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Digital Electronics Vocab

Subject : engineering
Instructions:
  • Answer 50 questions in 15 minutes.
  • If you are not ready to take this test, you can study here.
  • Match each statement with the correct term.
  • Don't refresh. All questions and answers are randomly picked and ordered every time you load a test.

This is a study tool. The 3 wrong answers for each question are randomly chosen from answers to other questions. So, you might find at times the answers obvious, but you will see it re-enforces your understanding as you take the test each time.
1. Process of joining two metallic surfaces to make an electrical contact by melting solder (usually tin and lead) across them.






2. An IC package similar to a DIP - but smaller - which is designed for automatic placement and soldering on the surface of a circuit board.






3. Coding system of colored stripes on a resistor to indicate the resistor's value and tolerance.






4. A circuit board for wiring temporary circuits - usually used for prototypes or laboratory work.






5. Term derived from 'transfer resistor.' Semiconductor device that can be used as an amplifier or as an electronic switch.






6. A way of representing some physical quantity - such as temperature or velocity - by a proportional continuous voltage or current. An analog voltage or current can have any value within a defined range.






7. A solder connection that exhibits poor wetting and is characterized by a grayish - porous appearance due to excessive impurities in the solder - inadequate cleaning prior to soldering - and/or the insufficient application of heat during the soldering






8. A square IC package with leads on all four sides designed for surface mounting on a circuit board.






9. The direction of current flow associated with positive charge in motion. The current flow direction is from a positive to negative potential - which is in the opposite direction of electron flow.






10. A series of logic 1s and 0s plotted as a function of time.






11. The instantaneous voltage of a waveform. Often used to mean maximum amplitude - or peak voltage - or a pulse.






12. Circuit that is capable of sensing and holding a signal until the event that changed the signal can be addressed.






13. A circuit the produces a digital output signal that is half the frequency of the input.






14. Metallic alloy of tin and lead that is used to join two metal surfaces.






15. Abbreviation of System International - a system of practical units based on the meter - kilogram - second - ampere - Kelvin - mole - and candela.






16. Micro






17. Nano






18. Mega






19. Component made of material that opposes flow of current and therefore has some value of resistance.






20. Any material that allows the free movement of electric changes - such as electrons - to provide an electric current.






21. The unwanted formation of a conductive path of solder between conductors.






22. Nano






23. A movement of electrical charges around a closed path or circuit.






24. Pico






25. Metallic alloy of tin and lead that is used to join two metal surfaces.






26. Light-emitting diode. An electronic device that conducts current in one direction only and illuminates when it is conducting.






27. A group of flip-flops (typically 4 or 8) that are arranged so that the values stored in the flip-flops are shifted from one flip-flop to the next for every clock.






28. Process of joining two metallic surfaces to make an electrical contact by melting solder (usually tin and lead) across them.






29. A protective device in the current path that melts or breaks when current exceeds a predetermined maximum value.






30. Abbreviation of System International - a system of practical units based on the meter - kilogram - second - ampere - Kelvin - mole - and candela.






31. C and Farad (F)






32. A solder connection that exhibits poor wetting and is characterized by a grayish - porous appearance due to excessive impurities in the solder - inadequate cleaning prior to soldering - and/or the insufficient application of heat during the soldering






33. A protective device in the current path that melts or breaks when current exceeds a predetermined maximum value.






34. A way of representing a physical quantity by a series of binary numbers. A digital representation can have only specific discrete values.






35. A very common IC package with two parallel rows of pins intended to be inserted into a socket of through holes drilled in a printed circuit board.






36. An IC package similar to a DIP - but smaller - which is designed for automatic placement and soldering on the surface of a circuit board.






37. Electronic test equipment that can perform multiple tasks. Typically one capable of measuring voltage - current - and resistance. More sophisticated modern digital multimeters also measure capacitance - inductance - current gain of transistors - and/






38. Are and Ohms






39. A two terminal device that conducts in only one direction.






40. C and Farad (F)






41. V or E and Volt (V)






42. An electrical device used to store electrical charge.






43. Tera






44. Kilo






45. Giga






46. A square IC package with leads on all four sides designed for surface mounting on a circuit board.






47. A very common IC package with two parallel rows of pins intended to be inserted into a socket of through holes drilled in a printed circuit board.






48. Circuit that is capable of sensing and holding a signal until the event that changed the signal can be addressed.






49. A way of representing a physical quantity by a series of binary numbers. A digital representation can have only specific discrete values.






50. Electronic test equipment that can perform multiple tasks. Typically one capable of measuring voltage - current - and resistance. More sophisticated modern digital multimeters also measure capacitance - inductance - current gain of transistors - and/