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Digital Electronics Vocab

Subject : engineering
Instructions:
  • Answer 50 questions in 15 minutes.
  • If you are not ready to take this test, you can study here.
  • Match each statement with the correct term.
  • Don't refresh. All questions and answers are randomly picked and ordered every time you load a test.

This is a study tool. The 3 wrong answers for each question are randomly chosen from answers to other questions. So, you might find at times the answers obvious, but you will see it re-enforces your understanding as you take the test each time.
1. The unwanted formation of a conductive path of solder between conductors.






2. A series of logic 1s and 0s plotted as a function of time.






3. A group of flip-flops (typically 4 or 8) that are arranged so that the values stored in the flip-flops are shifted from one flip-flop to the next for every clock.






4. The direction of current flow associated with positive charge in motion. The current flow direction is from a positive to negative potential - which is in the opposite direction of electron flow.






5. I and Ampere or Amp (A)






6. Component made of material that opposes flow of current and therefore has some value of resistance.






7. Insulating board containing conductive tracks for circuit connections.






8. Abbreviation of System International - a system of practical units based on the meter - kilogram - second - ampere - Kelvin - mole - and candela.






9. Circuit that is capable of sensing and holding a signal until the event that changed the signal can be addressed.






10. An electrical device used to store electrical charge.






11. Numbers entered as a number from one to ten multiplied by a power of ten.






12. A group of flip-flops (typically 4 or 8) that are arranged so that the values stored in the flip-flops are shifted from one flip-flop to the next for every clock.






13. C and Farad (F)






14. Giga






15. Metallic alloy of tin and lead that is used to join two metal surfaces.






16. The unwanted formation of a conductive path of solder between conductors.






17. Process of joining two metallic surfaces to make an electrical contact by melting solder (usually tin and lead) across them.






18. Circuit that is capable of sensing and holding a signal until the event that changed the signal can be addressed.






19. Milli






20. Micro






21. The process of applying a thin coat of solder to materials prior to their being soldered; for example - application of a light coat of solder to the filaments of a conductor to hold the filaments in place prior to soldering the conductor.






22. I and Ampere or Amp (A)






23. A very common IC package with two parallel rows of pins intended to be inserted into a socket of through holes drilled in a printed circuit board.






24. A floating point system in which numbers are expressed as products consisting of a number greater than one multiplied by an appropriate power of ten that is some multiple of three.






25. F and Hertz (Hz) or Cycles per sec.






26. Mega






27. A floating point system in which numbers are expressed as products consisting of a number greater than one multiplied by an appropriate power of ten that is some multiple of three.






28. Mega






29. A two terminal device that conducts in only one direction.






30. The smallest particle of an element that still has the same characteristics as the element.






31. Process of joining two metallic surfaces to make an electrical contact by melting solder (usually tin and lead) across them.






32. The smallest particle of an element that still has the same characteristics as the element.






33. Term derived from 'transfer resistor.' Semiconductor device that can be used as an amplifier or as an electronic switch.






34. A solder connection that exhibits poor wetting and is characterized by a grayish - porous appearance due to excessive impurities in the solder - inadequate cleaning prior to soldering - and/or the insufficient application of heat during the soldering






35. Are and Ohms






36. Electronic test equipment that can perform multiple tasks. Typically one capable of measuring voltage - current - and resistance. More sophisticated modern digital multimeters also measure capacitance - inductance - current gain of transistors - and/






37. Abbreviation of System International - a system of practical units based on the meter - kilogram - second - ampere - Kelvin - mole - and candela.






38. A protective device in the current path that melts or breaks when current exceeds a predetermined maximum value.






39. Nano






40. Light-emitting diode. An electronic device that conducts current in one direction only and illuminates when it is conducting.






41. Micro






42. The direction of current flow associated with positive charge in motion. The current flow direction is from a positive to negative potential - which is in the opposite direction of electron flow.






43. Pico






44. Term derived from 'transfer resistor.' Semiconductor device that can be used as an amplifier or as an electronic switch.






45. Milli






46. A very common IC package with two parallel rows of pins intended to be inserted into a socket of through holes drilled in a printed circuit board.






47. An electrical device used to store electrical charge.






48. An IC package similar to a DIP - but smaller - which is designed for automatic placement and soldering on the surface of a circuit board.






49. C and Farad (F)






50. A way of representing a physical quantity by a series of binary numbers. A digital representation can have only specific discrete values.