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Digital Electronics Vocab

Subject : engineering
Instructions:
  • Answer 50 questions in 15 minutes.
  • If you are not ready to take this test, you can study here.
  • Match each statement with the correct term.
  • Don't refresh. All questions and answers are randomly picked and ordered every time you load a test.

This is a study tool. The 3 wrong answers for each question are randomly chosen from answers to other questions. So, you might find at times the answers obvious, but you will see it re-enforces your understanding as you take the test each time.
1. Numbers entered as a number from one to ten multiplied by a power of ten.






2. A series of logic 1s and 0s plotted as a function of time.






3. Any material that allows the free movement of electric changes - such as electrons - to provide an electric current.






4. Abbreviation of System International - a system of practical units based on the meter - kilogram - second - ampere - Kelvin - mole - and candela.






5. Process of joining two metallic surfaces to make an electrical contact by melting solder (usually tin and lead) across them.






6. A group of flip-flops (typically 4 or 8) that are arranged so that the values stored in the flip-flops are shifted from one flip-flop to the next for every clock.






7. The smallest particle of an element that still has the same characteristics as the element.






8. P and Watt (W)






9. Component made of material that opposes flow of current and therefore has some value of resistance.






10. The process of applying a thin coat of solder to materials prior to their being soldered; for example - application of a light coat of solder to the filaments of a conductor to hold the filaments in place prior to soldering the conductor.






11. Circuit that is capable of sensing and holding a signal until the event that changed the signal can be addressed.






12. The instantaneous voltage of a waveform. Often used to mean maximum amplitude - or peak voltage - or a pulse.






13. Metallic alloy of tin and lead that is used to join two metal surfaces.






14. An array of seven independently controlled light-emitting diodes (LED) or liquid crystal display (LCD) elements - shaped like a figure-8 - which can be used to display decimal digits and other characters by turning on the appropriate elements.






15. A square IC package with leads on all four sides designed for surface mounting on a circuit board.






16. Any material that allows the free movement of electric changes - such as electrons - to provide an electric current.






17. A protective device in the current path that melts or breaks when current exceeds a predetermined maximum value.






18. Insulating board containing conductive tracks for circuit connections.






19. The direction of current flow associated with positive charge in motion. The current flow direction is from a positive to negative potential - which is in the opposite direction of electron flow.






20. A solder connection that exhibits poor wetting and is characterized by a grayish - porous appearance due to excessive impurities in the solder - inadequate cleaning prior to soldering - and/or the insufficient application of heat during the soldering






21. Tera






22. A two terminal device that conducts in only one direction.






23. Mega






24. Light-emitting diode. An electronic device that conducts current in one direction only and illuminates when it is conducting.






25. A movement of electrical charges around a closed path or circuit.






26. V or E and Volt (V)






27. Nano






28. Milli






29. Milli






30. The direction of current flow associated with positive charge in motion. The current flow direction is from a positive to negative potential - which is in the opposite direction of electron flow.






31. A way of representing some physical quantity - such as temperature or velocity - by a proportional continuous voltage or current. An analog voltage or current can have any value within a defined range.






32. P and Watt (W)






33. Micro






34. Metallic alloy of tin and lead that is used to join two metal surfaces.






35. An IC package similar to a DIP - but smaller - which is designed for automatic placement and soldering on the surface of a circuit board.






36. A square IC package with leads on all four sides designed for surface mounting on a circuit board.






37. A floating point system in which numbers are expressed as products consisting of a number greater than one multiplied by an appropriate power of ten that is some multiple of three.






38. Pico






39. A circuit board for wiring temporary circuits - usually used for prototypes or laboratory work.






40. The instantaneous voltage of a waveform. Often used to mean maximum amplitude - or peak voltage - or a pulse.






41. Term derived from 'transfer resistor.' Semiconductor device that can be used as an amplifier or as an electronic switch.






42. Kilo






43. V or E and Volt (V)






44. C and Farad (F)






45. The process of applying a thin coat of solder to materials prior to their being soldered; for example - application of a light coat of solder to the filaments of a conductor to hold the filaments in place prior to soldering the conductor.






46. An array of seven independently controlled light-emitting diodes (LED) or liquid crystal display (LCD) elements - shaped like a figure-8 - which can be used to display decimal digits and other characters by turning on the appropriate elements.






47. Giga






48. An electrical device used to store electrical charge.






49. A two terminal device that conducts in only one direction.






50. Electronic test equipment that can perform multiple tasks. Typically one capable of measuring voltage - current - and resistance. More sophisticated modern digital multimeters also measure capacitance - inductance - current gain of transistors - and/