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Digital Electronics Vocab

Subject : engineering
Instructions:
  • Answer 50 questions in 15 minutes.
  • If you are not ready to take this test, you can study here.
  • Match each statement with the correct term.
  • Don't refresh. All questions and answers are randomly picked and ordered every time you load a test.

This is a study tool. The 3 wrong answers for each question are randomly chosen from answers to other questions. So, you might find at times the answers obvious, but you will see it re-enforces your understanding as you take the test each time.
1. The process of applying a thin coat of solder to materials prior to their being soldered; for example - application of a light coat of solder to the filaments of a conductor to hold the filaments in place prior to soldering the conductor.






2. The direction of current flow associated with positive charge in motion. The current flow direction is from a positive to negative potential - which is in the opposite direction of electron flow.






3. A way of representing a physical quantity by a series of binary numbers. A digital representation can have only specific discrete values.






4. Circuit that is capable of sensing and holding a signal until the event that changed the signal can be addressed.






5. Pico






6. A series of logic 1s and 0s plotted as a function of time.






7. Component made of material that opposes flow of current and therefore has some value of resistance.






8. V or E and Volt (V)






9. Signal in the form of a rectangular pulse train or a square wave.






10. Term derived from 'transfer resistor.' Semiconductor device that can be used as an amplifier or as an electronic switch.






11. The smallest particle of an element that still has the same characteristics as the element.






12. I and Ampere or Amp (A)






13. A protective device in the current path that melts or breaks when current exceeds a predetermined maximum value.






14. A very common IC package with two parallel rows of pins intended to be inserted into a socket of through holes drilled in a printed circuit board.






15. Light-emitting diode. An electronic device that conducts current in one direction only and illuminates when it is conducting.






16. An electrical device used to store electrical charge.






17. A solder connection that exhibits poor wetting and is characterized by a grayish - porous appearance due to excessive impurities in the solder - inadequate cleaning prior to soldering - and/or the insufficient application of heat during the soldering






18. A square IC package with leads on all four sides designed for surface mounting on a circuit board.






19. A way of representing some physical quantity - such as temperature or velocity - by a proportional continuous voltage or current. An analog voltage or current can have any value within a defined range.






20. A floating point system in which numbers are expressed as products consisting of a number greater than one multiplied by an appropriate power of ten that is some multiple of three.






21. Tera






22. Metallic alloy of tin and lead that is used to join two metal surfaces.






23. Process of joining two metallic surfaces to make an electrical contact by melting solder (usually tin and lead) across them.






24. C and Farad (F)






25. The unwanted formation of a conductive path of solder between conductors.






26. Numbers entered as a number from one to ten multiplied by a power of ten.






27. The instantaneous voltage of a waveform. Often used to mean maximum amplitude - or peak voltage - or a pulse.






28. Tool with an internal heating element used to heat surfaces being soldered to the point where the solder becomes molten.






29. A group of flip-flops (typically 4 or 8) that are arranged so that the values stored in the flip-flops are shifted from one flip-flop to the next for every clock.






30. P and Watt (W)






31. F and Hertz (Hz) or Cycles per sec.






32. Are and Ohms






33. The unwanted formation of a conductive path of solder between conductors.






34. An IC package similar to a DIP - but smaller - which is designed for automatic placement and soldering on the surface of a circuit board.






35. Tool with an internal heating element used to heat surfaces being soldered to the point where the solder becomes molten.






36. Any material that allows the free movement of electric changes - such as electrons - to provide an electric current.






37. An electrical device used to store electrical charge.






38. The process of applying a thin coat of solder to materials prior to their being soldered; for example - application of a light coat of solder to the filaments of a conductor to hold the filaments in place prior to soldering the conductor.






39. Micro






40. A group of flip-flops (typically 4 or 8) that are arranged so that the values stored in the flip-flops are shifted from one flip-flop to the next for every clock.






41. An array of seven independently controlled light-emitting diodes (LED) or liquid crystal display (LCD) elements - shaped like a figure-8 - which can be used to display decimal digits and other characters by turning on the appropriate elements.






42. A circuit the produces a digital output signal that is half the frequency of the input.






43. Signal in the form of a rectangular pulse train or a square wave.






44. Electronic test equipment that can perform multiple tasks. Typically one capable of measuring voltage - current - and resistance. More sophisticated modern digital multimeters also measure capacitance - inductance - current gain of transistors - and/






45. V or E and Volt (V)






46. Mega






47. Insulating board containing conductive tracks for circuit connections.






48. The direction of current flow associated with positive charge in motion. The current flow direction is from a positive to negative potential - which is in the opposite direction of electron flow.






49. A circuit board for wiring temporary circuits - usually used for prototypes or laboratory work.






50. Abbreviation of System International - a system of practical units based on the meter - kilogram - second - ampere - Kelvin - mole - and candela.