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Digital Electronics Vocab

Subject : engineering
Instructions:
  • Answer 50 questions in 15 minutes.
  • If you are not ready to take this test, you can study here.
  • Match each statement with the correct term.
  • Don't refresh. All questions and answers are randomly picked and ordered every time you load a test.

This is a study tool. The 3 wrong answers for each question are randomly chosen from answers to other questions. So, you might find at times the answers obvious, but you will see it re-enforces your understanding as you take the test each time.
1. F and Hertz (Hz) or Cycles per sec.






2. V or E and Volt (V)






3. A circuit board for wiring temporary circuits - usually used for prototypes or laboratory work.






4. Are and Ohms






5. Light-emitting diode. An electronic device that conducts current in one direction only and illuminates when it is conducting.






6. The direction of current flow associated with positive charge in motion. The current flow direction is from a positive to negative potential - which is in the opposite direction of electron flow.






7. Nano






8. Giga






9. The unwanted formation of a conductive path of solder between conductors.






10. Metallic alloy of tin and lead that is used to join two metal surfaces.






11. P and Watt (W)






12. Any material that allows the free movement of electric changes - such as electrons - to provide an electric current.






13. The process of applying a thin coat of solder to materials prior to their being soldered; for example - application of a light coat of solder to the filaments of a conductor to hold the filaments in place prior to soldering the conductor.






14. Any material that allows the free movement of electric changes - such as electrons - to provide an electric current.






15. Signal in the form of a rectangular pulse train or a square wave.






16. A two terminal device that conducts in only one direction.






17. Pico






18. Pico






19. A movement of electrical charges around a closed path or circuit.






20. Micro






21. A circuit board for wiring temporary circuits - usually used for prototypes or laboratory work.






22. Tera






23. A protective device in the current path that melts or breaks when current exceeds a predetermined maximum value.






24. Mega






25. I and Ampere or Amp (A)






26. Component made of material that opposes flow of current and therefore has some value of resistance.






27. Coding system of colored stripes on a resistor to indicate the resistor's value and tolerance.






28. The smallest particle of an element that still has the same characteristics as the element.






29. Milli






30. Coding system of colored stripes on a resistor to indicate the resistor's value and tolerance.






31. A square IC package with leads on all four sides designed for surface mounting on a circuit board.






32. An IC package similar to a DIP - but smaller - which is designed for automatic placement and soldering on the surface of a circuit board.






33. The smallest particle of an element that still has the same characteristics as the element.






34. Metallic alloy of tin and lead that is used to join two metal surfaces.






35. A protective device in the current path that melts or breaks when current exceeds a predetermined maximum value.






36. A floating point system in which numbers are expressed as products consisting of a number greater than one multiplied by an appropriate power of ten that is some multiple of three.






37. Kilo






38. Milli






39. Tool with an internal heating element used to heat surfaces being soldered to the point where the solder becomes molten.






40. Process of joining two metallic surfaces to make an electrical contact by melting solder (usually tin and lead) across them.






41. Insulating board containing conductive tracks for circuit connections.






42. Tera






43. Micro






44. A series of logic 1s and 0s plotted as a function of time.






45. The process of applying a thin coat of solder to materials prior to their being soldered; for example - application of a light coat of solder to the filaments of a conductor to hold the filaments in place prior to soldering the conductor.






46. A very common IC package with two parallel rows of pins intended to be inserted into a socket of through holes drilled in a printed circuit board.






47. Abbreviation of System International - a system of practical units based on the meter - kilogram - second - ampere - Kelvin - mole - and candela.






48. The unwanted formation of a conductive path of solder between conductors.






49. A group of flip-flops (typically 4 or 8) that are arranged so that the values stored in the flip-flops are shifted from one flip-flop to the next for every clock.






50. The instantaneous voltage of a waveform. Often used to mean maximum amplitude - or peak voltage - or a pulse.