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Digital Electronics Vocab

Subject : engineering
Instructions:
  • Answer 50 questions in 15 minutes.
  • If you are not ready to take this test, you can study here.
  • Match each statement with the correct term.
  • Don't refresh. All questions and answers are randomly picked and ordered every time you load a test.

This is a study tool. The 3 wrong answers for each question are randomly chosen from answers to other questions. So, you might find at times the answers obvious, but you will see it re-enforces your understanding as you take the test each time.
1. The unwanted formation of a conductive path of solder between conductors.






2. A circuit board for wiring temporary circuits - usually used for prototypes or laboratory work.






3. Kilo






4. Numbers entered as a number from one to ten multiplied by a power of ten.






5. P and Watt (W)






6. A protective device in the current path that melts or breaks when current exceeds a predetermined maximum value.






7. The unwanted formation of a conductive path of solder between conductors.






8. A group of flip-flops (typically 4 or 8) that are arranged so that the values stored in the flip-flops are shifted from one flip-flop to the next for every clock.






9. Nano






10. Mega






11. Any material that allows the free movement of electric changes - such as electrons - to provide an electric current.






12. A two terminal device that conducts in only one direction.






13. Electronic test equipment that can perform multiple tasks. Typically one capable of measuring voltage - current - and resistance. More sophisticated modern digital multimeters also measure capacitance - inductance - current gain of transistors - and/






14. Milli






15. Term derived from 'transfer resistor.' Semiconductor device that can be used as an amplifier or as an electronic switch.






16. Coding system of colored stripes on a resistor to indicate the resistor's value and tolerance.






17. An electrical device used to store electrical charge.






18. Pico






19. I and Ampere or Amp (A)






20. Pico






21. A very common IC package with two parallel rows of pins intended to be inserted into a socket of through holes drilled in a printed circuit board.






22. Term derived from 'transfer resistor.' Semiconductor device that can be used as an amplifier or as an electronic switch.






23. Are and Ohms






24. Are and Ohms






25. A square IC package with leads on all four sides designed for surface mounting on a circuit board.






26. I and Ampere or Amp (A)






27. C and Farad (F)






28. Process of joining two metallic surfaces to make an electrical contact by melting solder (usually tin and lead) across them.






29. The process of applying a thin coat of solder to materials prior to their being soldered; for example - application of a light coat of solder to the filaments of a conductor to hold the filaments in place prior to soldering the conductor.






30. Light-emitting diode. An electronic device that conducts current in one direction only and illuminates when it is conducting.






31. The direction of current flow associated with positive charge in motion. The current flow direction is from a positive to negative potential - which is in the opposite direction of electron flow.






32. Circuit that is capable of sensing and holding a signal until the event that changed the signal can be addressed.






33. Signal in the form of a rectangular pulse train or a square wave.






34. An IC package similar to a DIP - but smaller - which is designed for automatic placement and soldering on the surface of a circuit board.






35. The instantaneous voltage of a waveform. Often used to mean maximum amplitude - or peak voltage - or a pulse.






36. The direction of current flow associated with positive charge in motion. The current flow direction is from a positive to negative potential - which is in the opposite direction of electron flow.






37. An IC package similar to a DIP - but smaller - which is designed for automatic placement and soldering on the surface of a circuit board.






38. A way of representing some physical quantity - such as temperature or velocity - by a proportional continuous voltage or current. An analog voltage or current can have any value within a defined range.






39. Metallic alloy of tin and lead that is used to join two metal surfaces.






40. Coding system of colored stripes on a resistor to indicate the resistor's value and tolerance.






41. A very common IC package with two parallel rows of pins intended to be inserted into a socket of through holes drilled in a printed circuit board.






42. Component made of material that opposes flow of current and therefore has some value of resistance.






43. Micro






44. A way of representing some physical quantity - such as temperature or velocity - by a proportional continuous voltage or current. An analog voltage or current can have any value within a defined range.






45. Tera






46. Tool with an internal heating element used to heat surfaces being soldered to the point where the solder becomes molten.






47. A movement of electrical charges around a closed path or circuit.






48. Any material that allows the free movement of electric changes - such as electrons - to provide an electric current.






49. The process of applying a thin coat of solder to materials prior to their being soldered; for example - application of a light coat of solder to the filaments of a conductor to hold the filaments in place prior to soldering the conductor.






50. Giga







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