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Digital Electronics Vocab

Subject : engineering
Instructions:
  • Answer 50 questions in 15 minutes.
  • If you are not ready to take this test, you can study here.
  • Match each statement with the correct term.
  • Don't refresh. All questions and answers are randomly picked and ordered every time you load a test.

This is a study tool. The 3 wrong answers for each question are randomly chosen from answers to other questions. So, you might find at times the answers obvious, but you will see it re-enforces your understanding as you take the test each time.
1. The direction of current flow associated with positive charge in motion. The current flow direction is from a positive to negative potential - which is in the opposite direction of electron flow.






2. Process of joining two metallic surfaces to make an electrical contact by melting solder (usually tin and lead) across them.






3. An IC package similar to a DIP - but smaller - which is designed for automatic placement and soldering on the surface of a circuit board.






4. Are and Ohms






5. F and Hertz (Hz) or Cycles per sec.






6. V or E and Volt (V)






7. Light-emitting diode. An electronic device that conducts current in one direction only and illuminates when it is conducting.






8. Tool with an internal heating element used to heat surfaces being soldered to the point where the solder becomes molten.






9. A protective device in the current path that melts or breaks when current exceeds a predetermined maximum value.






10. The unwanted formation of a conductive path of solder between conductors.






11. I and Ampere or Amp (A)






12. A solder connection that exhibits poor wetting and is characterized by a grayish - porous appearance due to excessive impurities in the solder - inadequate cleaning prior to soldering - and/or the insufficient application of heat during the soldering






13. Circuit that is capable of sensing and holding a signal until the event that changed the signal can be addressed.






14. Milli






15. Term derived from 'transfer resistor.' Semiconductor device that can be used as an amplifier or as an electronic switch.






16. A floating point system in which numbers are expressed as products consisting of a number greater than one multiplied by an appropriate power of ten that is some multiple of three.






17. A square IC package with leads on all four sides designed for surface mounting on a circuit board.






18. Signal in the form of a rectangular pulse train or a square wave.






19. P and Watt (W)






20. Tera






21. A very common IC package with two parallel rows of pins intended to be inserted into a socket of through holes drilled in a printed circuit board.






22. The process of applying a thin coat of solder to materials prior to their being soldered; for example - application of a light coat of solder to the filaments of a conductor to hold the filaments in place prior to soldering the conductor.






23. Tool with an internal heating element used to heat surfaces being soldered to the point where the solder becomes molten.






24. The unwanted formation of a conductive path of solder between conductors.






25. Insulating board containing conductive tracks for circuit connections.






26. Process of joining two metallic surfaces to make an electrical contact by melting solder (usually tin and lead) across them.






27. An array of seven independently controlled light-emitting diodes (LED) or liquid crystal display (LCD) elements - shaped like a figure-8 - which can be used to display decimal digits and other characters by turning on the appropriate elements.






28. An electrical device used to store electrical charge.






29. Coding system of colored stripes on a resistor to indicate the resistor's value and tolerance.






30. Giga






31. A floating point system in which numbers are expressed as products consisting of a number greater than one multiplied by an appropriate power of ten that is some multiple of three.






32. A circuit the produces a digital output signal that is half the frequency of the input.






33. A group of flip-flops (typically 4 or 8) that are arranged so that the values stored in the flip-flops are shifted from one flip-flop to the next for every clock.






34. V or E and Volt (V)






35. Coding system of colored stripes on a resistor to indicate the resistor's value and tolerance.






36. Numbers entered as a number from one to ten multiplied by a power of ten.






37. A way of representing a physical quantity by a series of binary numbers. A digital representation can have only specific discrete values.






38. A very common IC package with two parallel rows of pins intended to be inserted into a socket of through holes drilled in a printed circuit board.






39. Pico






40. Nano






41. Kilo






42. A way of representing some physical quantity - such as temperature or velocity - by a proportional continuous voltage or current. An analog voltage or current can have any value within a defined range.






43. A movement of electrical charges around a closed path or circuit.






44. Electronic test equipment that can perform multiple tasks. Typically one capable of measuring voltage - current - and resistance. More sophisticated modern digital multimeters also measure capacitance - inductance - current gain of transistors - and/






45. Metallic alloy of tin and lead that is used to join two metal surfaces.






46. Metallic alloy of tin and lead that is used to join two metal surfaces.






47. P and Watt (W)






48. Insulating board containing conductive tracks for circuit connections.






49. A solder connection that exhibits poor wetting and is characterized by a grayish - porous appearance due to excessive impurities in the solder - inadequate cleaning prior to soldering - and/or the insufficient application of heat during the soldering






50. The process of applying a thin coat of solder to materials prior to their being soldered; for example - application of a light coat of solder to the filaments of a conductor to hold the filaments in place prior to soldering the conductor.