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Test your basic knowledge |
Engineering Materials
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Subject
:
engineering
Instructions:
Answer 50 questions in 15 minutes.
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Match each statement with the correct term.
Don't refresh. All questions and answers are randomly picked and ordered every time you load a test.
This is a study tool. The 3 wrong answers for each question are randomly chosen from answers to other questions. So, you might find at times the answers obvious, but you will see it re-enforces your understanding as you take the test each time.
1. Occur when lots of dislocations move.
Insulators
Slip Bands
Influence of Temperature on Magnetic Behavior
Engineering Fracture Performance
2. Growing interconnections to connect devices -Low electrical resistance - good adhesion to dielectric insulators.
Hysteresis and Permanent Magnetization
Metallization
Luminescence
The three modes of crack surface displacement
3. Measures Hardness 1. psia = 500 x HB 2. MPa = 3.45 x HB
Influence of Temperature on Magnetic Behavior
Elastic Deformation
Transparent
HB (Brinell Hardness)
4. Second phase particles with n > glass.
Stress Intensity values
Opacifiers
Brittle Fracture
Film Deposition
5. They are used to assess properties of ceramics & glasses.
LASER
Bending tests
Large Hardness
Hardness
6. Increase temperature - no increase in interatomic separation - no thermal expansion
Where does DBTT occur?
Ductile Fracture
Thermal Expansion: Symmetric curve
Response to a Magnetic Field
7. Occurs at a single pore or other solid by refraction n = 1 for pore (air) n > 1 for the solid - n ~ 1.5 for glass - Scattering effect is maximized by pore/particle size within 400-700 nm range - Reason for Opacity in ceramics - glasses and polymers.
True Stress
Scattering
Ductile Fracture
To improve fatigue life
8. Found in 26 metals and hundreds of alloys & compounds - Tc= critical temperature = termperature below which material is superconductive.
Opacity
Superconductivity
Incident Light
Generation of a Magnetic Field - Within a Solid Material
9. Plastic means permanent! When a small load is applied - bonds stretch & planes shear. Then when the load is no longer applied - the planes are still sheared.
Ductile Materials
Iron-Silicon Alloy in Transformer Cores
Oxidation
Plastic Deformation (Metals)
10. Loss of image transmission - You get no image - There is no light transmission - and therefore reflects - scatters - or absorbs ALL of it. Both mirrors and carbon black are opaque.
IC Devices: P-N Rectifying Junction
Opaque
Holloman Equation
Transparent
11. 1. Tensile (opening) 2. Sliding 3. Tearing
Intergranular Fracture
The three modes of crack surface displacement
Translucent
Etching
12. Cp: Heat capacity at constant pressure Cv: Heat capacity at constant volume.
Stress Intensity values
Two ways to measure heat capacity
Bending tests
Fourier's Law
13. A three terminal device that acts like a simple "on-off" switch. (the basis of Integrated Circuits (IC) technology - used in computers - cell phones - automotive control - etc) - If voltage (potential) applied to the "gate" - current flows between th
Stages of Failure: Ductile Fracture
Metals: Resistivity vs. T - Impurities
The Transistor
Electromigration
14. Without passing a current a continually varying magnetic field will cause a current to flow
Shear and Tensile Stress
Fourier's Law
Response to a Magnetic Field
Linewidth
15. Elastic means reversible! This is not a permanent deformation.
Transparent
Translucent
Elastic Deformation
Opaque
16. 1. Ductility- % elongation - % reduction in area - may be of use in metal forming operations (e.g. - stretch forming). This is convenient for mechanical testing - but not very meaningful for most deformation processing. 2. Toughness- Area beneath str
Generation of a Magnetic Field - Vacuum
How to gage the extent of plastic deformation
Modulus of Rupture (MOR)
Holloman Equation
17. Failure under cyclic stress 1. It can cause part failure - even though (sigma)max < (sigma)c 2. Causes ~90% of mechanical engineering failures.
Fatigue
Griffith Crack Model
Response to a Magnetic Field
Fourier's Law
18. Resistance to plastic deformation of cracking in compression - and better wear properties.
Large Hardness
Generation of a Magnetic Field - Within a Solid Material
True Stress
Heat Capacity from an Atomic Prospective
19. heat flux = -(thermal conductivity)(temperature gradient) - Defines heat transfer by CONDUCTION
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20. There is always some statistical distribution of flaws or defects.
Slip Bands
There is no perfect material?
Brittle Materials
Holloman Equation
21. 1. General yielding occurs if flaw size a < a(critical) 2. Catastrophic fast fracture occurs if flaw size a > a(critical)
Electrical Conduction
Thermal Expansion: Asymmetric curve
Engineering Fracture Performance
Fatigue
22. Defines the ability of a material to resist fracture even when a flaw exists - Directly depends on size of flaw and material properties - K(ic) is a materials constant
Heat Capacity from an Atomic Prospective
LASER
Two ways to measure heat capacity
Stress Intensity Factor
23. (sigma)=K(sigma)^n . K = strength coefficient - n = work hardening rate or strain hardening exponent. Large n value increases strength and hardness.
Valence band
Transgranular Fracture
Holloman Equation
Scattering
24. Rho=F/A - tau=G/A . Depending on what angle the force is applied - and what angle the crystal is at - it takes different amounts of force to induce plastic deformation.
