - b/c of complex 2. Reliability - No device has infinite lifetime. Statistical methods to predict expected lifetime - Failure mechanisms: Diffusion reg






44. Cp: Heat capacity at constant pressure Cv: Heat capacity at constant volume.






45. -> fluorescent light - electron transitions occur randomly - light waves are out of phase with each other.






46. Diffuse image






47. 1. Necking 2. Cavity formation 3. Cavity coalescence to form cracks 4. Crack propagation (growth) 5. Fracture






48. Reflectiviy is between 0.90 and 0.95 - Metal surfaces appear shiny - Most of absorbed light is reflected at the same wavelength (NO REFRACTION) - Small fraction of light may be absorbed - Color of reflected light depends on wavelength distribution of






49. - A magnetic field is induced in the material B= Magnetic Induction (tesla) inside the material mu= permeability of a solid






50. Ability to transmit a clear image - The image is clear.







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