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Digital Electronics Vocab

Subject : engineering
Instructions:
  • Answer 50 questions in 15 minutes.
  • If you are not ready to take this test, you can study here.
  • Match each statement with the correct term.
  • Don't refresh. All questions and answers are randomly picked and ordered every time you load a test.

This is a study tool. The 3 wrong answers for each question are randomly chosen from answers to other questions. So, you might find at times the answers obvious, but you will see it re-enforces your understanding as you take the test each time.
1. Signal in the form of a rectangular pulse train or a square wave.






2. Nano






3. Nano






4. Mega






5. A way of representing some physical quantity - such as temperature or velocity - by a proportional continuous voltage or current. An analog voltage or current can have any value within a defined range.






6. A group of flip-flops (typically 4 or 8) that are arranged so that the values stored in the flip-flops are shifted from one flip-flop to the next for every clock.






7. Any material that allows the free movement of electric changes - such as electrons - to provide an electric current.






8. A square IC package with leads on all four sides designed for surface mounting on a circuit board.






9. The process of applying a thin coat of solder to materials prior to their being soldered; for example - application of a light coat of solder to the filaments of a conductor to hold the filaments in place prior to soldering the conductor.






10. Micro






11. Tera






12. Coding system of colored stripes on a resistor to indicate the resistor's value and tolerance.






13. A two terminal device that conducts in only one direction.






14. Circuit that is capable of sensing and holding a signal until the event that changed the signal can be addressed.






15. Are and Ohms






16. Metallic alloy of tin and lead that is used to join two metal surfaces.






17. A very common IC package with two parallel rows of pins intended to be inserted into a socket of through holes drilled in a printed circuit board.






18. Giga






19. Tool with an internal heating element used to heat surfaces being soldered to the point where the solder becomes molten.






20. Light-emitting diode. An electronic device that conducts current in one direction only and illuminates when it is conducting.






21. V or E and Volt (V)






22. F and Hertz (Hz) or Cycles per sec.






23. An array of seven independently controlled light-emitting diodes (LED) or liquid crystal display (LCD) elements - shaped like a figure-8 - which can be used to display decimal digits and other characters by turning on the appropriate elements.






24. A very common IC package with two parallel rows of pins intended to be inserted into a socket of through holes drilled in a printed circuit board.






25. The direction of current flow associated with positive charge in motion. The current flow direction is from a positive to negative potential - which is in the opposite direction of electron flow.






26. P and Watt (W)






27. Pico






28. Term derived from 'transfer resistor.' Semiconductor device that can be used as an amplifier or as an electronic switch.






29. Insulating board containing conductive tracks for circuit connections.






30. The unwanted formation of a conductive path of solder between conductors.






31. Signal in the form of a rectangular pulse train or a square wave.






32. A movement of electrical charges around a closed path or circuit.






33. A solder connection that exhibits poor wetting and is characterized by a grayish - porous appearance due to excessive impurities in the solder - inadequate cleaning prior to soldering - and/or the insufficient application of heat during the soldering






34. A series of logic 1s and 0s plotted as a function of time.






35. A protective device in the current path that melts or breaks when current exceeds a predetermined maximum value.






36. A series of logic 1s and 0s plotted as a function of time.






37. A movement of electrical charges around a closed path or circuit.






38. F and Hertz (Hz) or Cycles per sec.






39. An IC package similar to a DIP - but smaller - which is designed for automatic placement and soldering on the surface of a circuit board.






40. Milli






41. A circuit board for wiring temporary circuits - usually used for prototypes or laboratory work.






42. Any material that allows the free movement of electric changes - such as electrons - to provide an electric current.






43. The process of applying a thin coat of solder to materials prior to their being soldered; for example - application of a light coat of solder to the filaments of a conductor to hold the filaments in place prior to soldering the conductor.






44. An IC package similar to a DIP - but smaller - which is designed for automatic placement and soldering on the surface of a circuit board.






45. Process of joining two metallic surfaces to make an electrical contact by melting solder (usually tin and lead) across them.






46. Circuit that is capable of sensing and holding a signal until the event that changed the signal can be addressed.






47. I and Ampere or Amp (A)






48. Process of joining two metallic surfaces to make an electrical contact by melting solder (usually tin and lead) across them.






49. A protective device in the current path that melts or breaks when current exceeds a predetermined maximum value.






50. The instantaneous voltage of a waveform. Often used to mean maximum amplitude - or peak voltage - or a pulse.