Coefficient of Thermal Expansion
Shear and Tensile Stress
Plastic Deformation (Metals)
Incident Light
25. Growth of an oxide layer by the reaction of oxygen with the substrate - Provides dopant masking and device isolation - IC technology uses 1. Thermal grown oxidation (dry) 2. Wet Oxidation 3. Selective Oxidation
Oxidation
Sparkle of Diamonds
Transgranular Fracture
Scattering
26. 1. Data for Pure Silicon - electrical conductivity increases with T - opposite to metals
Pure Semiconductors: Conductivity vs. T
Incoherent
Fatigue
Thermal Shock Resistance
27. The Magnetization of the material - and is essentially the dipole moment per unit volume. It is proportional to the applied field. Xm is the magnetic susceptibility.
What do magnetic moments arise from?
M is known as what?
Etching
Reflection of Light for Metals
28. Different orientation of cleavage planes in grains.
Iron-Silicon Alloy in Transformer Cores
Force Decomposition
Why fracture surfaces have faceted texture
To improve fatigue life
29. This strength parameter is similar in magnitude to a tensile strength. Fracture occurs along the outermost sample edge - which is under a tensile load.
Modulus of Rupture (MOR)
Generation of a Magnetic Field - Vacuum
Thermal expansion
Sparkle of Diamonds
30. Hardness is the resistance of a material to deformation by indentation - Useful in quality control - Hardness can provide a qualitative assessment of strength - Hardness cannot be used to quantitatively infer strength or ductility.
Hardness
Rockwell
Generation of a Magnetic Field - Within a Solid Material
Oxidation
31. Metals are good conductors since their _______is only partially filled.
Electromigration
Hysteresis and Permanent Magnetization
Valence band
Fourier's Law
32. Transmitted light distorts electron clouds - The velocity of light in a material is lower than in a vacuum - Adding large ions to glass decreases the speed of light in the glass - Light can be "bent" (or refracted) as it passes through a transparent
Generation of a Magnetic Field - Vacuum
Refraction
Opaque
Sparkle of Diamonds
33. Not ALL the light is refracted - SOME is reflected. Materials with a high index of refraction also have high reflectance - High R is bad for lens applications - since this leads to undesirable light losses or interference.
Fatigue
Opaque
Coherent
Reflectance of Non-Metals
34. Undergo little or no plastic deformation.
Hardness
Brittle Materials
Engineering Fracture Performance
Insulators
35. Reflectiviy is between 0.90 and 0.95 - Metal surfaces appear shiny - Most of absorbed light is reflected at the same wavelength (NO REFRACTION) - Small fraction of light may be absorbed - Color of reflected light depends on wavelength distribution of
LASER
4 Types of Magnetism
True Stress
Reflection of Light for Metals
36. - Metals that exhibit high ductility - exhibit high toughness. Ceramics are very strong - but have low ductility and low toughness - Polymers are very ductile but are not generally very strong in shear (compared to metals and ceramics). They have low
How an LCD works
Paramagnetic Materials
Pure Semiconductors: Conductivity vs. T
Stress Intensity values
37. Digitalized data in the form of electrical signals are transferred to and recorded digitally on a magnetic medium (tape or disk) - This transference is accomplished by a recording system that consists of a read/write head - "write" or record data by
To improve fatigue life
Heat Capacity
Brittle Ceramics
Magnetic Storage
38. To build a device - various thin metal or insulating films are grown on top of each other - Evaporation - MBE - Sputtering - CVD (ALD)
Film Deposition
Why fracture surfaces have faceted texture
Pure Semiconductors: Conductivity vs. T
Relative Permeability
39. The ability of a material to absorb heat - Quantitatively: The energy required to produce a unit rise in temperature for one mole of a material.
Relative Permeability
Heat Capacity
Etching
Shear and Tensile Stress
40. Becomes harder (more strain) to stretch (elongate)
Magnetic Storage
Work Hardening
Electromigration
Rockwell
41. Specific heat = energy input/(mass*temperature change)
Intergranular Fracture
Specific Heat
Impact energy
Linewidth
42. Cracks propagate along grain boundaries.
Superconductivity
Fatigue
Intergranular Fracture
Generation of a Magnetic Field - Vacuum
43. High toughness; material resists crack propagation.
Force Decomposition
Why do ceramics have larger bonding energy?
High impact energy
Stress Intensity values
44. No appreciable plastic deformation. The crack propagates very fast; nearly perpendicular to applied stress. Cracks often propagate along specific crystal planes or boundaries.
Brittle Fracture
Impact - Toughness
Hysteresis and Permanent Magnetization
There is no perfect material?
45. Wet: isotropic - under cut Dry: ansiotropic - directional
IC Devices: P-N Rectifying Junction
Etching
How an LCD works
Intergranular Fracture
46. Allows flow of electrons in one direction only (useful to convert alternating current to direct current) - Result: no net current flow
Color
IC Devices: P-N Rectifying Junction
Generation of a Magnetic Field - Within a Solid Material
Stress Intensity Factor
47. 1. Insulators: Higher energy states NOT ACCESSIBLE due to gap 2. Semiconductors: Higher energy states separated by a smaller gap.
Two ways to measure heat capacity
Energy States: Insulators and Semiconductors
Impact energy
LASER
48. These materials are "attracted" to magnetic fields.
Specific Heat
Paramagnetic Materials
Stress Intensity values
True Stress
49. With Increasing temperature - the saturation magnetization diminishes gradually and then abruptly drops to zero at Curie Temperature - Tc.
Stress Intensity Factor
Opacifiers
IC Devices: P-N Rectifying Junction
Influence of Temperature on Magnetic Behavior
50. Energy is stored as atomic vibrations - As temperature increases - the average energy of atomic vibrations increases.
Opacity
Elastic Deformation
Heat Capacity from an Atomic Prospective
Stress Intensity Factor
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