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Digital Electronics Vocab

Subject : engineering
Instructions:
  • Answer 50 questions in 15 minutes.
  • If you are not ready to take this test, you can study here.
  • Match each statement with the correct term.
  • Don't refresh. All questions and answers are randomly picked and ordered every time you load a test.

This is a study tool. The 3 wrong answers for each question are randomly chosen from answers to other questions. So, you might find at times the answers obvious, but you will see it re-enforces your understanding as you take the test each time.
1. Mega






2. Term derived from 'transfer resistor.' Semiconductor device that can be used as an amplifier or as an electronic switch.






3. I and Ampere or Amp (A)






4. Metallic alloy of tin and lead that is used to join two metal surfaces.






5. C and Farad (F)






6. A two terminal device that conducts in only one direction.






7. Tera






8. C and Farad (F)






9. Process of joining two metallic surfaces to make an electrical contact by melting solder (usually tin and lead) across them.






10. Circuit that is capable of sensing and holding a signal until the event that changed the signal can be addressed.






11. Component made of material that opposes flow of current and therefore has some value of resistance.






12. Coding system of colored stripes on a resistor to indicate the resistor's value and tolerance.






13. A protective device in the current path that melts or breaks when current exceeds a predetermined maximum value.






14. A way of representing a physical quantity by a series of binary numbers. A digital representation can have only specific discrete values.






15. Tera






16. A circuit board for wiring temporary circuits - usually used for prototypes or laboratory work.






17. A floating point system in which numbers are expressed as products consisting of a number greater than one multiplied by an appropriate power of ten that is some multiple of three.






18. A movement of electrical charges around a closed path or circuit.






19. The smallest particle of an element that still has the same characteristics as the element.






20. Abbreviation of System International - a system of practical units based on the meter - kilogram - second - ampere - Kelvin - mole - and candela.






21. A very common IC package with two parallel rows of pins intended to be inserted into a socket of through holes drilled in a printed circuit board.






22. An array of seven independently controlled light-emitting diodes (LED) or liquid crystal display (LCD) elements - shaped like a figure-8 - which can be used to display decimal digits and other characters by turning on the appropriate elements.






23. Signal in the form of a rectangular pulse train or a square wave.






24. A group of flip-flops (typically 4 or 8) that are arranged so that the values stored in the flip-flops are shifted from one flip-flop to the next for every clock.






25. Are and Ohms






26. Light-emitting diode. An electronic device that conducts current in one direction only and illuminates when it is conducting.






27. A series of logic 1s and 0s plotted as a function of time.






28. Kilo






29. Metallic alloy of tin and lead that is used to join two metal surfaces.






30. Signal in the form of a rectangular pulse train or a square wave.






31. Numbers entered as a number from one to ten multiplied by a power of ten.






32. Numbers entered as a number from one to ten multiplied by a power of ten.






33. Giga






34. Tool with an internal heating element used to heat surfaces being soldered to the point where the solder becomes molten.






35. The process of applying a thin coat of solder to materials prior to their being soldered; for example - application of a light coat of solder to the filaments of a conductor to hold the filaments in place prior to soldering the conductor.






36. A solder connection that exhibits poor wetting and is characterized by a grayish - porous appearance due to excessive impurities in the solder - inadequate cleaning prior to soldering - and/or the insufficient application of heat during the soldering






37. A group of flip-flops (typically 4 or 8) that are arranged so that the values stored in the flip-flops are shifted from one flip-flop to the next for every clock.






38. Mega






39. Nano






40. Milli






41. F and Hertz (Hz) or Cycles per sec.






42. A circuit the produces a digital output signal that is half the frequency of the input.






43. Any material that allows the free movement of electric changes - such as electrons - to provide an electric current.






44. Tool with an internal heating element used to heat surfaces being soldered to the point where the solder becomes molten.






45. The instantaneous voltage of a waveform. Often used to mean maximum amplitude - or peak voltage - or a pulse.






46. The process of applying a thin coat of solder to materials prior to their being soldered; for example - application of a light coat of solder to the filaments of a conductor to hold the filaments in place prior to soldering the conductor.






47. P and Watt (W)






48. Any material that allows the free movement of electric changes - such as electrons - to provide an electric current.






49. Pico






50. A square IC package with leads on all four sides designed for surface mounting on a circuit board.